Abstract: A switching module includes a substrate, a switching element, a first control part, a second control part, a first power part and a second power part. The switching element is disposed on the substrate. The switching element includes a first control terminal, a second control terminal, a first power terminal and a second power terminal. The first control part is connected with the first control terminal of the switching element. The second control part is connected with the second control terminal of the switching element. A projection area of the first control part on a reference plane intersects with a projection area of the second control part on the reference plane at one or more first intersections. The first power part is connected with the first power terminal of the switching element. The second power part is connected with the second power terminal of the switching element.

Abstract: A driving circuit for driving a switch element, which includes a control terminal, a first power terminal and a second power terminal. The second power terminal receives a first voltage. The driving circuit includes a switching circuit, a first unidirectional switch and a first capacitor. The switching circuit receives a first signal. The switching circuit is electrically connected with a first voltage terminal and a ground terminal. The first voltage terminal receives a second voltage. A voltage at the output terminal is switched between the second voltage and a ground voltage. A first terminal of the first unidirectional switch receives a third voltage. A first terminal of the first capacitor is connected with the output terminal of the switching circuit. A second terminal of the first capacitor is connected with a second terminal of the first unidirectional switch and the control terminal of the first switch element.

Abstract: A switching module includes at least one substrate, at least one switching element, at least one control loop, a first power part and a second power part. The at least one switching element is disposed on the at least one substrate. The at least one control loop is connected with the corresponding switching element. The first power part is connected with the corresponding switching element. The second power part is connected with the corresponding switching element. A direction of a first current flowing through the first power part and a direction of a second current flowing through the second power part are identical. A projection of the first power part on a reference plane and a projection of the second power part on the reference plane are located at two opposite sides of a projection of the control loop on the reference plane.

Abstract: A switching module includes a substrate, a switching element, a first control part, a second control part, a first power part and a second power part. The switching element is disposed on the substrate. The switching element includes a first control terminal, a second control terminal, a first power terminal and a second power terminal. The first control part is connected with the first control terminal of the switching element. The second control part is connected with the second control terminal of the switching element. A projection area of the first control part on a reference plane intersects with a projection area of the second control part on the reference plane at one or more first intersections. The first power part is connected with the first power terminal of the switching element. The second power part is connected with the second power terminal of the switching element.

Abstract: A power module assembly is disclosed and includes a package body, a first wiring layer, a capacitor, and a system bus set. The package body includes a first surface, a second surface and two switches connected in series to form a bridge arm between the first surface and the second surface. The first wiring layer is disposed on the first surface. The capacitor is connected in parallel with the bridge arm to form a first high-frequency loop. The system bus set includes a positive-electrode bus and a negative-electrode bus fanned out from the first surface, respectively. The projection of the positive-electrode bus or/and the negative-electrode bus on the first surface is at least partially overlapped with the projection of the two switches on the first surface. The bridge arm is electrically connected between the positive-electrode bus and the negative-electrode bus to form a second high-frequency loop.

Abstract: A power module is disclosed. The power module includes a carrier board, two switches, at least one metal block, a clamping component and a metal conductive component. The carrier board includes an upper surface and a lower surface. The two switches are disposed on the upper surface and connected in series to form a bridge arm electrically connected between a positive terminal and a negative terminal. The metal block is electrically connected to the two switches. The clamping component is disposed on the upper surface and electrically connected in parallel with the bridge arm through the carrier board. The metal conductive component is connected from a common node of the two switches to an output terminal. The metal conductive component is located at a side of the two switches facing away from the upper surface.

Abstract: A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.

Abstract: A power module is disclosed. The power module includes a carrier board, two switches, at least one metal block, a clamping component and a metal conductive component. The carrier board includes an upper surface and a lower surface. The two switches are disposed on the upper surface and connected in series to form a bridge arm electrically connected between a positive terminal and a negative terminal. The metal block is electrically connected to the two switches. The clamping component is disposed on the upper surface and electrically connected in parallel with the bridge arm through the carrier board. The metal conductive component is connected from a common node of the two switches to an output terminal. The metal conductive component is located at a side of the two switches facing away from the upper surface.

Abstract: A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.

Abstract: A power module assembly is disclosed and includes a package body, a first wiring layer, a capacitor, and a system bus set. The package body includes a first surface, a second surface and two switches connected in series to form a bridge arm between the first surface and the second surface. The first wiring layer is disposed on the first surface. The capacitor is connected in parallel with the bridge arm to form a first high-frequency loop. The system bus set includes a positive-electrode bus and a negative-electrode bus fanned out from the first surface, respectively. The projection of the positive-electrode bus or/and the negative-electrode bus on the first surface is at least partially overlapped with the projection of the two switches on the first surface. The bridge arm is electrically connected between the positive-electrode bus and the negative-electrode bus to form a second high-frequency loop.

Abstract: The present invention provides a glycopeptide compound or pharmaceutically acceptable salt thereof as shown in Formula (I) or (II), and a method for preparing same, and pharmaceutical compositions and applications thereof, wherein the definition of R1, R2, R3, R4, R5 is the same as that of the specification. The glycopeptide compound of the present invention has in-vitro antibacterial activity and has important significance for development of new antibacterial agents.

Abstract: The present invention provides a method for preparing an intermediate compound of sitagliptin represented by formula I. The preparation method comprises: dissolving a compound represented by formula II into an organic solvent; and under the catalysis of fatty acid and effect of chlorosilane, performing a reduction reaction of carbon-carbon double bonds, so as to obtain the intermediate compound of sitagliptin represented by formula I, R being methyl or formoxyl. The preparation method of the present invention avoids precious metal as a catalyst, and accordingly, the cost is low, the post-treatment is simple, the product has a high yield, chemical purity and optical purity, and de % is greater than 99.6%, and the preparation method can be used in synthesis of sitagliptin and is suitable for industrial production.

Abstract: The present invention provides a method for preparing an intermediate compound of sitagliptin represented by formula I. The preparation method comprises: dissolving a compound represented by formula II into an organic solvent; and under the catalysis of fatty acid and effect of chlorosilane, performing a reduction reaction of carbon-carbon double bonds, so as to obtain the intermediate compound of sitagliptin represented by formula I, R being methyl or formoxyl. The preparation method of the present invention avoids precious metal as a catalyst, and accordingly, the cost is low, the post-treatment is simple, the product has a high yield, chemical purity and optical purity, and de % is greater than 99.6%, and the preparation method can be used in synthesis of sitagliptin and is suitable for industrial production.

Abstract: The present invention provides a glycopeptide compound or pharmaceutically acceptable salt thereof as shown in Formula (I) or (II), and a method for preparing same, and pharmaceutical compositions and applications thereof, wherein the definition of R1, R2, R3, R4, R5 is the same as that of the specification. The glycopeptide compound of the present invention has in-vitro antibacterial activity and has important significance for development of new antibacterial agents.

Abstract: A kind of quinoline compounds as formula A, pharmaceutical accepted solvates, optical isomers or polymorphisms thereof. The intermediates of formula D. in which, R1, R2 and R3 is independently H, halo or the subustitents of formula H, in which, R is H, halo, C1˜C4alkyl, C1˜C4alkoxyl. The preparation methods and the uses for the manufacture of a medicament of inhibiting the HMG CoA reductase and treating the diseases relating to the high blood fat. Compared with the fluvastatin, rosuvatatin, pitavastatin disclosed in the prior arts, present quinoline compounds have better activity of inhibiting HMG CoA reductase. Present quinoline compounds can be used for treating the diseases relating to the high blood fat.

Abstract: The present invention discloses a quinoline compound represented by the formula A or pharmaceutically acceptable solvate, optical isomer or polymorph thereof, wherein X is S or O; M is H, Na+, NH4+ or Ca2+; each of R1, R2 and R3 is independently H, halogen, the group represented by formula D or formula E; R is H, halogen, C1˜C4 alkyl or C1˜C4 alkoxy. The present invention also discloses its pharmaceutical composition and the preparation method thereof and application in manufacturing a medicament for inhibiting HMG-CoA reductase or for the treatment and prophylaxis of the diseases which can be treated effectively by inhibiting HMG-CoA reductase. The quinloline compound and pharmaceutical composition thereof of the present invention have an excellent lipid reduction effect in vivo and can be applied for treatment of a hyperlipidemia-related disease.

Abstract: A kind of quinoline compounds as formula A, pharmaceutical accepted solvates, optical isomers or polymorphisms thereof. The intermediates of formula D. in which, R1, R2 and R3 is independently H, halo or the subustitents of formula H, in which, R is H, halo, C1˜C4alkyl, C1˜C4alkoxyl. The preparation methods and the uses for the manufacture of a medicament of inhibiting the HMG CoA reductase and treating the diseases relating to the high blood fat. Compared with the fluvastatin, rosuvatatin, pitavastatin disclosed in the prior arts, present quinoline compounds have better activity of inhibiting HMG CoA reductase. Present quinoline compounds can be used for treating the diseases relating to the high blood fat.

Abstract: The present invention discloses a quinoline compound represented by the formula A or pharmaceutically acceptable solvate, optical isomer or polymorph thereof, wherein X is S or O; M is H, Na+, NH4+ or Ca2+; each of R1, R2 and R3 is independently H, halogen, the group represented by formula D or formula E; R is H, halogen, C1˜C4 alkyl or C1˜C4 alkoxy. The present invention also discloses its pharmaceutical composition and the preparation method thereof and application in manufacturing a medicament for inhibiting HMG-CoA reductase or for the treatment and prophylaxis of the diseases which can be treated effectively by inhibiting HMG-CoA reductase. The quinloline compound and pharmaceutical composition thereof of the present invention have an excellent lipid reduction effect in vivo and can be applied for treatment of a hyperlipidemia-related disease.