Abstract: The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.

Abstract: The present disclosure relates to a device, method and computer readable medium for sending an emergency message. A device for sending an emergency message through an apparatus installed with at least one communication application, the device comprises: a memory having instructions stored therein; a processor configured to execute the instructions stored on the memory so that the processor performs the following operations: receiving an emergency signal from a user; transmitting an emergency message to the at least one communication application in response to the received emergency signal; and sending, through the at least one communication application, the emergency message to contacts of the at least one communication application.