Patents by Inventor WEI-JIAN DAI

WEI-JIAN DAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallic housing forming method
    Patent number: 8904620
    Abstract: A metallic housing forming method includes steps as follows: friction stir welding metallic members to form a metallic housing; immersing the metallic housing in an alkali solution to remove contaminants from the metallic housing, and forming a black salt layer on the metallic housing; stripping the black salt layer away from the metallic housing; electro-polishing the metallic housing to dissolve the outermost surface of the metallic housing; anode-oxiding the metallic housing; and sealing and drying the metallic housing.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: December 9, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Meng-Yu Tsou, Wei-Jian Dai
  • METALLIC HOUSING FORMING METHOD
    Publication number: 20130263428
    Abstract: A metallic housing forming method includes steps as follows: friction stir welding metallic members to form a metallic housing; immersing the metallic housing in an alkali solution to remove contaminants from the metallic housing, and forming a black salt layer on the metallic housing; stripping the black salt layer away from the metallic housing; electro-polishing the metallic housing to dissolve the outermost surface of the metallic housing; anode-oxiding the metallic housing; and sealing and drying the metallic housing.
    Type: Application
    Filed: October 1, 2012
    Publication date: October 10, 2013
    Inventors: MENG-YU TSOU, WEI-JIAN DAI