Abstract: A method and device for manufacturing low temperature poly-silicon, and a laser assembly are provided. A method for manufacturing low temperature poly-silicon includes forming an amorphous silicon layer on a substrate; controlling a relative movement of a laser assembly to the substrate in a direction perpendicular to a thickness of the substrate, and controlling a laser beam emitted from the laser assembly to irradiate the amorphous silicon layer on the substrate, to recrystallize an amorphous silicon in a region to be irradiated with the laser beam in the amorphous silicon layer. In a direction of the substrate moving relative to the laser assembly, energy of the laser beam emitted by the laser assembly in a same period of time decreases gradually.

Abstract: Embodiments of the present invention provide a flexible base substrate and a fabrication method thereof. The flexible base substrate comprises: a first flexible film layer, having an upper surface and a lower surface opposite to each other, wherein a plurality of concave parts are arranged on the lower surface of the first flexible film layer.

Abstract: Embodiments of the present invention provide a flexible base substrate and a fabrication method thereof. The flexible base substrate comprises: a first flexible film layer, having an upper surface and a lower surface opposite to each other, wherein a plurality of concave parts are arranged on the lower surface of the first flexible film layer.

Abstract: Disclosed are a chip on film and a display device. the chip on film includes a plurality of output pads independent from each other extending in the first direction on a side of a base material; correspondingly, a flexible display panel in the display device includes a plurality of input pads in one-to-one correspondance with output pads extending in the first direction in the bonding region. The chip on film can improve the bonding yield and stability of the display device.

Abstract: A flexible substrate treatment device comprising at least one tank that accommodates treatment liquid, winding rollers including a main roller and a driven roller located above the treatment liquid, a positioning roller located in the treating liquid in each tank, a detecting unit configured to detect radius or diameter of at least one of the winding rollers, and a movable discharge member fixed to a side wall of each tank, including a movable discharge port configured to discharge the treatment liquid and a discharge port position controlling mechanism, wherein the movable discharge port can be moved in a direction X perpendicular to a bottom wall of the tank.

Abstract: A display substrate, a method for preparing the same, and a display device are provided in the embodiments of the disclosure. The display substrate comprises: a flexible substrate, the flexible substrate defining a connection region thereon; an inorganic structure layer on a side of the flexible substrate and in the connection region; a plurality of connection terminals on the inorganic structure layer and in the connection region; and a flexible filling layer in the inorganic structure layer and between two adjacent connection terminals of the plurality of connection terminals.

Abstract: A protective circuit for a cathode layer, a protective method and an OLED display device are provided. The protective circuit includes a power supply, and an electronic output node electrically connected with a negative electrode of the power supply. Electric potential of the electronic output node is the same as the electric potential of the cathode layer in a working state of the OLED display device, the electronic output node is connected to the cathode layer of the OLED display device, and a positive electrode of the power supply is connected to a voltage node with any potential other than an anode of the OLED display device via a wire, so that electrons can be continuously provided by the power supply to the cathode layer in a non-working state of the OLED display device.

Abstract: A packaging method and a display device are disclosed. The packaging method includes: packaging a display element on a substrate having the display element disposed thereon to form a package covering the display element, wherein a first substance is disposed on at least a part of the substrate inside the package, the first substance including thermite; and initiating the first substance to obtain a second substance including a product of the thermite reaction.

Abstract: The disclosure describes a flexible display apparatus and an encapsulation method thereof, which are capable of solving the problem of easily producing cracks with the existing encapsulating film layer and improving the performance of flex resistance of the flexible display apparatus. The flexible display apparatus according to the disclosure includes: an LED device, and a protective layer arranged on a cathode of the OLED device, wherein the protective layer includes a water oxygen barrier region and a multi-functional region, the multi-functional region has dual functions of a water oxygen barrier and stress blocking, and the thickness of the film layer in the multi-functional region is less than that of the film layer in the water oxygen barrier region, and/or the film texture in the multi-functional region is looser than that in the water oxygen barrier region.

Abstract: The present disclosure provides a chip-on-film, a flexible display panel and a display device. The COF includes a plurality of output pads independent of each other. The plurality of output pads are disposed at a side of the substrate and are arranged in at least one row in the first direction. Virtual extension lines of all the output pads intersect at the same intersecting point on the base line. The flexible display panel includes a plurality of input pads independent of each other. The plurality of input pads are disposed in the binding region and are arranged in at least one row in the first direction. Virtual extension lines of all the input pads intersect at the same intersecting point on the base line.

Abstract: The disclosure provides a method for manufacturing a flexible display device and a flexible display device. The manufacturing method comprises: providing a bottom film to be treated, the bottom film being divided into a bezel bending area and a remaining area; surface treating the upper surface of the bottom film, such that an adhesive force between the bezel bending area and an adhesive layer to be laminated is less than an adhesive force between the remaining area and the adhesive layer to be laminated; providing a display panel to be laminated, and adhering the display panel to the upper surface of the bottom film via the adhesive layer; removing a portion of the bottom film that is located within the bezel bending area.

Abstract: A display device and a method for manufacturing a display device are provided. The method includes: forming a material layer on a first face of a display panel; forming a touch panel and a polarizer sequentially on a second face of the display panel, the display panel having an end projecting beyond lateral faces of the touch panel and the polarizer; removing a portion of the material layer located in a first area on the display panel, the first area being located out of an effective display region of the display panel; and bending the first area of the display panel towards the first face such that a second area and a third area of the display panel are located on both sides of the material layer respectively, wherein the second area and the third area are connected to two ends of the first area respectively.

Abstract: The present disclosure proposes a method for manufacturing an electronic apparatus and a corresponding electronic apparatus. The method comprises: removing a back film in a first region of a flexible substrate; and bending the flexible substrate in the first region to form an electronic apparatus having a bending portion. The electronic apparatus comprises: a flexible substrate having a bending portion in a first region thereof; and a back film bonded to a region of a back surface of the flexible substrate except for the first region.

Abstract: A flexible display module includes a flexible substrate, a display layer disposed on the flexible substrate, a protective layer disposed on the display layer, a strengthening layer disposed between the display layer and the protective layer, the modulus of the strengthening layer being greater than or equal to the modulus of any of the layers in the flexible display module.

Abstract: A display device and a method for manufacturing a display device are provided. The method includes: forming a material layer on a first face of a display panel; forming a touch panel and a polarizer sequentially on a second face of the display panel, the display panel having an end projecting beyond lateral faces of the touch panel and the polarizer; removing a portion of the material layer located in a first area on the display panel, the first area being located out of an effective display region of the display panel; and bending the first area of the display panel towards the first face such that a second area and a third area of the display panel are located on both sides of the material layer respectively, wherein the second area and the third area are connected to two ends of the first area respectively.

Abstract: The present disclosure provides a flexible device, including a flexible module, a flexible support structure arranged opposite to the flexible module, and an adhesive structure configured to adhere the flexible module to the flexible support structure, and enable the flexible module to be slidable relative to the flexible support structure in the case that the flexible device is being bent.

Abstract: The embodiments of the disclosure disclose a flexible substrate, a fabrication method thereof, and a flexible display apparatus. The flexible substrate includes a first organic layer and an inorganic buffer layer stacked together. The first organic layer and the inorganic buffer layer form an organic-inorganic composite structure. The expansion coefficient of the flexible substrate provided by the embodiment of the present disclosure is more matched with that of the rigid auxiliary substrate, so as to reduce the risk of warping of the rigid auxiliary substrate and then improve the process accuracy when fabricating the display device.

Abstract: The embodiments of the present invention provide a substrate, a chip on film and an electronic equipment. The substrate includes a plurality of first bonding pads arranged side by side along a first direction. Each first bonding pad has a first side edge and a second side edge arranged oppositely, which are arranged along the first direction. A third side edge and a fourth side edge of the first bonding pad are arranged oppositely and arranged along a second direction perpendicular to the first direction. The first side edge and second side edge of each first bonding pad are not parallel to each other.

Abstract: A flexible display panel, a display device and a bonding method thereof are provided. The flexible display panel includes a plurality of fan-out leads arranged along a first direction and disposed in a fan-out region; virtual extension lines of the fan out leads at least disposed in lateral regions of the fan-out region are intersected at a first junction point on a reference line perpendicular to the first direction; a chip on film includes a plurality of pads being arranged along the first direction and in one-to-one correspondence with the fan-out leads; and virtual extension lines of the pads, which at least correspond to the fan-out leads disposed in the lateral regions, are intersected at a second junction point on the reference line.