Abstract: This application discloses an obstacle detection method, including: obtaining a first image, where the first image is an image encoded based on an RGB model; reconstructing the first image to obtain a second image, where the second image is a hyper spectral image; and extracting a hyper spectral feature from the hyper spectral image, and classifying a candidate object in the hyper spectral image based on the hyper spectral feature to obtain an obstacle detection result. Because different textures correspond to different hyper spectral features, classifying candidate objects in hyper spectral images based on the hyper spectral features can distinguish an object that has a similar color but a different texture.

Abstract: Provided are a battery pack and a vehicle having same. The battery pack includes a frame, a partition assembly, a liquid cooling plate, and a bottom protection plate. The frame is configured to enclose a receiving cavity. The partition assembly is disposed in the frame to divide the receiving cavity into a plurality of receiving sub-cavities. The liquid cooling plate is located at a bottom of the frame, and has a bottom access opening directly facing one of the plurality of receiving sub-cavities. The liquid cooling plate is fixedly connected to the frame and at least part of the partition assembly adjacent to the bottom access opening. The bottom protection plate is detachably connected below the liquid cooling plate, and configured to open and close the bottom access opening.

Abstract: Methods, systems, and devices for edge protection for stacked semiconductor systems are described. A system may be fabricated to include a first semiconductor component with one or more first semiconductor dies associated with first circuitry. The system may include a second semiconductor component bonded with the first semiconductor component and including one or more second semiconductor dies associated with second circuitry. The second circuitry may be electrically coupled with the first circuitry. Various molding materials may be formed around the first semiconductor component and the second semiconductor component along one or more respective sidewalls surfaces of the first semiconductor component and the second semiconductor component. Alternatively, a same molding material may be formed around the first semiconductor component and the second semiconductor component. The sidewall surfaces of respective molding materials may be indicative of a separation from other portions of molding materials.

Abstract: Embodiments of the present disclosure provide a backlight module, a preparation method therefor, and a display device. The backlight module comprises: a backplane; a light plate arranged at one side of the backplane; and a backlight film arranged at a side, away from the backplane, of the light plate; wherein orthographic projections of the backlight film and the light plate on the backplane coincide with the backplane.

Abstract: The invention relates to an optical fiber adapter comprising a housing, an inner core, and a sliding drive mechanism. The housing comprises a large-size end and a small-size end, the large-size end is configured to be detachably connected to a second connector, and a first channel is provided in the housing; the inner core is slidably abutted in the first channel of the housing and has a second channel therein, the second channel is a signal connection channel between the second connector and a first connector, and the inner core is configured to be detachably connected to the first connector; and one or more sliding drive mechanisms drive the inner core so that it has a tendency to slide away from the small-size end.

Abstract: A series of novel anti-B7-H3 antibodies. The antibodies have high affinity to B7-H3 and have stable structures. Also provided is an antibody drug conjugate prepared by using said antibody. The antibody drug conjugate uses a camptothecin compound having a specific structure as a toxic molecule, has significant tumor inhibition activity, and has a bystander killing effect.

Abstract: The discloses provides a method for resolving the issue of accurately segmenting and determining the Region of Interest when two or more touches are in close proximity is provided, thereby improving touch detection and reducing errors and a method for reliably distinguishing between intentional finger touches and palm touches based on capacitive sensor data are provided, also enabling the system to effectively differentiate between deliberate user input and accidental palm contact. A method, a touchscreen device and a device driver are disclosed. A touch image comprising a plurality of active pixels is obtained from a touch sensor. One or more touch blobs are extracted from the touch image to create blob images. For each blob image, a query, keys and values are generated by an encoder using the output of a region-of-interest predictor, which makes it possible to use cross-attention to predict the probability of the touch being intentional or not.

Abstract: A smart furniture controller may include a remote control device and a control box including a receptacle configured to receive and retain the remote control device. A first magnet may be provided within the receptacle on an inner wall of the control box, and a second magnet may be provided in the remote control device. The first magnet and the second magnet may be configured to magnetically connect when the remote control device is positioned in the receptacle. According to an aspect, the control box may include a control circuit and a wireless communication assembly. The control circuit may control a functional unit of a smart furniture item. The wireless communication assembly may be configured to send a control signal to an external receiver or to the remote control device to control a massage component of the remote control device.

Abstract: An imidazolium salt macrocyclic compound, and a preparation method therefor, and a use thereof are provided. The macrocyclic compound as shown in formula (I) or a pharmaceutically acceptable salt, a hydrate, or a solvate thereof can be used in a composition with a pharmaceutically acceptable carrier, which is capable of producing neuromuscular junction block in the preparation of muscle relaxants.

Abstract: A display module, a method of manufacturing a display module, a display apparatus, a compensation method and an electronic device are provided. The display module includes: a display panel (100), a first PCB (110), a second PCB (120) and a transfer circuit (130). The first PCB (110) is bound to the display panel (100), and the first PCB (110) is provided with a transfer interface (113). The second PCB (120) is provided with a timing control chip (121) and a first memory chip (122). The transfer circuit (130) includes a first connection terminal and a second connection terminal, the first connection terminal is electrically connected to a signal output terminal of the second PCB (120), and the second connection terminal is plugged and connected to the transfer interface (113), so as to transmit a signal output by the second PCB (120) to the first PCB (110).

Abstract: An embodiment of the present disclosure discloses a display device, wherein the display device includes a backlight module and a display panel. The backlight module includes a back frame and an optical film group. The display device further includes a signal synchronizing member positioned on a side of the optical film group away from the display panel, and at least a part of the signal synchronizing member is positioned between the back frame and the optical film group. The signal synchronizing member receives a first signal while the touch control function layer receives a touch control signal, and a voltage difference between the first signal and the touch control signal maintains constant.

Abstract: This document discloses techniques, apparatuses, and systems for connecting semiconductor dies through traces. A semiconductor assembly is described that includes two semiconductor dies. The first semiconductor die includes a first dielectric layer at which first circuitry is disposed. The second semiconductor die includes a second dielectric layer at which second circuitry is disposed. One or more traces extend from a side surface of the first dielectric layer and at a side surface of the second dielectric layer to electrically couple the first circuitry and the second circuitry. In doing so, rigid connective structures may not be needed to couple the first semiconductor die and the second semiconductor die.

Abstract: A timestamp generation method and apparatus, and an electronic device and a storage medium, which are used for solving the technical problem of recorded information being easily leaked because a trusted third party is usually needed as a timestamp authority for recording in a traditional trusted timestamp generation method. In the present invention, the method comprises: acquiring a file record; calculating a hash value of the file record; sending the hash value to a random issuer, and receiving a signature result returned by the random issuer, wherein the signature result is generated after the random issuer signs the hash value and a receiving time, and the receiving time is the time when the random issuer receives the hash value; and storing the signature result in a blockchain as a timestamp of the file record.

Abstract: Memory-only cubes and methods of forming the same are disclosed herein. In one embodiment, a semiconductor device includes (i) a dielectric layer comprising a spin-on dielectric material, and (ii) a stack of semiconductor dies disposed on the dielectric layer. The spin-on dielectric material can be a photoimageable dielectric material. A first semiconductor die of the stack can be bonded to the dielectric layer, such as using a thermocompression bond or a hybrid bond. One or more interconnect structures can be formed in the dielectric layer, and external contacts can be disposed at a side of the dielectric layer opposite the stack of semiconductor dies. The one or more interconnect structures can extend through the dielectric layer and electrically couple the first semiconductor die to the external contacts.

Abstract: The present disclosure provides a heat dissipation film, a display module and a display apparatus. The heat dissipation film includes a metal layer, an adhesive layer, and a functional layer between the metal layer and the adhesive layer. The adhesive layer has a charge conduction property, and the functional layer has a stress buffering property. On at least one side of the heat dissipation film, an edge of at least one functional layer is retracted relative to an edge of the adhesive layer, such that after the heat dissipation film is bonded to a back film, the metal layer contacts the adhesive layer on the at least one side.

Abstract: Memory-only cubes and methods of forming the same are disclosed herein. In one embodiment, a semiconductor device includes a stack of semiconductor dies including a first semiconductor die and a second semiconductor die bonded to the first semiconductor die. A dielectric layer can be disposed on a side of the first semiconductor die opposite the second semiconductor die and can include a plurality of interconnect structures formed therein. The semiconductor device can lack a bondline between the first semiconductor die and the dielectric layer. The dielectric layer can comprise low-temperature silicon dioxide. One or more of the plurality of interconnect structures can extend at least partway through the dielectric layer. The semiconductor device can include external contacts formed on the interconnect structures. The dielectric layer can emulate an interface die or logic die of a high-bandwidth memory device.

Abstract: The present disclosure provides a lamination device and a lamination method, in the lamination device drives the first to-be-laminated film to move towards a direction close to the carrier film, gradually brings the first to-be-laminated film into contact with the second to-be-laminated film from the center to both ends, ultimately causing the first to-be-laminated film to be fully laminated with the second to-be-laminated film to form a to-be-laminated film group. The clamping fixture and the laminating mechanism move synchronously towards a direction close to the flexible laminating pad, such that the flexible laminating pad and the carrier film come into contact in sequence from the center to both ends, squeezing out the bubbles between the carrier film and the flexible laminating pad from both sides.

Abstract: A driving data collection method is disclosed, including: obtaining driving scenario requirement information (S203); determining at least one sensor on a vehicle based on the driving scenario requirement information (S204); and then, sending driving data collected by the at least one sensor to a network side device (S206).

Abstract: This document discloses techniques, apparatuses, and systems for providing a semiconductor device assembly with a substrate for vertically assembled semiconductor dies. A semiconductor assembly is described that includes a semiconductor die coupled to a substrate such that an active surface of the semiconductor die is substantially orthogonal to a top surface of the substrate. The substrate includes a surface having a recessed slot at which a side surface of the semiconductor die couples. The semiconductor die includes a contact pad that couples to a contact pad at the recessed slot. In doing so, the techniques, apparatuses, and systems herein enable a robust and cost-efficient semiconductor device to be assembled.