Patents by Inventor WEI CHIH LEE

WEI CHIH LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8707547
    Abstract: A lead-frameless power inductor and its fabrication method are disclosed. The power inductor comprises a lower substrate, a coil provided on the lower substrate, and an intermediate layer which encloses the coil, wherein the lower substrate can be a soft magnetic entrainer or a non-magnetic entrainer. The coil is made of an insulated wire, and the intermediate layer is a colloid consisting of magnetic powder. A method for fabricating the lead-frameless power inductor includes steps of preparing a lower substrate; forming a plurality of conducting metal layers on the lower substrate; forming a wire package on an upper surface of said lower substrate; coating a surface of said wire package with a magnetic powder; dividing the substrate into a plurality of granulated elements by cutting process; and forming the conducting metal layer on both sides of the element to form a surface mounting device.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: April 29, 2014
    Assignee: Inpaq Technology Co., Ltd.
    Inventor: Wei Chih Lee
  • Publication number: 20130062656
    Abstract: A thermally enhanced optical package includes a heat conducting module configured to dissipate the heat generated from an optical device, a plurality of insulating pads disposed on a heat conducting substrate, and at least one electrical conducting pad disposed on the insulating pads. The heat conducting module includes a heat conducting substrate and a plurality of heat conducting pillars, and the optical device is a light emitting diode chip or a light emitting diode die in the present embodiments. The thermally enhanced optical package is further characterized in a simple manufacturing procedure, including substantially an electrical or electroless plating process, a metal foil laminating process, a thick film printing process, and a patterning and etching process.
    Type: Application
    Filed: September 13, 2011
    Publication date: March 14, 2013
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: WEI CHIH LEE, SHIH KWAN LIU, HUAI LUH CHANG
  • Publication number: 20120281338
    Abstract: An aluminum electrolytic capacitor includes an aluminum foil substrate, a porous aluminum layer, an insulating layer, an electrically conductive polymer material, an electrically conductive material, and at least two terminal electrodes. The porous aluminum layer is attached to the aluminum foil substrate. The insulating layer is formed on the porous aluminum layer. The electrically conductive polymer material overlays the insulating layer. The terminal electrodes respectively connect to the aluminum foil and the electrically conductive material.
    Type: Application
    Filed: May 5, 2011
    Publication date: November 8, 2012
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: WEI CHIH LEE, SHIH KWAN LIU