Abstract: The present invention discloses a lens control device and a control method thereof, a lens driver and a control method thereof, and a follow focus control system. The lens control device includes adjusting members. The control method of the lens control device includes: upon detecting a change of position data of any one adjusting member, acquiring current position data of the adjusting member and a matching identification corresponding to the adjusting member; and generating and wirelessly transmitting an adjustment signal based on the acquired position data and the matching identification, the adjustment signal containing the matching identification, the matching identification being provided for a lens driver that receives the adjustment signal to perform a match verification. The technical solution of the present invention effectively prevents the communication signals between the lens control device and the lens driver from being interfered with and improving control accuracy of the lens.

Abstract: A powder spreading device includes a device body, an adjustment assembly, and a dust removing mechanism. The adjustment assembly is provided on the device body. The adjustment assembly is configured to orient to a powder spreading surface. A first end of the dust removing mechanism is provided on the device body. The first end of the dust removing mechanism is covered over the adjustment assembly. A second end of the dust removing mechanism is communicated to the first end of the dust removing mechanism. The second end of the dust removing mechanism is configured to extend to the device body. A three-dimensional (3D) printing device and a 3D printing system are further provided.

Abstract: Provided are a display panel and a manufacturing method thereof and a display device. The display panel includes: a base substrate; a first planarization layer; a plurality of sub-pixels, a plurality of anodes of which being located on one side of the first planarization layer away from the base substrate; a pixel defining layer having a plurality of pixel openings; a planarization structure including a plurality of planarization portions, orthographic projection of each of the first group of pixel openings on the base substrate is a first orthographic projection, orthographic projections of an anode and a planarization portion corresponding to each of the first group of pixel openings on the base substrate are a second and a third orthographic projection respectively, and an overlapping portion of the first and second orthographic projections is located within the third orthographic projection.

Abstract: The present disclosure provides a method (200) in a network node. The method (200) includes: selecting (210) a number, N, of beams for data transmission to a terminal device, where N is an integer larger than one; transmitting (220) to the terminal device Channel State Information-Reference Signal, CSI-RS, having N ports using the N beams; receiving (230) from the terminal device a first measurement report containing a Rank Indicator, RI, obtained by the terminal device measuring the CSI-RS; and transmitting (240) data to the terminal device based on the RI using the N beams.

Abstract: An information processing method, an Ethernet switching chip and a storage medium are provided. The method includes: executing, by a master IP core, one of following operations: updating a global information table of the master IP core according to first information corresponding to the information processing request, and sending the first information to each slave IP core; updating a dedicated information table of the master IP core according to second information corresponding to the information processing request, or, sending, to a corresponding slave IP core, third information corresponding to the information processing request; or acquiring fourth information from the global information table or the dedicated information table of the master IP core based on the information processing request and sending the fourth information to a processor, or, acquiring fifth information from a corresponding slave IP core and sending the fifth information to the processor.

Abstract: A vehicle-road cooperation precise positioning method based on an electrified highway includes measuring position information of its own positioning point by using a roadside positioning module; determining absolute coordinates of all points on a communication line according to the position information; acquiring a contact signal when a vehicle-road connection information system comes into contact with the communication line, and determining position information of a contact point according to the contact signal and the absolute coordinates; and based on a conversion algorithm, determining current vehicle mass center position coordinate information according to the position information of the contact point and parameter information of the vehicle-road connection information system.

Abstract: A semiconductor device with a through via between redistribution layers is disclosed. The semiconductor device includes a stack of semiconductor dies coupled with first contact pads on a first redistribution layer. The first redistribution layer further includes a second contact pad located outside the footprint of the die stack and circuitry coupling the second contact pad to the first contact pads. A gap fill is disposed around the stack of semiconductor dies. A second redistribution layer is disposed at the stack of semiconductor dies and the gap fill. The second redistribution layer includes third contact pads coupled with the stack of semiconductor dies, a fourth contact pad disposed beyond the footprint of the stack of semiconductor dies, fifth contact pads opposite the third and fourth contact pads, and circuitry coupling the contact pads. A through via is disposed through the gap fill coupling the second and fourth contact pads.

Abstract: A semiconductor device with a spaced supply voltage and ground reference is disclosed. A stack of semiconductor dies includes a first semiconductor die, one or more second semiconductor dies, and first and second contacts. A gap fill is disposed over a distal end of the one or more second semiconductor dies opposite the first semiconductor die. A first rail (e.g., supply voltage) is disposed at a distal end of the gap fill opposite the first semiconductor die, and a first via extends from the first rail to the first contact. A layer of dielectric material is disposed at least partially over the first rail. A second rail (e.g., ground reference) is disposed at the layer of dielectric material, and a second via extends from the second rail to the second contact. Third and fourth exposed contacts are coupled to the first and second rails, respectively.

Abstract: A semiconductor device having monolithic conductive columns, and associated systems and methods, are disclosed herein. The semiconductor device can include a semiconductor die and a molding material. The semiconductor die may have a semiconductor substrate, a conductive pad, an opening, a non-conductive liner, and a plug of non-conductive material. The conductive pad may be at a surface of the semiconductor substrate. The opening may extend through the semiconductor substrate from the conductive pad to a second surface and define a side wall. The liner may coat the side wall and the plug may fill the opening. A second opening may be formed through the semiconductor device and the opening and a conductive material plated therein. The molding material may be laterally adjacent to the semiconductor die.

Abstract: Embodiments of this application provide an image processing method, a model training method, and an electronic device. The image processing method includes: shooting a first image and a second image for a motion scene in an alternating current lighting environment, where exposure duration of the first image is greater than exposure duration of the second image, and the exposure duration of the second image is less than an energy period of an alternating current; and inputting the first image and the second image to a trained image processing model, and outputting a target image by using the image processing model. In this way, an image without a stripe can be obtained through shooting for the motion scene in the alternating current lighting environment.

Abstract: A bond pad with micro-protrusions for direct metallic bonding. In one embodiment, a semiconductor device comprises a semiconductor substrate, a through-silicon via (TSV) extending through the semiconductor substrate, and a copper pad electrically connected to the TSV and having a coupling side. The semiconductor device further includes a copper element that projects away from the coupling side of the copper pad. In another embodiment, a bonded semiconductor assembly comprises a first semiconductor substrate with a first TSV and a first copper pad electrically coupled to the first TSV, wherein the first copper pad has a first coupling side. The bonded semiconductor assembly further comprises a second semiconductor substrate, opposite to the first semiconductor substrate, the second semiconductor substrate comprising a second copper pad having a second coupling side. A plurality of copper connecting elements extend between the first and second coupling sides of the first and second copper pads.

Abstract: A device authentication method and an apparatus are provided, to solve the problem of how to perform an authentication for the device in a UUDN. The method includes: obtaining, by a target access point (AP), a first timestamp sent by a local service center (LSC) device and a second timestamp sent by a terminal, where the second timestamp is sent by the LSC device to the terminal, and the first timestamp and the second timestamp are sent by the LSC device based on an AP switching event; when the first timestamp is consistent with the second timestamp, determining, by the target AP, that the terminal is an access terminal of the target AP.

Abstract: Embodiments of this application generally disclose a communication method and apparatus. The method is applied to an intelligent device, and the intelligent device includes a plurality of sensors. The method includes determining N target sensors from a plurality of sensors, where N is an integer greater than 1. The method also includes, correcting to respective second moments of the N target sensors to a first moment of a first clock. According to embodiments of this application, time of different sensors in the intelligent device can be synchronized, to improve an accuracy for a fusion of data collected by the different sensors.

Abstract: This application relates to the vibration control field, and in particular, to vibration control technologies in the field of new energy vehicles and intelligent vehicles, and discloses an air spring, a vibration isolation apparatus, a sensor assembly, a vibration isolation control method, and a vehicle. The air spring includes an airway and at least two air chambers, where the at least two air chambers include a first air chamber and a second air chamber, the first air chamber and the second air chamber are distributed at an interval along the airway, the first air chamber is connected to the airway by using a first control valve, and the second air chamber is connected to the airway by using a second control valve.

Abstract: Methods, apparatuses, and systems related to a semiconductor apparatus having one or more dielectric structures used to detect bonding voids during manufacturing. In some embodiments, a semiconductor wafer includes the dielectric structures. After the wafer is bonded to another structure, capacitances may be measured across the dielectric structures and the other wafer. The measured capacitance can be used to detect or characterize any bonding voids that may have been introduced during the wafer bonding process.

Abstract: A semiconductor device assembly is provided. The semiconductor device assembly includes a first semiconductor die and a second semiconductor die. The first semiconductor die has a first layer of dielectric material and a first conductive pad disposed in a first opening of the first layer of dielectric material. The second semiconductor die has a second layer of dielectric material facing the first layer of dielectric material and a second conductive pad disposed in a second opening of the second layer of dielectric material and corresponding to the first conductive pad. A spacer extends between the first layer of dielectric material and the second layer of dielectric material. A conductive material is disposed between the first conductive pad and the second conductive pad (e.g., through atomic layer deposition (ALD)) to implement an interconnect electrically coupling the first semiconductor die and the second semiconductor die.

Abstract: One example of a flexible battery includes an electrochemical cell layer and a wrapping layer that wraps the electrochemical cell layer. The flexible battery further includes an energy absorbing layer. The energy absorbing layer is located between the wrapping layer and upper and lower surfaces, which are opposite to each other, of the electrochemical cell layer. The energy absorbing layer includes a plurality of supporting parts that protrude outward from the upper or lower surface of the electrochemical cell layer. The plurality of supporting parts are mainly made of a foam material or rubber. For the energy absorbing layer, a lower-modulus buffering layer or an empty part may be further disposed between the electrochemical cell layer and the wrapping layer, to complement a wavy surface of the supporting part to form a flat surface, so as to meet diversified requirements of a wearable device.

Abstract: Disclosed are a material pushing apparatus and a charging method thereof, and a material pushing machine and a material pushing method thereof. The material pushing apparatus comprises a charger (200) and a material pushing machine (100), and when the material pushing machine moves to the position where the charger is located, the charger can automatically supplement electric energy to the material pushing machine, such that the automation level of the material pushing apparatus is improved.

Abstract: Generating a user timeline for an electronic device (ED) userData is collected that includes: location data; application data; and activity data. Occurrences of predetermined types of observed events are detected based on the collected data. For each detected occurrence a respective observed event record is stored that includes information about a time and type of the observed event. Planned event records, each including information about a time and type of a respective planned event, are stored for planned events that the user is scheduled to participate in, the planned event records. Events are predicted based on the observed event records and the planned event records. Information about observed, planned and predicted events are output on a timeline user interface based on observed event records, planned event records and predicted event records stored for the predicted events, respectively.

Abstract: A method, a device and a medium for genome graph analysis based on in-memory computing. The method comprises the following steps: firstly, combining a linear reference genome with genetic variation to construct a genome graph; then, generating indexes for a plurality of vertices of the genome graph, and constructing an index table according to the generated indexes; then dividing the read length into a plurality of substrings with the length of k-mer, and querying the index table to obtain a seed position, generating a reference subgraph according to the seed position, and identifying a candidate mapping position according to the reference subgraph to filter a candidate mapping area; finally, using a PUM mode to run approximate string matching between the read length and all unfiltered candidate mapping positions, so as to complete the optimal alignment of a reference gene sequence and a query gene sequence.