Abstract: A camera structure, including a lens holder, a lens frame and a plurality of balls. The lens holder has a holder body, one end of which has a first rolling groove. The first groove wall part and the second groove wall part are disposed on two sides of the first rolling groove, and the groove bottom is disposed between the first groove wall part and the second groove wall part. The lens frame is mounted on an outer side of the holder body. The plurality of balls are located inside the first rolling groove, wherein the first groove wall part and the second groove wall part support the plurality of balls, there is a gap between each of the plurality of balls and the groove bottom, and the plurality of balls lay between the lens holder and the lens frame.

Abstract: There is described a method performed by a computing device having first and second touch-sensitive user interfaces. According to this method, when a user input is applied to one of the first and second user interfaces, the computing device detects the user input and determines a force applied by the user input and a type of the user input. The computing device then determines whether to perform a function such as whether to display a virtual trackpad or a virtual keyboard, based on the force, the type of the user input, and a determination whether the user input is applied to a selected one of the first and second user interfaces.

Abstract: An integrated circuit (IC) package includes a first integrated circuit (IC) device. An interconnection structure is disposed over the first IC device in a cross-sectional side view. The interconnection structure includes a plurality of interconnection components. A cavity is disposed in the interconnection structure in the cross-sectional side view. A second IC device is disposed at least partially within the cavity in the cross-sectional side view. The second IC device is electrically coupled to the first IC device through at least a subset of the interconnection components of the interconnection structure. A non-metallic material partially fills the cavity. The second IC device is at least partially surrounded by the non-metallic material in the cross-sectional side view and in a top view.

Abstract: A semiconductor structure includes an interconnect structure, a passivation structure, a first capacitor, and a contact feature. The interconnect structure is disposed over a semiconductor substrate. The passivation structure is disposed over the interconnect structure. The first capacitor is disposed within the passivation structure. The contact feature is disposed over the passivation structure, wherein the first capacitor is proximal to a corner of the contact feature. A method of manufacturing the semiconductor structure is also provided.

Abstract: A semiconductor structure includes a source/drain feature in the semiconductor layer. The semiconductor structure includes a dielectric layer over the source/drain feature. The semiconductor structure includes a silicide layer over the source/drain feature. The semiconductor structure includes a barrier layer over the silicide layer. The semiconductor structure includes a seed layer over the barrier layer. The semiconductor structure includes a metal layer between a sidewall of the seed layer and a sidewall of the dielectric layer, a sidewall of each of the silicide layer, the barrier layer, and the metal layer directly contacting the sidewall of the dielectric layer. The semiconductor structure includes a source/drain contact over the seed layer.

Abstract: An optical element driving mechanism is provided, including a fixed part, a movable part, a metallic member and a driving assembly. The fixed part includes a base. The movable part is movably connected to the fixed part, and carries an optical element, the optical element has an optical axis. The metallic member is disposed on the base, and includes an inner electrical connection part and an outer electrical connection part, the inner electrical connection part and the outer electrical connection part are connected to each other. The driving assembly includes at least one driving magnetic element and drives the movable part to move relative to the fixed part.

Abstract: The present disclosure provides an electronic circuit, a memory device, and a method for operating an electronic circuit. An electronic circuit comprises a driver circuit configured to provide a drive voltage to a word line of the electronic circuit, a suppression circuit electrically connected to the driver circuit and the word line, and a control circuit electrically connected to the suppression circuit. The suppression circuit is configured to generate a voltage drop in the drive voltage. The control circuit controls the suppression circuit.

Abstract: A biomimetic waterfowl includes a housing, two waterfowl legs, and a driving module. The waterfowl legs are spaced apart from each other in a left-right direction and are mounted to a bottom portion of the housing. Each waterfowl leg includes a first segment mounted to the housing and rotatable about a first axis parallel to the left-right direction, and a second segment rotatable about a second axis parallel to the first axis. The driving module is mounted to the housing and is configured to drive the waterfowl legs. Each of the waterfowl legs is movable between a retracted state, where the first segment extends forwardly from the housing and the second segment extends rearwardly from the first segment, and a propelling state, where the first segment extends rearwardly from the housing and the second segment extends rearwardly from the first segment.

Abstract: A memory device is provided which includes a first memory cell including a first transistor and a second transistor coupled to the first transistor in parallel. Gates of the first transistor and the second transistor are coupled to each other, and the gates of the first transistor and the second transistor pass different layers and overlap with each other. Types of the first transistor and the second transistor are the same.

Abstract: A making device of ice balls comprises a refrigeration chamber unit; the refrigeration chamber unit comprises a lower half ball mold body, an upper half ball mold body and a water circulation unit; in addition, a cover plate is arranged above the refrigeration chamber unit, and a water injection hole is arranged on the cover plate; in addition, a plurality of low-temperature condensing tubes are arranged in the lower half ball mold body; in addition, the refrigeration chamber unit further comprises a thermo electric cooler, and a cold end face of the thermo electric cooler is attached to a bottom surface of the lower half ball mold body; the upper half ball mold body is arranged above the lower half ball mold body, a plurality of convection circulation holes are distributed on the upper half ball mold body, and a water inlet hole is arranged in the center of the upper half ball mold body; and the water circulation unit is arranged on the cover plate and comprises a pump, and the pump is respectively connected

Abstract: A color filter substrate and a display panel are provided. The color filter substrate includes a substrate, first spacers, second spacers, color resist patterns, and at least one dummy-color resist pattern. A first area has a first projection area A. A second area has a second projection area B. The color resist patterns are disposed at least partially around of at least one of the first spacers. A covering area of the color resist patterns in the first area is a. (a/A)*100% is defined as a first coverage rate M. The dummy-color resist pattern is disposed at least partially around of at least one of the second spacers. The covering area of the dummy-color resist pattern in the second area is b. (b/B)*100% is defined as a second coverage rate N. The first projected area A is equal to the second projected area B and 27%?(N?M)?58%.

Abstract: A color filter substrate and a display panel are provided. The color filter substrate includes a substrate, first spacers, second spacers, color resist patterns, and at least one dummy-color resist pattern. A first area has a first projection area A. A second area has a second projection area B. The color resist patterns are disposed at least partially around of at least one of the first spacers. A covering area of the color resist patterns in the first area is a. (a/A)*100% is defined as a first coverage rate M. The dummy-color resist pattern is disposed at least partially around of at least one of the second spacers. The covering area of the dummy-color resist pattern in the second area is b. (b/B)*100% is defined as a second coverage rate N. The first projected area A is equal to the second projected area B and 27% ?, (N-M)?58%.

Abstract: A cover film with high dimensional stability includes an insulation film, a first adhesive layer, and a carrier. A first side of the first adhesive layer is connected to a first surface of the insulation film, and a second side of the first adhesive layer is configured to adhere to at least one metal conductor of a flexible printed circuit board. The carrier includes a supporting film and a second adhesive layer. A first side of the second adhesive layer is connected to the supporting film, and a second side of the second adhesive layer is adhered to a second surface of the insulation film, wherein bonding strength of the second adhesive film is smaller than bonding strength of the first adhesive film.

Abstract: Novel 1,1,2-trifluorodienes, which have a minimum of seven carbon atoms and may contain in their molecule a phenylene or a methylphenylene moiety, are useful monomers, that can be polymerized in the presence of either free radical or coordination catalysts and can undergo selective reactions such, as for example, epoxidation of the vinyl (nonfluorinated) double bond. The resulting perfluorovinyl epoxy compounds also are useful monomers, which can undergo polymerization to useful materials.