Abstract: A light guide element includes first and second surfaces, a light-incident surface, and microstructure groups arranged on the first surface. Each microstructure group includes a first microstructure and a second microstructure separated from and being mirror image structures of each other. A first intersection line is provided between a first light-receiving surface of the first microstructure and the first surface. A first distance is provided between the first intersection line and a light-incident intersection line in a first direction. A second intersection line is provided between a second light-receiving surface of the second microstructure and the first surface. A second distance is provided between the second intersection line and the light-incident intersection line in the first direction. A variation trend of the first distance in a second direction is opposite to a variation trend of the second distance in the second direction.

Abstract: A light guide element includes first and second surfaces, a light-incident surface, and microstructure groups arranged on the first surface. Each microstructure group includes a first microstructure and a second microstructure separated from and being mirror image structures of each other. A first intersection line is provided between a first light-receiving surface of the first microstructure and the first surface. A first distance is provided between the first intersection line and a light-incident intersection line in a first direction. A second intersection line is provided between a second light-receiving surface of the second microstructure and the first surface. A second distance is provided between the second intersection line and the light-incident intersection line in the first direction. A variation trend of the first distance in a second direction is opposite to a variation trend of the second distance in the second direction.

Abstract: A light source module includes a light guide plate, a light-emitting element, and first and second prism sheets. One of the light-emitting surface and the bottom surface of the light guide plate has strip-shaped microstructures. The bottom surface has bottom microstructures, and the angle between the first surface of each bottom microstructure and the bottom surface is 1° to 17°. The first prism sheet is disposed on the light-emitting surface and between the light-emitting surface and the second prism sheet and includes first prism rods. The second prism sheet includes second prism rods. The aspect ratio of the strip-shaped microstructure is greater than 0.2. The angle between the maximum luminance direction of the light from the light-emitting surface and the normal direction of the light-emitting surface is less than 70°. The light-emitting angle range is less than 40°. A display device including the light source module is also provided.

Abstract: A light source module includes a light guide plate, a light-emitting element, and first and second prism sheets. One of the light-emitting surface and the bottom surface of the light guide plate has strip-shaped microstructures. The bottom surface has bottom microstructures, and the angle between the first surface of each bottom microstructure and the bottom surface is 1° to 17°. The first prism sheet is disposed on the light-emitting surface and between the light-emitting surface and the second prism sheet and includes first prism rods. The second prism sheet includes second prism rods. The aspect ratio of the strip-shaped microstructure is greater than 0.2. The angle between the maximum luminance direction of the light from the light-emitting surface and the normal direction of the light-emitting surface is less than 70°. The light-emitting angle range is less than 40°. A display device including the light source module is also provided.

Abstract: A backlight module includes a light guide plate, a light source, multiple first optical microstructures, and multiple second optical microstructures. The first optical microstructures and the second optical microstructures are disposed on the bottom surface of the light guide plate. Each of the first optical microstructures has a first light receiving surface facing the light source. Each of the second optical microstructures has a second light receiving surface facing the light source. A first angle is included between the first light receiving surface and the bottom surface. A second angle is included between the second light receiving surface and the bottom surface. The second angle is different from the first angle. A display apparatus adopting the backlight module is also provided.

Abstract: An illumination apparatus includes a light guide plate having a plurality of first and second diffusion net points formed on a surface of a light transmissive substrate, and at least one light emitting element disposed to emit light into a light incident surface of the light guide plate. A portion of the first diffusion net points at least partially overlaps the second diffusion net points, and the size of the first diffusion net points is smaller than the size of the second diffusion net points.

Abstract: A light plate includes a light guide plate and four light source modules. The light source modules are disposed around the light guide plate. Each of the light source modules includes a first white light emitting element and a second white light emitting element. The first white light emitting element is capable of emitting a first white beam. The second white light emitting element disposed beside the first white light emitting element is capable of emitting a second white beam. The first white light emitting elements of the light source modules are mirror-symmetrical with respect to a first reference plane and a second reference plane. The second white light emitting elements of the light source modules are mirror-symmetrical with respect to the first reference plane and the second reference plane. The correlated color temperature (CCT) of the first white beam is greater than the CCT of the second white beam.

Abstract: An illumination apparatus includes a light guide plate, a first light source module, and a second light source module. The light guide plate has a first incident surface and a second incident surface opposite to the first incident surface. The first and the second light source modules provide light beams into the first and the second incident surfaces, respectively. The first light source module includes at least one first white light emitting diode (LED) and at least one second white LED neighboring with each other. The first and the second white LEDs have different color temperatures. The second light source module includes at least one third white LED and at least one forth white LED neighboring with each other. The third and the forth white LEDs have different color temperatures. The third and the forth white LEDs are located corresponding to the second and the first white LEDs, respectively.

Abstract: An illumination apparatus includes a light guide plate and at least one light emitting element. The light guide plate includes a light transmissive substrate, a plurality of first diffusion net points, and a plurality of second diffusion net points. The light transmissive substrate has a first surface, a second surface opposite to the first surface, and a light incident surface connecting the first surface and the second surface. The first diffusion net points and the second diffusion net points are disposed on the second surface. A portion of the first diffusion net points at least partially overlaps the second diffusion net points. The size of the first diffusion net points is smaller than the size of the second diffusion net points. The light emitting element is disposed beside the light incident surface and capable of emitting a light beam. A light guide plate is also provided.

Abstract: An electric connection structure and a method for fabricating the same are provided. The present invention provides a fixing thread fixed to a substrate and disposed on an upper surface of the substrate. The fixing thread is fixed to the substrate by shuttling between, binding, or penetrating through the upper surface and the bottom surface of the substrate. And then, a bare end of a signal line is fixed to the upper surface of the substrate by welding a solder thereby. When the solder is cooled down to solidify, the fixing thread generates a pull force applied on the solder pulling the solder toward the upper surface of the substrate.

Abstract: A light plate includes a light guide plate and four light source modules. The light source modules are disposed around the light guide plate. Each of the light source modules includes a first white light emitting element and a second white light emitting element. The first white light emitting element is capable of emitting a first white beam. The second white light emitting element disposed beside the first white light emitting element is capable of emitting a second white beam. The first white light emitting elements of the light source modules are mirror-symmetrical with respect to a first reference plane and a second reference plane. The second white light emitting elements of the light source modules are mirror-symmetrical with respect to the first reference plane and the second reference plane. The correlated colour temperature (CCT) of the first white beam is greater than the CCT of the second white beam.

Abstract: An illumination apparatus includes a light guide plate, a first light source module, and a second light source module. The light guide plate has a first incident surface and a second incident surface opposite to the first incident surface. The first and the second light source modules provide light beams into the first and the second incident surfaces, respectively. The first light source module includes at least one first white light emitting diode (LED) and at least one second white LED neighboring with each other. The first and the second white LEDs have different color temperatures. The second light source module includes at least one third white LED and at least one forth white LED neighboring with each other. The third and the forth white LEDs have different color temperatures. The third and the forth white LEDs are located corresponding to the second and the first white LEDs, respectively.

Abstract: A coating for converting optical spectrum includes: a transparent colloid layer and an emitter material unit. The emitter material unit is used to convert one part of a short-wavelength band of a light source into a long-wavelength band. The emitter material unit has at least one first emitter body and at least one second emitter body both mixed with the transparent colloid layer, the at least one first emitter body is an inorganic silicate compound, and the at least one second emitter body is an organic dye. Hence, the color rendering index (CRI) and the range of color temperature of white light generated by an LED chip package module using the coating are increased according to the function of the emitter material unit for converting one part of a short-wavelength band of a light source into a long-wavelength band.

Abstract: A coating for converting optical spectrum includes: a transparent colloid layer and an emitter material unit. The emitter material unit is used to convert one part of a short-wavelength band of a light source into a long-wavelength band. The emitter material unit has at least one first emitter body and at least one second emitter body both mixed with the transparent colloid layer, the at least one first emitter body is an inorganic silicate compound, and the at least one second emitter body is aan organic dye. Hence, the color rendering index (CRI) and the range of color temperature of white light generated by an LED chip package module using the coating are increased according to the function of the emitter material unit for converting one part of a short-wavelength band of a light source into a long-wavelength band.

Abstract: A new structure is provided to replace the existing common planar capacitor structure used in printed circuit boards. The conventional common planar capacitor structure utilizes a single dielectric layer and embedded capacitors with different capacitances are achieved by adjusting the sizes of the embedded capacitors' conductive terminals. Since general applications usually require capacitors whose capacitance range covers several orders of magnitude, these embedded capacitors have significant differences in terms of their conductive terminals' sizes. This will make the manufacturing process more complicated and difficult. The new structure combines inorganic material having a specific dielectric constant and polymer having another specific dielectric constant into a singulated non-overlapping coplanar capacitor structure that is easy to manufacture and provides better precision.

Abstract: A new structure is provided to replace the existing common planar capacitor structure used in printed circuit boards. The common planar capacitor structure utilizes a single dielectric layer and embedded capacitors with different capacitances achieved by adjusting the sizes of the embedded capacitors' conductive terminals. Since general applications usually require capacitors whose capacitance range covers several orders of magnitude, these embedded capacitors have significant differences in terms of their conductive terminals' sizes. This will make the manufacturing process more complicated and difficult. The new structure combines inorganic material having a specific dielectric constant and polymer having another specific dielectric constant into a singulated coplanar capacitor structure.

Abstract: A new structure is provided to replace the existing common planar capacitor structure used in printed circuit boards. The common planar capacitor structure utilizes a single dielectric layer and embedded capacitors with different capacitances are achieved by adjusting the sizes of the embedded capacitors' conductive terminals. Since general applications usually require capacitors whose capacitance range covers several orders of magnitude, these embedded capacitors have significant differences in terms of their conductive terminals' sizes. This will make the manufacturing process more complicated and difficult. The new structure combines inorganic material having a specific dielectric constant and polymer having another specific dielectric constant into a singulated coplanar capacitor structure.

Abstract: A structure and a method of a substrate with built-in via hole resistors are disclosed. The substrate structure includes a core layer made of insulating material and a plurality of via holes for filling with polymer thick film resistor. After the via holes are filled with PTFR, a solder ball or a pad is formed on both ends of the via hole to provide electrical conductivity.

Abstract: A process is disclosed for forming resistors on a printed circuit substrate. The method includes the step of applying a photoresist layer onto substrate, and forming openings in the photoresist layer to expose the preselected regions for resistors, such that polymer thick resist pastes as well as resistive metallic films can be applied onto the substrate through these openings with precise geometry. The process according to the invention has higher accuracy and greater processing flexibility than the prior art processes where the resistor pastes are directly applied onto the substrate by screen printing.