Patents by Inventor Weibo DONG

Weibo DONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High speed camera interface PCB floor plan for autonomous vehicles
    Patent number: 12666532
    Abstract: A printed circuit board (PCB) includes one or more signal layers in between a first surface and a second surface, the one or more signal layers including a first signal layer. The PCB includes a connector interface disposed on the first surface and a first signal via electrically coupled to the connector interface. The PCB includes first transmission line disposed at the first signal layer electrically coupling a first location to a second location of the first signal layer and a second signal via disposed at the second location. The PCB includes a power-over-cable circuit disposed on the first surface and electrically coupled to the second signal via and a receiver circuit disposed on the first surface adjacent to the power-over-cable circuit. The PCB includes a second transmission line disposed on the first surface layer electrically coupling the power-over-cable circuit to the receiver circuit.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: June 23, 2026
    Assignees: APOLLO AUTONOMOUS DRIVING USA LLC, BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
    Inventors: Yun Ji, Zhenwei Yu, Yuming Wang, Weibo Dong
  • HIGH SPEED CAMERA INTERFACE PCB FLOOR PLAN FOR AUTONOMOUS VEHICLES
    Publication number: 20250081336
    Abstract: A printed circuit board (PCB) includes one or more signal layers in between a first surface and a second surface, the one or more signal layers including a first signal layer. The PCB includes a connector interface disposed on the first surface and a first signal via electrically coupled to the connector interface. The PCB includes first transmission line disposed at the first signal layer electrically coupling a first location to a second location of the first signal layer and a second signal via disposed at the second location. The PCB includes a power-over-cable circuit disposed on the first surface and electrically coupled to the second signal via and a receiver circuit disposed on the first surface adjacent to the power-over-cable circuit. The PCB includes a second transmission line disposed on the first surface layer electrically coupling the power-over-cable circuit to the receiver circuit.
    Type: Application
    Filed: December 29, 2022
    Publication date: March 6, 2025
    Inventors: Yun JI, Zhenwei YU, Yuming WANG, Weibo DONG