Patents by Inventor Wei Zou

Wei Zou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110069653
    Abstract: A method including sending a multicast packet to a cluster of recipients; receiving information indicating receiving status relating to the multicast packet from individual members of the cluster of recipients; and initiating intra-cluster retransmission of said multicast packet by sending to the cluster of recipients collective information about the receiving statuses of the members of the cluster of recipients.
    Type: Application
    Filed: September 23, 2010
    Publication date: March 24, 2011
    Applicant: Nokia Corporation
    Inventors: Haifeng Wang, Gang Wu, Wei Zou, Zhenhong Li
  • Patent number: 7898076
    Abstract: Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: March 1, 2011
    Assignee: International Business Machines Corporation
    Inventors: Bruce Furman, Madhusudan K. Iyengar, Paul A. Lauro, Yves Martin, Roger R. Schmidt, Da-Yuan Shih, Theodore G. Van Kessel, Wei Zou
  • Publication number: 20110044295
    Abstract: In accordance with an example embodiment of the present invention, an apparatus, comprising at least one processor; and at least one memory including computer program code, the at least one memory and the computer program code configured to, with the at least one processor, cause the apparatus to perform at least the following: select at least two relay stations from a plurality of relay stations; determine a transmission mode for cooperatively forwarding a data packet by the selected relay stations; schedule a resource allocation for the selected relay stations based at least in part on the transmission mode; and notify the selected relay stations of the resource allocation, is disclosed.
    Type: Application
    Filed: August 19, 2009
    Publication date: February 24, 2011
    Applicant: Nokia Corporation
    Inventors: Zhenhong Li, Gang Wu, Haifeng Wang, Wei Zou
  • Publication number: 20110013564
    Abstract: This invention provides a Mobile Station (MS) interworking with a Base Station (BS) which is compatible with a first protocol and a second protocol, the MS comprising: a synchronizing unit for synchronizing with the BS; a broadcast information obtaining unit for obtaining first protocol broadcast information from the BS; an operation mode selecting unit for selecting a first operation mode or a second operation mode according to whether the MS supports the first protocol or the second protocol, wherein when the MS supports the second protocol, second protocol MAP information is obtained according to the first protocol broadcast information, and data are transmitted via a prescribed channel to the BS according to the second protocol MAP information. Also, the present invention provides a method of MS network entry to communicate with a BS and a method of forming an IEEE 802.16m frame compatible with IEEE 802.16e frame. According to this invention, an IEEE 802.16e MS can access an IEEE 802.
    Type: Application
    Filed: March 7, 2008
    Publication date: January 20, 2011
    Inventors: Wei Zou, Gang shen, Jimin Liu, Wu Zheng
  • Publication number: 20100309792
    Abstract: A method and a device for data relay transmission in a wireless relay communication network are provided, in which, the relay station directly obtains corresponding egress CID related information based on input MAC PDUs, then generates output MAC PDUs including the egress CID related information, and at last, according to the egress CID related information, performs QoS scheduling for the output MAC PDUs, so as to output them in an sequence of QoS. The invention omits the steps of de-cascading, de-segmenting or de-capsulating the MAC PDUs in order to obtain MAC SDUs, and the steps of scheduling by category, cascading, segmenting, and encapsulating the MAC SDUs in order to re-generate the MAC PDUs in the prior art, and the invention simplifies the data processing procedure and achieves the goal of decreasing the relay latency.
    Type: Application
    Filed: January 17, 2008
    Publication date: December 9, 2010
    Inventors: Dongyao Wang, Wei Zou, Shan Jin
  • Publication number: 20100147497
    Abstract: The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.
    Type: Application
    Filed: February 23, 2010
    Publication date: June 17, 2010
    Inventors: BRUCE K. FURMAN, Sushumna Iruvanti, Paul A. Lauro, Yves C. Martin, Da Yuan Shih, Theodore G. Van Kessel, Wei Zou
  • Patent number: 7727447
    Abstract: A method to produce a product includes the steps of: providing a mold including an upper mold (40) and a lower mold (30), the upper mold defining a plurality of through holes (43); providing a metal piece (10), a hot melt adhesive, and a nonmetal cover layer (50) between the upper and lower molds, the hot melt adhesive arranged between the hot melt adhesive and the cover layer; closing the mold; heating the mold to melt the hot melt adhesive; conducting high-pressure gas into the mold via the through holes to press the cover layer toward the metal piece; opening the mold to pick up an intermediary product having the metal piece and the cover layer attached thereto by means of the adhesive; and applying a sealing layer (60) which joins corresponding free edges of the metal piece and the cover layer to the intermediary product through injection molding technology.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: June 1, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hai-Min Song, Shih-Ming Liu, Wei Zou, Wen-Che Chen, Hsin-Pei Chang
  • Patent number: 7694719
    Abstract: The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.
    Type: Grant
    Filed: January 4, 2007
    Date of Patent: April 13, 2010
    Assignee: International Business Machines Corporation
    Inventors: Bruce K. Furman, Sushumna Iruvanti, Paul A. Lauro, Yves C. Martin, Da Yuan Shih, Theodore G. Van Kessel, Wei Zou
  • Publication number: 20090313518
    Abstract: The present invention provides two primary Hybrid Automatic Repeat reQuest (HARQ) mechanisms for a multi-hop network, i.e. an active Mobile Multi-hop Relaying (MMR) HARQ and a passive Mobile Multi-hop Relaying (MMR) HARQ. According to the solution of the present invention, there are provided a method and a device for HARQ retransmission in relay stations of a wireless communication network, wherein in HARQ retransmission, the HARQ procedure is implemented based on resource allocated by a base station; and a method and device for HARQ in a base station, characterized in that a HARQ procedure is implemented in-between one or more relay stations and a mobile station. With the methods of the present invention, the HARQ problems existing in a multi-hop network are overcome, the correction rate of data transmission is improved, while time delay for data transmission is reduced.
    Type: Application
    Filed: August 27, 2007
    Publication date: December 17, 2009
    Applicant: Alcatel Lucent
    Inventors: Gang Shen, Jimin Liu, Jin Shan, Wei Ni, Wei Zou
  • Publication number: 20090287438
    Abstract: Techniques to achieve greater diagnostic speeds using relatively small fault dictionaries, such as dictionaries that are only slightly larger than so-called NFB dictionaries. This speed-up may be achieved by identifying a set of faults called hyperactive faults, and creating a dictionary for identifying those faults.
    Type: Application
    Filed: December 15, 2008
    Publication date: November 19, 2009
    Inventors: Wu-Tung Cheng, Huaxing Tang, Wei Zou, Manish Sharma
  • Publication number: 20090233942
    Abstract: Markers of the ACE, ATP5C3, BCL2L1, CYP2C9, DRD3, FOS, DTNBP1, GABRG3, GRIA4, LAMA4, MAPK1, NPY1R, OPRD1, OPRM1, PER3, PLCB1, PSMD1, ABI1, LOC402382, and NCALD genes, and their association with response to antidepressants are disclosed. Compositions and methods for detecting and using these markers in a variety of clinical applications are disclosed.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 17, 2009
    Inventors: Maria Athanasiou, Kerri Holick, Carol Reed, Benjamin Salisbury, Alessandro Serretti, Wei Zou
  • Patent number: 7563338
    Abstract: A method to produce a product includes the steps of: providing a mold including an upper mold (40) and a lower mold (30), the upper mold defining a plurality of through holes; providing a workpiece (10), a hot melt adhesive (25), and a cover layer (50) between the upper and lower molds, the hot melt adhesive arranged between the workpiece and the cover layer; providing a heater (20) to melt the hot melt adhesive; closing the mold; conducting high-pressure gas into the mold via the through holes to press the cover layer toward the workpiece; and opening the mold to pick up the product having the workpiece and the cover layer attached thereto by means of the adhesive.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: July 21, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hai-Min Song, Shih-Ming Liu, Wei Zou, Wen-Che Chen, Hsin-Pei Chang
  • Publication number: 20090141682
    Abstract: A method and system of controlling an audio switch at a receiving unit during handoff is disclosed herein. The method can include the step of—at a receiving unit with an audio call active on a first network supporting a first audio protocol—setting up a second audio call on a second network supporting a different audio protocol. The method can further include the steps of monitoring for one or more events, detecting one or more of the events, and in response to the detection of one or more of the events, switching an audio path of the receiving unit from the first network to the second network.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 4, 2009
    Applicant: MOTOROLA, INC.
    Inventors: WEI ZOU, ROBERT A. CORDES, XIANG-MING LI, JERRY J. MAHLER, YINGCHUNG XU
  • Publication number: 20090097434
    Abstract: The present invention discloses a frame constructing method for use in a multi-hop wireless access network, the method comprising the steps of: determining Relay Stations (RSs) and Mobile Stations (MSs); setting a DL sub-frame; setting an UL sub-frame; and constructing a completed frame based on the UL sub-frame and the DL sub-frame; wherein the step of setting the DL sub-frame comprises a step of setting a DL relay sub-frame field for DL relay information sent to the RS; and the step of setting the UL sub-frame comprises a step of setting an UL relay sub-frame field for UL relay information sent from the RS. The present invention further discloses a corresponding frame processing method and a device, base station, relay station and system for implementing the method. According to the present invention, the synchronization in the whole network system is ensured, and the handover operation when the MS moves is simplified.
    Type: Application
    Filed: April 27, 2007
    Publication date: April 16, 2009
    Applicant: Alcatel Lucent
    Inventors: Xiaobing Leng, Kaibin Zhang, Gang Shen, Wei Zou
  • Publication number: 20090097433
    Abstract: The present invention is directed to provide a relay method in a wireless access system, including comprising the following steps: in downlink direction, receiving downlink data from a base station, wherein the downlink data include control information for relay operation; constructing downlink data to be retransmitted; retransmitting the constructed downlink data to wireless communication terminals according to a profile specified by the control information; and, in uplink direction, receiving uplink data from the wireless communication terminals according to a profile specified by the control information; recovering the uplink data of the wireless communication terminals; and retransmitting the uplink data to the base station according to the profile specified by the control information. The present invention further provides the corresponding base station device, relay device and wireless relay system.
    Type: Application
    Filed: April 27, 2007
    Publication date: April 16, 2009
    Applicant: Alcatel Lucent
    Inventors: Gang Shen, Wei Zou, Jiang Qi, Jimin Liu
  • Publication number: 20090088164
    Abstract: The present invention provides a handover control method in a wireless access system, a relay station and a base station for performing handover control in a mobile multi-hop relay wireless access system such that the wireless access system is enabled to cover a wider area. To achieve the above object, the present invention provides a handover control method in a wireless access system, wherein the wireless access system comprises a mobile station and a base station, which receive and send message via a wireless channel, and further comprises a relay station for forwarding message from the mobile station and the base station under control of the base station, characterized in that the method comprising a relay station measure and arbitration step in which the relay station measures the message and arbitrates whether to relay the message, and a base station measure and handover step in which the base station measures the message and arbitrates whether to perform handover.
    Type: Application
    Filed: April 28, 2007
    Publication date: April 2, 2009
    Applicant: ALCATEL LUCENT
    Inventors: Gang Shen, Wei Ni, Wei Zou, Shan Jin
  • Publication number: 20090088165
    Abstract: A method for extending a coverage of a base station in a wireless communication network is disclosed, characterized in that a relay station transfers control information and communication related information between the base station and the mobile station according to an indication of the base station.
    Type: Application
    Filed: April 17, 2007
    Publication date: April 2, 2009
    Inventors: Gang Shen, Ni Wei, Wei Zou, Jimin Liu, Shan Jin
  • Patent number: 7494951
    Abstract: The present invention relates to a process for the manufacture of catalysts used for producing para-xylene by toluene shape selective alkylation. The invention is primarily used for solving the problems in the old technology, e.g., high requirements on the environment and great treatment of waste water containing organic amines when synthesizing ZSM-5 molecular sieves by using an organic amine as the template agent; small and non-homogeneous particles of the molecular sieves when synthesizing ZSM-5 molecular sieves by using an alcohol or ether as the template agent, such that the catalyst prepared thereby has low catalytic selectivity and low toluene conversion rate, etc. Said problems are better solved in the present invention by synthesizing ZSM-5 molecular sieves using the combination of organic amines and alcohols or ethers as the template agents (having a weight ratio of organic amines/alcohols=0.05-150, and organic amines/ethers=0.05-150), and modifying with organosilicon so as to obtain the catalysts.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: February 24, 2009
    Assignees: China Petroleum & Chemical Corporation, Shanghai Research Institute of Petrochemical Technology Sinopec
    Inventors: Zhirong Zhu, Dejin Kong, Weimin Yang, Qingling Chen, Wei Zou, Wei Li, Min Hou, Deqin Yang
  • Publication number: 20080299707
    Abstract: A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.
    Type: Application
    Filed: December 13, 2007
    Publication date: December 4, 2008
    Applicant: International Business Machines Corporation
    Inventors: David L. Edwards, Sushumna Iruvanti, Hilton T. Toy, Wei Zou
  • Publication number: 20080265404
    Abstract: Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Applicant: International Business Machines Corporation
    Inventors: Bruce Furman, Madhusudan K. Iyengar, Paul A. Lauro, Yves Martin, Roger R. Schmidt, Da-Yuan Shih, Theodore G. Van Kessel, Wei Zou