Patents by Inventor Wei Zhen

Wei Zhen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12311396
    Abstract: The present invention discloses a shower device, comprising a shower and a base, the base is provided with a convex boss, the back of the shower 1 is provided with a groove matching the convex boss, and the base is also provided with an elastic buckle, the shower is provided with a clamping slot that can be matched and clamped with the elastic buckle, and another socket for hooking up the shower is also provided on the base. Through the design of the above-mentioned structure, the invention specifically uses the cooperation relationship between the clamping slot and the groove to form a lock position in a certain, so as to avoid the accident that the shower falls off from the base and accidentally injures the child. At the same time, a socket is arranged at the height of the side end of the base, which meets the needs of people who need high-altitude shower, and enhance diversity and flexibility.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: May 27, 2025
    Assignee: RUNNER(XIAMEN) CORP.
    Inventors: bi fu Dai, xin zhan Hu, wen Gao, tao yan Zhang, Gang Yu, zhi liang Lin, wei zhen Chen, yong Lin, lu Lu
  • Publication number: 20250011427
    Abstract: The present disclosure provides new anti-CD3 antibodies, including humanized ones, and their antigen-binding fragments. These antibodies can bind to both human and cynomolgus CD3 at high affinity, and their single chain fragments (scFv) can be readily incorporated into multispecific antibodies to effectively activate T cell in the presence of tumor cells. Further, even though a relatively small number, these antibodies have anti-CD3 activities of a broad range, which are accordingly categorized into nine different grades. As further demonstrated, these anti-CD3 antibodies and fragments can be suitably used in bi- or tri-specific antibodies to achieve optimized activities and safety margins.
    Type: Application
    Filed: October 12, 2022
    Publication date: January 9, 2025
    Inventors: Wei Zhen, Liu YANG, Lei FANG
  • Publication number: 20220219189
    Abstract: The present invention discloses a shower device, comprising a shower and a base, the base is provided with a convex boss, the back of the shower 1 is provided with a groove matching the convex boss, and the base is also provided with an elastic buckle, the shower is provided with a clamping slot that can be matched and clamped with the elastic buckle, and another socket for hooking up the shower is also provided on the base. Through the design of the above-mentioned structure, the invention specifically uses the cooperation relationship between the clamping slot and the groove to form a lock position in a certain, so as to avoid the accident that the shower falls off from the base and accidentally injures the child. At the same time, a socket is arranged at the height of the side end of the base, which meets the needs of people who need high-altitude shower, and enhance diversity and flexibility.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 14, 2022
    Applicant: RUNNER(XIAMEN) CORP.
    Inventors: bi fu Dai, xin zhan HU, wen Gao, tao yan Zhang, gang Xu, zhi liang Lin, wei zhen Chen, yong Lin, lu Lu
  • Patent number: 11302647
    Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: April 12, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Hung Chen, Hui-Ping Jian, Wei-Zhen Qiu
  • Publication number: 20210358859
    Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.
    Type: Application
    Filed: May 14, 2020
    Publication date: November 18, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Hui-Ping JIAN, Wei-Zhen QIU
  • Patent number: 9679870
    Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: June 13, 2017
    Assignee: STMicroelectronics Pte Ltd
    Inventors: Yiyi Ma, Kim-Yong Goh, Xueren Zhang, Wei Zhen Goh
  • Publication number: 20160172262
    Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.
    Type: Application
    Filed: December 10, 2014
    Publication date: June 16, 2016
    Inventors: Yiyi MA, Kim-Yong GOH, Xueren ZHANG, Wei Zhen GOH
  • Publication number: 20160086690
    Abstract: A cable beam is provided and includes a first cable and a second cable. The first cable includes a first conductor and a first PTC material layer clad on the first conductor. The second cable includes a second conductor and a second PTC material layer clad on the second conductor. The second cable is wound with the first cable and the first PTC material layer is electrically connected to the second PTC material layer.
    Type: Application
    Filed: September 18, 2015
    Publication date: March 24, 2016
    Applicant: RAYCHEM ELECTRONICS (SHANGHAI) LTD.
    Inventors: Tao Guo, Wei Zhen, Jianyong Liu
  • Publication number: 20160086689
    Abstract: A cable is provided and includes a first conductor, a second conductor, and a PTC material layer. The PTC material layer is directly bonded to and electrically connects the first conductor and the second conductor.
    Type: Application
    Filed: September 18, 2015
    Publication date: March 24, 2016
    Applicant: Raychem Electronics (Shanghai) Co., Ltd.
    Inventors: Tao Guo, Wei Zhen, Jianyong Liu
  • Patent number: 9119237
    Abstract: The present invention discloses a lighting lamp (10), is used for emitting a plurality of lights with different color temperatures, and color rendering indexes of all the lights are larger than 90. The lighting lamp (10) includes a combination (100) of light sources and a driving module (200). The combination (100) of the light sources includes four LEDs with specific wavelengths. The driving module (200) is utilized to drive the LEDs to illuminate and to control energy distribution of luminous energy for the first, second, third and fourth LEDs, thereby dynamically adjusting to show the light with 9000K, 12000K and eight color temperatures defined by the ENERGY STAR.
    Type: Grant
    Filed: November 23, 2012
    Date of Patent: August 25, 2015
    Assignee: NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Neng-chung Hu, Chin-chuan Wu, Wei-zhen Wu
  • Patent number: 8907465
    Abstract: Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: December 9, 2014
    Assignee: STMicroelectronics Pte Ltd
    Inventors: Kim-Yong Goh, Yiyi Ma, Wei Zhen Goh
  • Publication number: 20140291782
    Abstract: Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.
    Type: Application
    Filed: March 29, 2013
    Publication date: October 2, 2014
    Applicant: STMicroelectronics Pte Ltd.
    Inventors: Kim-Yong Goh, Yiyi Ma, Wei Zhen Goh
  • Patent number: 8615498
    Abstract: A computer-implemented method for migrating an object from a deduplication store to an external domain in an external media is described. A deduplication store (dstore) deduplication map (dmap) is retrieved from a dstore for an object stored in the dstore. A determination is made as to whether an external dmap exists in the external domain for an object referenced in the dstore dmap. If the external dmap exists, a determination is made as to whether data referenced in the dstore dmap exist in the external dmap. If the referenced data do not exist, the referenced data is extracted from the dstore to the external domain. If the external dmap does not exist, the object and the associated dmap are extracted from the dstore to the external domain.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: December 24, 2013
    Assignee: Symantec Corporation
    Inventors: Graham Bromley, Thomas Clifford, Jon Genda, Jian Jun Lu, James Ohr, Yi Qu, Weibao Wu, Wei-Zhen Zhu
  • Publication number: 20100084291
    Abstract: A carrying case for a tablet computer, said case including a support surface for supporting a tablet computer; a first and second holder for securing the tablet computer to a top-oriented face of said support surface, and a handle for carrying said case arranged with a bottom-oriented face of said support surface. Said first holder is attached to a first edge portion of the support face and said second holder is attached to a second edge portion of the support face such that said first holder and second holder are oriented respectively to engage adjacent sides of the tablet computer secured therein, and at least one of said holders is slidably attached to an edge portion of the support surface such that said holder can be extended outwards from the edge portion to allow the support surface to be adapted to support varying tablet computer sizes.
    Type: Application
    Filed: June 22, 2009
    Publication date: April 8, 2010
    Inventors: Steve Dayton, Doug Harrison, Huang Wei Zhen, Wang Yong Dong, Zhang Shu Shuai