Abstract: An anti-loosening mechanism for a pipe component and a pipe fitting at least partially removably inserted into the pipe component is provided, and includes an outer case, an operating component and a clamping component. The outer case is configured to be removably mounted on the pipe fitting. The operating component is rotatable. The clamping component is at least partially movably sleeved inside the operating component and includes a plurality of clamping portions. When the operating component rotates, the operating component drives each of the clamping portions to move along an clamping direction by a cooperation of a driving structure of the operating component and a driving cooperating structure of each of the clamping portions, such that the pipe component is clamped by and between each of the plurality of clamping portions and the pipe fitting. Besides, a related pipe assembly and a related cabinet system are also provided.

Abstract: The disclosure provides a solid-state light source device, a projection apparatus and an assembling method for solid-state light source device. The solid state light source device includes a cooler and a light source module. The cooler includes a chamber, a liquid inlet and a liquid outlet. An opening is formed on a top surface of the chamber. The liquid inlet is located on one sidewall of the chamber. The liquid outlet is located on another sidewall of the chamber. The light source module is disposed on a top surface of the cooler. The light source module covers the opening. Therefore, through the opening, the light source module contacts a liquid of the chamber such that heat generated by the light source module is taken away by the liquid. The efficiency of heat dissipation of the light source module may be improved.

Abstract: Bonded device structures and methods of fabrication thereof that provide improved uniformity of redistribution layer (RDL) pad surfaces. The RDL pads are formed by depositing (e.g., electroplating) a metal material on a semiconductor device structure, and performing a planarization process to provide discrete RDL pads having uniform, substantially flat upper surfaces with minimal differences in surface elevation. Passivation layer(s) and a bonding layer are formed over RDL pads, and bonding pad vias contact the upper surfaces of the RDL pads. In some embodiments, the flatness of the RDL pads may be enhanced by providing dielectric-filled slots filled in at least some of the RDL pads and/or non-functional “dummy” RDL pads between functional RDL pads to mitigate non-uniformities during the planarization process. Improved uniformity and flatness of the RDL pads may enhance the reliability and performance of bonded device structures.

Abstract: A semiconductor package and a formation method thereof are provided. The semiconductor package includes: a first device die; a second device die, stacked on and bonded to the first device die; and a gap fill dielectric, laterally surrounding the second device die, and locally recessed toward the second device die with respect to the first device die, such that lateral recesses are defined at outer sidewalls of the gap fill dielectric.

Abstract: A method of forming a semiconductor structure is provided. A substrate is provided with a first region and a second region. A through via is formed in the substrate in the first region. A first conductive pattern is formed covering the through via in the first region and a first conductive layer is simultaneously formed on the substrate in the second region. A second conductive pattern is formed on the first conductive pattern in the first region and a second conductive layer is simultaneously formed on the first conductive layer in the second region.

Abstract: A heat dissipation module is provided and includes an elastic component, a heat conduction component, a TEC chip and a heat dissipation component. The elastic component includes a body where the heat conduction component is disposed and at least two slab parts extending outward from the body. The TEC chip has a first surface thermally connected on the heat conduction component and a second surface thermally connected on the heat dissipation component. The heat dissipation component is fixed to the slab parts. The orthographic projection of the body on the TEC chip overlaps the first surface, and the area of the orthographic projection of the body on the TEC chip is less than or equal to the area of the first surface, and thus the elastic force which is generated from the body is applied to the inner side of the TEC chip.

Abstract: The disclosure provides an evaluation circuit for SRAM operations. The evaluation circuit includes a ring-oscillation control circuit and a plurality of SRAM instances connected in series with each other into an SRAM string. A WLE signal input terminal of an intermediate SRAM instance in the SRAM string is coupled to an internal signal output terminal of a previous-stage SRAM instance, and an internal signal output terminal of the intermediate SRAM instance is coupled to a WLE signal input terminal of a next-stage SRAM instance. An input terminal of the ring-oscillation control circuit is coupled to an internal signal output terminal of a last-stage SRAM instance in the SRAM string, and an output terminal of the ring-oscillation control circuit is coupled to a WLE signal input terminal of a first-stage SRAM instance in the SRAM string. Therefore, the ring-oscillation control circuit and the SRAM string form a ring oscillator circuit.

Abstract: A beam transmission module and a projection device with this beam transmission module. The beam transmission module includes a bracket, an actuator assembly, an optical assembly, and a bracket cover. The actuator assembly is configured on the bracket and is located on the transmission path of the image beam. The optical assembly is configured on the bracket and is located on the transmission path of the illumination beam. The bracket cover carries the optical assembly and is connected to the bracket. The beam transmission module and the projection device of this invention can simplify the design complexity and assembly cost of the projection device.

Abstract: A projection device includes: an illumination system providing an illumination beam; a light valve arranged on a transmission path of the illumination beam and converting the illumination beam into an image beam; a projection lens arranged on a transmission path of the image beam and projecting the image beam out of the projection device; a first actuating module connecting and moving a first element, so that the image beam shifts back and forth along at least one of the first, second, and third directions; and a second actuating module connecting and moving a second element, so that the image beam shifts back and forth along at least one of the first, second, and third directions. The first and second directions are perpendicular. The third and first directions form an angle of 45 degrees, so do the third and second directions. The first and second elements are different.

Abstract: An actuating device include a base, a frame body, two first shaft portions, an optical element, a frame body driving assembly, and a frame body sensing module. The two first shaft portions extend along a first axis. Each first shaft portion is located between the frame body and the base. The optical element is disposed in an opening of the frame body. The frame body driving assembly drives the frame body to swing about the two first shaft portions as rotating axes and includes a first coil and a first magnetic element disposed on one of the two first side walls and is located between the first coil and the frame body. The frame body sensing module is connected to the base and includes a frame body sensor disposed adjacent to the first magnetic element to sense an amount of change in magnetic field strength of the first magnetic element.

Abstract: Disclosed are computer-implemented or computer-aided method for diagnosing or predicting the risk of obstructive sleep apnea in a subject. The methods comprise determining whether the subject has obstructive sleep apnea based on at least one quantitative ultrasound parameter and/or at least one morphometric parameter.

Abstract: A fan cage assembly includes a cage and a handle mechanism, the handle mechanism includes a mount member including a mount portion and an extension portion respectively located at different sides of the cage and an operative member movably disposed on the extension portion of the mount member.

Abstract: An actuating apparatus configured to allow an image light beam to pass through. The actuating apparatus includes a frame body, an optical element, a light-transmitting element, and a drive assembly. The frame body includes a first frame portion, a second frame portion, and a shaft portion. The first frame portion is connected to the second frame portion through the shaft portion. A through hole of the second frame has a first opening and a second opening. The optical element is disposed on the first frame portion and located in the first opening. The light-transmitting element is disposed on the second frame portion, and is located in the second opening to seal the second opening. The image light beam sequentially passes through the optical element and the light-transmitting element. The drive assembly is disposed on the frame body and drives the first frame portion to rotate with the shaft portion.

Abstract: A method of fabricating a semiconductor device that includes a first die component and at least one second die component. The first die component includes a substrate, a dielectric layer on the substrate, and one or more metal pads positioned on the dielectric layer. The first die component further includes a passivation/bond film layer that is formed over the one or more metal pads, and one or more bond pad vias that extend through the passivation/bond film layer and contact one or more metal pads. The at least one second die component is bonded to the first die component and includes a substrate, and one or more through silicon vias, with the one or more through silicon vias contacting the one or more bond pad vias.

Abstract: Disclosed are computer-implemented or computer-aided method for diagnosing or predicting the risk of obstructive sleep apnea in a subject. The methods comprise determining whether the subject has obstructive sleep apnea based on at least one quantitative ultrasound parameter and/or at least one morphometric parameter.

Abstract: An optical module includes a frame body and an optical element. The frame body includes at least one fixing portion, at least one frame portion, at least one shaft portion, and at least one reinforcement structure. The frame portion is connected to the fixing portion through the shaft portion. The reinforcement structure is connected to the frame portion and forms at least one fracture. The position of the fracture corresponds to the at least one shaft portion. The optical element is disposed in the frame portion. In addition, a projection device having the optical module is also provided.

Abstract: A fluid cooling device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by an adhesive layer. In addition, the spray cooling cover includes a fluid inlet and a plurality of fluid outlets to utilize a working fluid to cool the chip directly.

Abstract: Disclosed are computer-implemented or computer-aided method for diagnosing or predicting the risk of obstructive sleep apnea in a subject. The methods comprise determining whether the subject has obstructive sleep apnea based on at least one quantitative ultrasound parameter and/or at least one morphometric parameter.

Abstract: A fixing mechanism is applied to an interface card assembly and an electronic apparatus. The fixing mechanism includes a movable window and an operation component. The movable window is slidably disposed on a casing of the interface card assembly. The operation component has a fixed end and a free end opposite to each other. The fixed end is disposed on the movable window. The free end is detachably engaged with the casing to position the movable window. The movable window is positioned on one of a first region and a second region of the casing for respectively fixing interface cards with different sizes to the casing.

Abstract: An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.