Patents by Inventor Weiguo Zeng

Weiguo Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • In-ear headphone having MMCX socket and detachable in-ear headphone assembly
    Patent number: 10638211
    Abstract: An in-ear headphone having an MMCX socket and a detachable in-ear headphone assembly are provided. The in-ear headphone includes a headphone housing and a speaker assembly disposed in the headphone housing. The headphone housing includes a first housing and a second housing to be connected with each other. The first housing has a first interface portion extending from one end thereof. The second housing has a second interface portion extending from one end thereof. The first interface portion and the second interface portion jointly form an interface.
    Type: Grant
    Filed: May 6, 2018
    Date of Patent: April 28, 2020
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng-Feng Wen, Weiguo Zeng, Haijuan Wu, Lin Cheng
  • IN-EAR HEADPHONE HAVING MMCX SOCKET AND DETACHABLE IN-EAR HEADPHONE ASSEMBLY
    Publication number: 20190090043
    Abstract: An in-ear headphone having an MMCX socket and a detachable in-ear headphone assembly are provided. The in-ear headphone includes a headphone housing and a speaker assembly disposed in the headphone housing. The headphone housing includes a first housing and a second housing to be connected with each other. The first housing has a first interface portion extending from one end thereof. The second housing has a second interface portion extending from one end thereof. The first interface portion and the second interface portion jointly form an interface.
    Type: Application
    Filed: May 6, 2018
    Publication date: March 21, 2019
    Inventors: Tseng-Feng Wen, Weiguo Zeng, Haijuan Wu, Lin Cheng