Patents by Inventor Wei-Yuan Chen
Wei-Yuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961808Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.Type: GrantFiled: October 14, 2021Date of Patent: April 16, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei-Jen Wang, Po-Jen Cheng, Fu-Yuan Chen, Yi-Hsin Cheng
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Patent number: 11948949Abstract: In some embodiments, the present disclosure relates to a device having a semiconductor substrate including a frontside and a backside. On the frontside of the semiconductor substrate are a first source/drain region and a second source/drain region. A gate electrode is arranged on the frontside of the semiconductor substrate and includes a horizontal portion, a first vertical portion, and a second vertical portion. The horizontal portion is arranged over the frontside of the semiconductor substrate and between the first and second source/drain regions. The first vertical portion extends from the frontside towards the backside of the semiconductor substrate and contacts the horizontal portion of the gate electrode structure. The second vertical portion extends from the frontside towards the backside of the semiconductor substrate, contacts the horizontal portion of the gate electrode structure, and is separated from the first vertical portion by a channel region of the substrate.Type: GrantFiled: July 15, 2022Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting, Wei Chuang Wu, Yen-Ting Chiang, Chia Ching Liao, Yen-Yu Chen
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Publication number: 20240104019Abstract: Disclosed is a method for enhancing memory utilization and throughput of a computing platform in training a deep neural network (DNN). The critical features of the method includes: calculating a memory size for every operation in a computational graph, storing the operations in the computational graph in multiple groups with the operations in each group being executable in parallel and a total memory size less than a memory threshold of a computational device, sequentially selecting a group and updating a prefetched group buffer, and simultaneously executing the group and prefetching data for a group in the prefetched group buffer to the corresponding computational device when the prefetched group buffer is update. Because of group execution and data prefetch, the memory utilization is optimized and the throughput is significantly increased to eliminate issues of out-of-memory and thrashing.Type: ApplicationFiled: September 9, 2020Publication date: March 28, 2024Applicant: AETHERAI IP HOLDING LLCInventors: Chi-Chung CHEN, Wei-Hsiang YU, Chao-Yuan YEH
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Publication number: 20240086329Abstract: An apparatus to facilitate data prefetching is disclosed. The apparatus includes a cache, one or more execution units (EUs) to execute program code, prefetch logic to maintain tracking information of memory instructions in the program code that trigger a cache miss and compiler logic to receive the tracking information, insert one or more pre-fetch instructions in updated program code to prefetch data from a memory for execution of one or more of the memory instructions that triggered a cache miss and download the updated program code for execution by the one or more EUs.Type: ApplicationFiled: September 20, 2023Publication date: March 14, 2024Applicant: Intel CorporationInventors: Vasileios Porpodas, Guei-Yuan Lueh, Subramaniam Maiyuran, Wei-Yu Chen
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Patent number: 11929434Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.Type: GrantFiled: April 15, 2022Date of Patent: March 12, 2024Assignee: eMemory Technology Inc.Inventors: Chih-Hsin Chen, Shih-Chen Wang, Tsung-Mu Lai, Wen-Hao Ching, Chun-Yuan Lo, Wei-Chen Chang
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Patent number: 11929767Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.Type: GrantFiled: August 16, 2022Date of Patent: March 12, 2024Assignee: MEDIATEK INC.Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
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Patent number: 11923205Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.Type: GrantFiled: December 17, 2021Date of Patent: March 5, 2024Assignee: UNITED MICROELECTRONICS CORPORATIONInventors: Kun-Ju Li, Ang Chan, Hsin-Jung Liu, Wei-Xin Gao, Jhih-Yuan Chen, Chun-Han Chen, Zong-Sian Wu, Chau-Chung Hou, I-Ming Lai, Fu-Shou Tsai
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Publication number: 20240071988Abstract: A method for manufacturing a semiconductor structure is provided. The method includes: providing a substrate and a dielectric layer on the substrate; forming a hole in the dielectric layer; forming an initial barrier material layer and a conductive layer on an upper surface of the dielectric layer and in the hole; removing part of the initial barrier material layer and part of the conductive layer to form a barrier material layer and a via element in the hole respectively and expose the upper surface of the dielectric layer. An upper surface of the barrier material layer is higher than the upper surface of the dielectric layer.Type: ApplicationFiled: October 11, 2022Publication date: February 29, 2024Inventors: Kun-Ju LI, Hsin-Jung LIU, Wei-Xin GAO, Jhih-Yuan CHEN, Ang CHAN, Chau-Chung HOU
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Patent number: 11898076Abstract: A contact lens includes at least one color changeable region, wherein the color changeable region includes at least one photoluminescence material. When a wavelength of the photoluminescence material having a maximum radiation intensity is WEmMx, an average transmittance in a wavelength range of 400 nm-700 nm of the color changeable region is T4070, a size of a total area of the color changeable region is AC, and a size of a total area of the contact lens is AL, certain conditions relating to WEmMx, T4070 and AC/AL are satisfied.Type: GrantFiled: November 11, 2022Date of Patent: February 13, 2024Assignee: LARGAN MEDICAL CO., LTD.Inventors: Wei-Yuan Chen, Po-Tsun Chen, Wei-Chun Chen, Chun-Hung Teng
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Publication number: 20240010816Abstract: A plasticizer, a plastic composition and a plastic product are provided. The plasticizer composition and the plastic product include the plasticizer, and the plasticizer has a biodegradability. The plasticizer has a structure represented by Formula (I), in which each of the symbols thereof is as defined in the specification, and the plasticizer has a central structure.Type: ApplicationFiled: June 16, 2023Publication date: January 11, 2024Inventors: Wei-Yuan CHEN, Po-Tsun CHEN, Tzu-Rong LU, Rih-Sian CHEN, Yu Jie HONG, Chun-Hung TENG
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Publication number: 20230400784Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.Type: ApplicationFiled: July 28, 2023Publication date: December 14, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shao-Hua WANG, Chueh-Chi KUO, Kuei-Lin HO, Zong-You YANG, Cheng-Wei SUN, Wei-Yuan CHEN, Cheng-Chieh CHEN, Heng-Hsin LIU, Li-Jui CHEN
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Publication number: 20230402587Abstract: A battery material is a core-shell structure, and the core-shell structure includes a core and a shell. The shell surrounds the core. A composition of the core is a silicon material. The shell includes a polymer, the polymer is linear, the polymer includes a first structure and a second structure, the first structure includes a siloxane group, and the second structure includes a carboxyl group or an ester group. The first structure is more adjacent to the core than the second structure.Type: ApplicationFiled: June 5, 2023Publication date: December 14, 2023Inventors: Wei-Yuan CHEN, Po-Tsun CHEN, Tzu Lien WANG, Shih Yu HUANG, Cheng-Yu TSAI, Chun-Hung TENG
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Publication number: 20230393417Abstract: A contact lens product includes a multifocal contact lens and a buffer solution. The multifocal contact lens is immersed in the buffer solution. The multifocal contact lens includes a central region and at least one annular region. The annular region concentrically surrounds the central region, and a diopter of the annular region is different from a diopter of the central region. The multifocal contact lens is made of silicone hydrogel or hydrogel. The annular region closest to a periphery of the multifocal contact lens is a first annular region.Type: ApplicationFiled: August 24, 2023Publication date: December 7, 2023Inventors: En-Ping LIN, Wei-Yuan CHEN, Chun-Hung TENG
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Publication number: 20230323083Abstract: A plastic composition includes at least one plastic and at least one plasticizer. The plastic include a polylactic acid. The plasticizer includes an amide ester compound, and the amide ester compound has the biodegradability. The weight percentage of the plastic in the plastic composition is 85% to 99.99%, and the weight percentage of the plasticizer in the plastic composition is 0.01% to 15%.Type: ApplicationFiled: March 15, 2023Publication date: October 12, 2023Inventors: Wei-Yuan CHEN, Po-Tsun CHEN, Tzu-Rong LU, Rih-Sian CHEN, Yu Jie HONG, Chun-Hung TENG
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Publication number: 20230326421Abstract: A light-emitting assembly includes a substrate and a plurality of light-emitting elements disposed on the substrate. The substrate includes a base material layer, a first electrical conductive layer and a protection layer in a sectional view. A thickness of the first electrical conductive layer is greater than a thickness of the protection layer. The thickness of the protection layer is greater than 0 ?m and less than 30 ?m. This disclosure can improve the non-uniform brightness issue (hotspots) or enhance the optical performance.Type: ApplicationFiled: June 14, 2023Publication date: October 12, 2023Inventors: Chung-Chun KUO, Chun-Fang CHEN, Hui-Wen SU, Wei-Yuan CHEN, Chung-Yu CHENG
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Patent number: 11782350Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.Type: GrantFiled: August 9, 2022Date of Patent: October 10, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shao-Hua Wang, Chueh-Chi Kuo, Kuei-Lin Ho, Zong-You Yang, Cheng-Wei Sun, Wei-Yuan Chen, Cheng-Chieh Chen, Heng-Hsin Liu, Li-Jui Chen
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Patent number: 11782294Abstract: A contact lens product includes a multifocal contact lens and a buffer solution. The multifocal contact lens is immersed in the buffer solution. The multifocal contact lens includes a central region and at least one annular region. The annular region concentrically surrounds the central region, and a diopter of the annular region is different from a diopter of the central region. The multifocal contact lens is made of silicone hydrogel or hydrogel. The annular region closest to a periphery of the multifocal contact lens is a first annular region.Type: GrantFiled: September 14, 2020Date of Patent: October 10, 2023Assignee: LARGAN MEDICAL CO., LTD.Inventors: En-Ping Lin, Wei-Yuan Chen, Chun-Hung Teng
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Patent number: 11715433Abstract: A light-emitting assembly includes a substrate and a plurality of light-emitting elements. The substrate includes a component arrangement region and a planar region in a top view, and includes a base material layer, a filled layer and a protection layer in a sectional view. A thickness of the filled layer is greater than a thickness of the protection layer. The thickness of the protection layer is greater than 0 ?m and less than 30 ?m. The plurality of light-emitting elements are located on the component arrangement region. This disclosure can improve the non-uniform brightness issue (hotspots) or enhance the optical performance.Type: GrantFiled: February 9, 2022Date of Patent: August 1, 2023Assignee: INNOLUX CORPORATIONInventors: Chung-Chun Kuo, Chun-Fang Chen, Hui-Wen Su, Wei-Yuan Chen, Chung-Yu Cheng
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Patent number: D1017381Type: GrantFiled: June 28, 2022Date of Patent: March 12, 2024Assignee: QBIC TECHNOLOGY CO., LTD.Inventors: Yi-Hsin Chen, Wei-Yuan Cheng, Ren-Yin Wu Ji
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Patent number: D1019349Type: GrantFiled: June 28, 2022Date of Patent: March 26, 2024Assignee: QBIC TECHNOLOGY CO., LTD.Inventors: Yi-Hsin Chen, Wei-Yuan Cheng, Ren-Yin Wu Ji