Patents by Inventor Wei Zhen
Wei Zhen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12311396Abstract: The present invention discloses a shower device, comprising a shower and a base, the base is provided with a convex boss, the back of the shower 1 is provided with a groove matching the convex boss, and the base is also provided with an elastic buckle, the shower is provided with a clamping slot that can be matched and clamped with the elastic buckle, and another socket for hooking up the shower is also provided on the base. Through the design of the above-mentioned structure, the invention specifically uses the cooperation relationship between the clamping slot and the groove to form a lock position in a certain, so as to avoid the accident that the shower falls off from the base and accidentally injures the child. At the same time, a socket is arranged at the height of the side end of the base, which meets the needs of people who need high-altitude shower, and enhance diversity and flexibility.Type: GrantFiled: December 30, 2021Date of Patent: May 27, 2025Assignee: RUNNER(XIAMEN) CORP.Inventors: bi fu Dai, xin zhan Hu, wen Gao, tao yan Zhang, Gang Yu, zhi liang Lin, wei zhen Chen, yong Lin, lu Lu
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Publication number: 20250011427Abstract: The present disclosure provides new anti-CD3 antibodies, including humanized ones, and their antigen-binding fragments. These antibodies can bind to both human and cynomolgus CD3 at high affinity, and their single chain fragments (scFv) can be readily incorporated into multispecific antibodies to effectively activate T cell in the presence of tumor cells. Further, even though a relatively small number, these antibodies have anti-CD3 activities of a broad range, which are accordingly categorized into nine different grades. As further demonstrated, these anti-CD3 antibodies and fragments can be suitably used in bi- or tri-specific antibodies to achieve optimized activities and safety margins.Type: ApplicationFiled: October 12, 2022Publication date: January 9, 2025Inventors: Wei Zhen, Liu YANG, Lei FANG
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Publication number: 20220219189Abstract: The present invention discloses a shower device, comprising a shower and a base, the base is provided with a convex boss, the back of the shower 1 is provided with a groove matching the convex boss, and the base is also provided with an elastic buckle, the shower is provided with a clamping slot that can be matched and clamped with the elastic buckle, and another socket for hooking up the shower is also provided on the base. Through the design of the above-mentioned structure, the invention specifically uses the cooperation relationship between the clamping slot and the groove to form a lock position in a certain, so as to avoid the accident that the shower falls off from the base and accidentally injures the child. At the same time, a socket is arranged at the height of the side end of the base, which meets the needs of people who need high-altitude shower, and enhance diversity and flexibility.Type: ApplicationFiled: December 30, 2021Publication date: July 14, 2022Applicant: RUNNER(XIAMEN) CORP.Inventors: bi fu Dai, xin zhan HU, wen Gao, tao yan Zhang, gang Xu, zhi liang Lin, wei zhen Chen, yong Lin, lu Lu
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Patent number: 11302647Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.Type: GrantFiled: May 14, 2020Date of Patent: April 12, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Hui-Ping Jian, Wei-Zhen Qiu
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Publication number: 20210358859Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.Type: ApplicationFiled: May 14, 2020Publication date: November 18, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Hui-Ping JIAN, Wei-Zhen QIU
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Patent number: 9679870Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.Type: GrantFiled: December 10, 2014Date of Patent: June 13, 2017Assignee: STMicroelectronics Pte LtdInventors: Yiyi Ma, Kim-Yong Goh, Xueren Zhang, Wei Zhen Goh
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Publication number: 20160172262Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.Type: ApplicationFiled: December 10, 2014Publication date: June 16, 2016Inventors: Yiyi MA, Kim-Yong GOH, Xueren ZHANG, Wei Zhen GOH
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Publication number: 20160086690Abstract: A cable beam is provided and includes a first cable and a second cable. The first cable includes a first conductor and a first PTC material layer clad on the first conductor. The second cable includes a second conductor and a second PTC material layer clad on the second conductor. The second cable is wound with the first cable and the first PTC material layer is electrically connected to the second PTC material layer.Type: ApplicationFiled: September 18, 2015Publication date: March 24, 2016Applicant: RAYCHEM ELECTRONICS (SHANGHAI) LTD.Inventors: Tao Guo, Wei Zhen, Jianyong Liu
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Publication number: 20160086689Abstract: A cable is provided and includes a first conductor, a second conductor, and a PTC material layer. The PTC material layer is directly bonded to and electrically connects the first conductor and the second conductor.Type: ApplicationFiled: September 18, 2015Publication date: March 24, 2016Applicant: Raychem Electronics (Shanghai) Co., Ltd.Inventors: Tao Guo, Wei Zhen, Jianyong Liu
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Patent number: 9119237Abstract: The present invention discloses a lighting lamp (10), is used for emitting a plurality of lights with different color temperatures, and color rendering indexes of all the lights are larger than 90. The lighting lamp (10) includes a combination (100) of light sources and a driving module (200). The combination (100) of the light sources includes four LEDs with specific wavelengths. The driving module (200) is utilized to drive the LEDs to illuminate and to control energy distribution of luminous energy for the first, second, third and fourth LEDs, thereby dynamically adjusting to show the light with 9000K, 12000K and eight color temperatures defined by the ENERGY STAR.Type: GrantFiled: November 23, 2012Date of Patent: August 25, 2015Assignee: NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Neng-chung Hu, Chin-chuan Wu, Wei-zhen Wu
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Patent number: 8907465Abstract: Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.Type: GrantFiled: March 29, 2013Date of Patent: December 9, 2014Assignee: STMicroelectronics Pte LtdInventors: Kim-Yong Goh, Yiyi Ma, Wei Zhen Goh
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Publication number: 20140291782Abstract: Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.Type: ApplicationFiled: March 29, 2013Publication date: October 2, 2014Applicant: STMicroelectronics Pte Ltd.Inventors: Kim-Yong Goh, Yiyi Ma, Wei Zhen Goh
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Patent number: 8615498Abstract: A computer-implemented method for migrating an object from a deduplication store to an external domain in an external media is described. A deduplication store (dstore) deduplication map (dmap) is retrieved from a dstore for an object stored in the dstore. A determination is made as to whether an external dmap exists in the external domain for an object referenced in the dstore dmap. If the external dmap exists, a determination is made as to whether data referenced in the dstore dmap exist in the external dmap. If the referenced data do not exist, the referenced data is extracted from the dstore to the external domain. If the external dmap does not exist, the object and the associated dmap are extracted from the dstore to the external domain.Type: GrantFiled: June 19, 2009Date of Patent: December 24, 2013Assignee: Symantec CorporationInventors: Graham Bromley, Thomas Clifford, Jon Genda, Jian Jun Lu, James Ohr, Yi Qu, Weibao Wu, Wei-Zhen Zhu
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Publication number: 20100084291Abstract: A carrying case for a tablet computer, said case including a support surface for supporting a tablet computer; a first and second holder for securing the tablet computer to a top-oriented face of said support surface, and a handle for carrying said case arranged with a bottom-oriented face of said support surface. Said first holder is attached to a first edge portion of the support face and said second holder is attached to a second edge portion of the support face such that said first holder and second holder are oriented respectively to engage adjacent sides of the tablet computer secured therein, and at least one of said holders is slidably attached to an edge portion of the support surface such that said holder can be extended outwards from the edge portion to allow the support surface to be adapted to support varying tablet computer sizes.Type: ApplicationFiled: June 22, 2009Publication date: April 8, 2010Inventors: Steve Dayton, Doug Harrison, Huang Wei Zhen, Wang Yong Dong, Zhang Shu Shuai