Abstract: A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al interlayer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.

Abstract: A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.

Abstract: A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.

Abstract: A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al interlayer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.

Abstract: Aluminum or aluminum alloy sputter targets and methods of making same are provided. The pure aluminum or aluminum alloy is mechanically worked to produce a circular blank, and then the blank is given a recrystallization anneal to achieve desirable grain size and crystallographic texture. A 10-50% additional strain is provided to the blank step after the annealing to increase the mechanical strength. Further, in a flange area of the target, the strain is greater than in the other target areas with the strain in the flange area being imparted at a rate of about 20-60% strain. The blank is then finished to form a sputtering target with desirable crystallographic texture and adequate mechanical strength.

Abstract: A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.

Abstract: A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al inter-layer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.

Abstract: Aluminum or aluminum alloy sputter targets and methods of making same are provided. The pure aluminum or aluminum alloy is mechanically worked to produce a circular blank, and then the blank is given a recrystallization anneal to achieve desirable grain size and crystallographic texture. A 10-50% additional strain is provided to the blank step after the annealing to increase the mechanical strength. Further, in a flange area of the target, the strain is greater than in the other target areas with the strain in the flange area being imparted at a rate of about 20-60% strain. The blank is then finished to form a sputtering target with desirable crystallographic texture and adequate mechanical strength.

Abstract: Aluminum or aluminum alloy sputter targets and methods of making same are provided. The pure aluminum or aluminum alloy is mechanically worked to produce a circular blank, and then the blank is given a recrystallization anneal to achieve desirable grain size and crystallographic texture. A 10-50% additional strain is provided to the blank step after the annealing to increase the mechanical strength. Further, in a flange area of the target, the strain is greater than in the other target areas with the strain in the flange area being imparted at a rate of about 20-60% strain. The blank is then finished to form a sputtering target with desirable crystallographic texture and adequate mechanical strength.

Abstract: Aluminum or aluminum alloy sputter targets and methods of making same are provided. The pure aluminum or aluminum alloy is mechanically worked to produce a circular blank, and then the blank is given a recrystallization anneal to achieve desirable grain size and crystallographic texture. A 10-50% additional strain is provided to the blank step after the annealing to increase the mechanical strength. Further, in a flange area of the target, the strain is greater than in the other target areas with the strain in the flange area being imparted at a rate of about 20-60% strain. The blank is then finished to form a sputtering target with desirable crystallographic texture and adequate mechanical strength.

Abstract: Superfine powders composed of mineral materials selected from the group consisting of talc, calcium carbonate, zeolite, clay, aluminum hydroxide, aluminum silicate, iron oxide and magnesium oxide are claimed. Such powders are produced when the subject mineral material is combined with a dry separation agent such as sodium chloride and ground for a sufficient time to produce the superfine mineral material of predetermined size or specific surface area. The separation agent is then removed from the final product by washing with a solvent such as water.

Abstract: A method of preparing substantially homogeneous aluminum oxynitride powder and other nitrogen-containing powders is provided. Particularly with respect to the AlON powder, the method comprises the steps of milling a mixture of aluminum and aluminum oxide in a nitrogen-containing atmosphere until a milled powder composed of aluminum-nitrogen solid solution and aluminum oxide forms. The next step is heating the milled powder in the presence of an inert gas and keeping it at sufficient temperature for a sufficient heating time to form the substantially homogenous aluminum oxynitride powder. This method is extended to the preparation of other powders by employing appropriate starting materials. The resultant powders are also claimed as part of the instant invention.

Abstract: A method of preparing substantially homogeneous aluminum oxynitride powder and other nitrogen-containing powders is provided. Particularly with respect to the AlON powder, the method comprises the steps of milling a mixture of aluminum and aluminum oxide in a nitrogen-containing atmosphere until a milled powder composed of aluminum-nitrogen solid solution and aluminum oxide forms. The next step is heating the milled powder in the presence of an inert gas and keeping it at sufficient temperature for a sufficient heating time to form the substantially homogenous aluminum oxynitride powder. This method is extended to the preparation of other powders by employing appropriate starting materials. The resultant powders are also claimed as part of the instant invention.

Abstract: A method is disclosed for the production of a superfine mineral material powder wherein the subject mineral material is combined with a dry separation agent such as sodium chloride and ground for a sufficient time to produce the superfine mineral material of predetermined size or specific surface area. The separation agent is then removed from the final product by washing it with a solvent such as water. Superfine powders composed of mineral materials where the material is selected from the group consisting of talc, calcium carbonate, zeolite, clay, aluminum hydroxide, aluminum silicate, iron oxide and magnesium oxide are also claimed.

Abstract: A method is disclosed for the production of a superfine mineral material powder wherein the subject mineral material is combined with a dry separation agent such as sodium chloride and ground for a sufficient time to produce the superfine mineral material of predetermined size or specific surface area. The separation agent is then removed from the final product by washing it with a solvent such as water. Superfine powders composed of mineral materials where the material is selected from the group consisting of talc, calcium carbonate, zeolite, clay, aluminum hydroxide, aluminum silicate, iron oxide and magnesium oxide are also claimed.