Patents by Inventor Wei-Yuan Ma
Wei-Yuan Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12206059Abstract: A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.Type: GrantFiled: February 7, 2022Date of Patent: January 21, 2025Assignee: Lextar Electronics CorporationInventors: Chih-Hao Lin, Wei-Yuan Ma, Jo-Hsiang Chen
-
Publication number: 20250022854Abstract: Provide a micro-light-emitting package includes a first substrate, a plurality of micro-light-emitting diodes (micro-LEDs), a transparent protective layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other. The micro-LEDs are disposed on the upper surface of the first substrate. The micro-LEDs have a first electrode and a second electrode electrically opposite to the first electrode. The transparent protective layer covers the micro-LEDs. The plurality of conductive pads are disposed on the lower surface of the first substrate. The conductive pads include a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad. The first conductive pad, the second conductive pad, the third conductive pad respectively electrically connected to the corresponding first electrode of the micro-LEDs. The fourth conductive pad is commonly electrically connected to the second electrode of the plurality of micro-LEDs.Type: ApplicationFiled: June 18, 2024Publication date: January 16, 2025Inventors: Chih-Hao LIN, Po-Han WU, Tsung-Hao SU, Wei-Yuan MA
-
Publication number: 20240355986Abstract: A micro light-emitting diode package structure and a forming method thereof are provided. The micro light-emitting diode package structure includes micro light-emitting diode dies, a light-transmitting layer, a first insulating layer, redistribution layers, and conductive elements. The micro light-emitting diode dies are disposed side by side and each includes an electrode surface, a light-emitting surface, and side surfaces. The electrode surface and the light-emitting surface are opposite to each other, and the side surfaces are between them. The light-transmitting layer covers the light-emitting surface and the side surfaces. The first insulating layer is under the micro light-emitting diode dies and in direct contact with the electrode surface. The redistribution layers are disposed under the first insulating layer and pass through the first insulating layer to electrically connect the electrode surface.Type: ApplicationFiled: April 11, 2024Publication date: October 24, 2024Inventors: Shiou-Yi KUO, Guo-Yi SHIU, Chin-Hung LO, Chih-Hao LIN, Cheng-Hsien LI, Wei-Yuan MA
-
Publication number: 20230238362Abstract: A light-emitting diode (LED) display device, including a substrate, a de-mura region, a plurality of mounting blocks, a first LED chip array and a second LED chip array, is disclosed. The substrate includes a first region and a second region adjacent to each other. The de-mura region includes part of the first region and part of the second region. The mounting blocks are arranged in the first and the second region as an array, each mounting block including a first and a second mounting part. The first and the second mounting part are connected in parallel. The first LED chip array includes multiple first LED chips. The second LED chip array includes multiple second LED chips. Each first mounting part is arranged on the first side of the corresponding mounting block, and each second mounting part is arranged on the second side of the corresponding mounting block.Type: ApplicationFiled: January 26, 2022Publication date: July 27, 2023Inventors: Jian-Chin LIANG, Chih-Hao LIN, Wei-Yuan MA, Jo-Hsiang CHEN
-
Publication number: 20230178523Abstract: A light-emitting diode display panel includes a driving substrate, and a first light-emitting region and a second light-emitting region disposed on the driving substrate. The first light-emitting region has a first region and a second region adjacent to the first region in the first direction. The second light-emitting region is adjacent to the first light-emitting region and has a first corresponding region. The second region is between the first region and the first corresponding region. The light-emitting diode display panel further includes pixels disposed in the first region, the second region, and the first corresponding region. Each pixel includes a first light-emitting unit. The first pitch is between the first light-emitting units in the first region and in the second region. The second pitch is between the first light-emitting units in the second region and the first corresponding region. The first pitch is shorter than the second pitch.Type: ApplicationFiled: August 22, 2022Publication date: June 8, 2023Inventors: Chih-Hao LIN, Wei-Yuan MA, Jo-Hsiang CHEN
-
Patent number: 11637082Abstract: A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.Type: GrantFiled: September 7, 2021Date of Patent: April 25, 2023Assignee: eLux, Inc.Inventors: Wei-Yuan Ma, Jong-Jan Lee
-
Publication number: 20230111709Abstract: A display device includes a plurality of first packages and a plurality of second packages. The first packages are arranged on the substrate and each of the first packages includes a plurality of first light-emitting chips. The second packages are arranged on the substrate and each of the second packages includes a plurality of second light-emitting chips. The first packages and the second packages are alternately arranged in a first direction, and an arrangement of the first light-emitting chips of the first packages is different from an arrangement of the second light-emitting chips of the second packages.Type: ApplicationFiled: August 25, 2022Publication date: April 13, 2023Inventors: Chih-Hao LIN, Wei-Yuan MA, Jo-Hsiang CHEN
-
Publication number: 20230070973Abstract: A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.Type: ApplicationFiled: September 7, 2022Publication date: March 9, 2023Inventors: Chih-Hao LIN, Jo-Hsiang CHEN, Wei-Yuan MA, Hui-Ru WU, Min-Che TSAI, Shiou-Yi KUO, Jian-Chin LIANG
-
Publication number: 20220254973Abstract: A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.Type: ApplicationFiled: February 7, 2022Publication date: August 11, 2022Inventors: Chih-Hao LIN, Wei-Yuan MA, Jo-Hsiang CHEN
-
Publication number: 20210398938Abstract: A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.Type: ApplicationFiled: September 7, 2021Publication date: December 23, 2021Inventors: Wei-Yuan Ma, Jong-Jan Lee
-
Patent number: 11152328Abstract: A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.Type: GrantFiled: December 13, 2018Date of Patent: October 19, 2021Assignee: eLux, Inc.Inventors: Wei-Yuan Ma, Jong-Jan Lee
-
Publication number: 20200194401Abstract: A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.Type: ApplicationFiled: December 13, 2018Publication date: June 18, 2020Inventors: Wei-Yuan Ma, Jong-Jan Lee
-
Publication number: 20160354781Abstract: The invention provides a microfluidic plate for various biological experiments and analyses. The microfluidic plate of the invention comprises one or more unit formed on or in the plate, wherein the unit comprises (a) a chamber; (b) a fluid channel adjacent to the chamber; (c) at least one microfluidic gap region connected between the chamber and the channel and in fluidic communication therewith; and (d) at least one opening located at the channel and connected with the gaps and in fluidic communication with the gaps.Type: ApplicationFiled: April 12, 2016Publication date: December 8, 2016Inventors: Andrew Man Chung Wo, Lo-Chang Hsiung, Wei-Yuan Ma