Patents by Inventor Weihong Gu

Weihong Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9057127
    Abstract: The present invention provides a plated resin molded article having a high adhering strength of a plating layer. Specifically, it provides a plated resin molded article that has a metal plating layer on the surface of a thermoplastic resin molded article comprising a composition that contains (A) 10 to 90 mass % of a matrix resin that has a water absorption after 24 hours in 23° C. water (ISO62) of at least 0.6% and (B) 90 to 10 mass % of a non-styrenic resin that has a water absorption after 24 hours in 23° C. water (ISO62) of less than 0.6%, wherein the thermoplastic resin molded article is not subjected to etching with a heavy metal-containing acid.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: June 16, 2015
    Assignees: DAICEL POLYMER LTD., DAICEL CHEMICAL INDUSTRIES, LTD.
    Inventors: Toshihiro Tai, Weihong Gu, Tatsuo Izumitani
  • Publication number: 20080027165
    Abstract: The present invention provides a plated resin molded article having a high adhering strength of a plating layer. Specifically, it provides a plated resin molded article that has a metal plating layer on the surface of a thermoplastic resin molded article comprising a composition that contains (A) 10 to 90 mass % of a matrix resin that has a water absorption after 24 hours in 23° C. water (ISO62) of at least 0.6% and (B) 90 to 10 mass % of a non-styrenic resin that has a water absorption after 24 hours in 23° C. water (ISO62) of less than 0.6%, wherein the thermoplastic resin molded article is not subjected to etching with a heavy metal-containing acid.
    Type: Application
    Filed: February 16, 2005
    Publication date: January 31, 2008
    Inventors: Toshihiro Tai, Weihong Gu, Tatsuo Izumitani
  • Publication number: 20070298227
    Abstract: The present invention provides a plated resin molded article that has a beautiful and strong plating layer. More particularly, it provides a plated resin molded article containing a resin molded article, the surface of which has not been subjected to a roughening treatment by chromic acid etching, and a metal plating layer formed on the surface of the resin molded article, the resin composition containing (A) 10 to 90 mass % matrix resin that has a water absorption (ISO62) after 24 hours in 23° C. water of at least 0.6%, (B) 10 to 90 mass % styrenic resin that has a water absorption (ISO62) after 24 hours in 23° C. water of less than 0.6%, (C) 0 to 40 mass % compatibilizer and (D) 1 to 20 parts by mass, to 100 parts by mass of the total of components (A) to (C), of a water-soluble substance that has a solubility (25° C.) in water of 0.01 g/100 g to 10 g/100 g; wherein the plated resin molded article does not exhibit a change in appearance upon visual inspect-ion after the prescribed heat cycle tests.
    Type: Application
    Filed: July 13, 2005
    Publication date: December 27, 2007
    Inventors: Toshihiro Tai, Weihong Gu, Tatsuo Izumitani