Patents by Inventor Weihua Zhou

Weihua Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150900
    Abstract: An anti-cavitation damping composite metal structure for a flow passage component and a preparation method thereof are provided. The preparation method includes: cladding a gradient functional material layer by layer on a substrate of a flow passage component; forming periodic structures on a surface of each layer of the gradient functional material through etching by an ultrafast laser to absorb a part of an impact load energy caused by cavitation of the flow passage component, where the layers of the gradient functional material form a gradient coating with a toughness increasing layer by layer and a hardness decreasing layer by layer from bottom to top; and forming nano twins on a surface layer by a laser shock peening technique, and implanting a residual compressive stress to further improve anti-cavitation resistance of a surface.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Applicant: HOHAI UNIVERSITY
    Inventors: Hongbing YAO, Yuanhang ZHOU, Wenlong LI, Wenjie SHI, Wei SU, Jiang YUE, Xiang HE, Yuanyuan XIANG, Weihua ZHU
  • Publication number: 20240147134
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 2, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240146827
    Abstract: Systems, apparatuses, and methods are described for wireless communications. A base station and wireless device may communicate capability information associated with a wireless device. The capability information may include information indicating support for an Ethernet type packet data unit session or header parameter compression. An Ethernet type packet data unit session may be instantiated based on the capability information.
    Type: Application
    Filed: October 19, 2023
    Publication date: May 2, 2024
    Inventors: Kyungmin Park, Esmael Hejazi Dinan, Weihua Qiao, Peyman Talebi Fard, Alireza Babaei, Hyoungsuk Jeon, Hua Zhou
  • Patent number: 11971326
    Abstract: A dynamic simulation test platform for ultra-high-speed evacuated tube magnetic levitation (maglev) transportation includes an evacuated tube having a transition section and a vacuum section, a vacuum maintaining system, a motor supporting platform, and a model train. One end of the evacuated tube is provided with a first isolation door, and the other end is closed. A second isolation door is provided inside the evacuated tube. The vacuum maintaining system is connected to the transition section and the vacuum section. The motor supporting platform is provided in the evacuated tube and extends outside the transition section. The motor supporting platform is provided with a stator winding and a permanent-magnet track. A mover and a cryogenic dewar are provided at a bottom of the model train. The cryogenic dewar is provided with a superconducting bulk. A test method using the test platform is further provided.
    Type: Grant
    Filed: October 9, 2023
    Date of Patent: April 30, 2024
    Assignee: Southwest Jiaotong University
    Inventors: Weihua Zhang, Zigang Deng, Haiquan Bi, Wenxiang Zhou, Jun Guo, Zhigen Xu, Yinchuan Li, Le Liang
  • Publication number: 20240137683
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137681
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137689
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137682
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137684
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137687
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137693
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137690
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137692
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240131223
    Abstract: Some embodiments of the disclosure provide a decellularized heart valve (DHV) composite, a preparation method of the DHV composite, and a use of the DHV composite. In some examples, the preparation method of the DHV composite includes the following steps: S1, conducting a reaction I on a DHV with a copper chloride-dopamine hydrochloride mixed solution to obtain a copper ion-modified DHV; and S2, conducting a reaction II on the copper ion-modified DHV with a GDF11 solution to obtain the DHV composite. In other examples, the present disclosure provides a use of the DHV composite in preparation of a tissue-engineered heart valve (TEHV). In further examples, the TEHV is a heart valve (HV) with remodeling and regeneration capabilities.
    Type: Application
    Filed: August 2, 2023
    Publication date: April 25, 2024
    Applicant: UNION HOSPITAL TONGJI MEDICAL COLLEGE HUST
    Inventors: Nianguo DONG, Ying ZHOU, Weihua QIAO, Ge YAN, Shuyu WEN, Xing CHEN
  • Patent number: 11950636
    Abstract: A battery housing includes a first casing and a second casing. A side wall of the first casing is provided with a limiting groove along an axial direction of the first casing. A guiding rib is protrudingly provided on the outer wall of the first casing along the axial direction of the first casing. An inner wall of the second casing is protrudingly provided with a limiting protrusion corresponding to the limiting groove along an axial direction of the second casing. A side wall of the second casing is provided with a guiding groove corresponding to the guiding rib along the axial direction of the second casing. When the second casing is sleeved on the outside of the first casing, the limiting protrusion is engaged in the limiting groove, and the guiding rib is engaged in the guiding groove.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: April 9, 2024
    Assignee: CHANGZHOU PATENT ELECTRONIC TECHNOLOGY CO., LTD
    Inventors: Weihua Qiu, Liangjun Zhou
  • Publication number: 20240114440
    Abstract: A wireless device may communicate with a base station via a cell. A cell may be selected for wireless communications based on having a configuration that is capable of serving certain wireless resources associated with a wireless device. A wireless device may select a cell that comprises a communication link supporting certain wireless resources that may be required for use by the wireless device.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 4, 2024
    Inventors: Kyungmin Park, Esmael Hejazi Dinan, Weihua Qiao, Taehun Kim, Jinsook Ryu, Peyman Talebi Fard, Hua Zhou
  • Publication number: 20220393879
    Abstract: A method and a system for managing voting of an alliance chain based on variable strategies are provided. The method specifically includes: 1) classifying channel strategies into an implicit strategy and a strategy based on signature; 2) specifically implementing the variable strategies: initiating, by a user, a proposal request for modifying a strategy; detecting whether a content of the strategy meets a format requirement on the condition that a target strategy is a strategy based on signature; sending a voting invitation or a signature invitation to an organization requiring auditing according to a present channel strategy or a present network strategy; voting or signing by the invited organization; analyzing a result to determine whether the result meets a requirement of the present channel strategy; if so, modifying the present channel strategy to a target channel strategy; otherwise, failing in modification.
    Type: Application
    Filed: December 17, 2021
    Publication date: December 8, 2022
    Applicant: Zhejiang University
    Inventors: Weihua ZHOU, Butian HUANG, Mengnan CHI, Chenglong LIU, Mandi XU, Qinming HE
  • Publication number: 20220059863
    Abstract: The present invention relates to the field of fuel cell stacks and stack tower or module, in particular to a sealing structure for stack tower and a stack tower. The sealing structure comprises a first component, a second component and a mica spacer, the first component and the second component are opposite to each other, the mica spacer is disposed between the first component and the second component, sealing part is arranged between the mica spacer and at least one of the first component and the second component, and the sealing part comprises a glass ceramic layer and an outer circumferential ceramic cement ring surrounding the glass cement layer; the sealing structure for stack tower has excellent sealing performance and service durability for a fuel cell system.
    Type: Application
    Filed: April 30, 2021
    Publication date: February 24, 2022
    Applicants: China Energy Investment Corporation Limited, Shenhua New Energy Co., Ltd., National Institute of Clean-and-Low-Carbon Energy
    Inventors: Zhien Liu, Dajun Li, Ying Zhang, Weihua Zhou, Xia Yang, Yuqiong Zhang, Jason Wang, Changlei Liu, Brandon Ohara
  • Patent number: 11108601
    Abstract: The invention comprises a method for controlling a gain of a multi-stage equalizer of a serial data receiver, applied to the serial data receiver, the serial data receiver comprising the multi-stage equalizer, wherein the method comprises the steps of: Step S1, enabling the serial data receiver to receive a set of serial data; Step S2, selecting a continuous first data sequence from the set of serial data according to a preset first rule; Step S3, selecting a continuous second data sequence from the first data sequence according to a preset second rule; Step S4, extracting a predetermined bit from the second data sequence; Step S5, calculating an equalization gain identifier of the data sequence by using each predetermined bit; and Step S6, controlling the gain value of the multi-stage equalizer according to the equalization gain identifier.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: August 31, 2021
    Assignee: AMLOGIC (SHANGHAI) CO., LTD.
    Inventors: Weihua Zhou, Ming Shi
  • Patent number: 10979253
    Abstract: The invention comprises a method for controlling a gain of a multi-stage equalizer of a serial data receiver, applied to the serial data receiver comprising the multi-stage equalizer, wherein the method comprises: Step S1, enabling the serial data receiver to receive a set of serial data; Step S2, selecting a plurality of continuous data sequences from the set of serial data according to a preset first rule; Step S3, extracting a predetermined bit from each of the plurality of continuous data sequences; Step S4, calculating an equalization gain identifier corresponding to each of the plurality of continuous data sequences according to a predetermined bit in each of the plurality of continuous data sequences; Step S5, obtaining an optimized equalization gain identifier through calculation according to each of the equalization gain identifiers; and Step S6, controlling a gain value of the multi-stage equalizer according to the optimized equalization gain identifier.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: April 13, 2021
    Assignee: Amlogic (Shanghai) Co., Ltd.
    Inventors: Weihua Zhou, Ming Shi