Patents by Inventor Weifan Wang

Weifan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METALLIZED FILM-OVER-FOAM CONTACTS
    Publication number: 20150382481
    Abstract: A contact suitable for circuit grounding of surface mount technology devices generally includes a resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.
    Type: Application
    Filed: September 3, 2015
    Publication date: December 31, 2015
    Inventors: Weifan Wang, Yi-Shen Lin, Larry D. Creasy, JR.
  • Metallized film-over-foam contacts
    Patent number: 9131616
    Abstract: A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: September 8, 2015
    Assignee: Laird Technologies, Inc.
    Inventors: Weifan Wang, Yi-Shen Lin, Larry D. Creasy, Jr.
  • METALLIZED FILM-OVER-FOAM CONTACTS
    Publication number: 20140203069
    Abstract: A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.
    Type: Application
    Filed: March 19, 2014
    Publication date: July 24, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: Weifan Wang, Yi-Shen Lin, Larry D. Creasy, JR.