Patents by Inventor Weijie Lu

Weijie Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130536
    Abstract: A foldable electric bed frame that is relatively thinner in a folded state and easy to pack and transport includes a bed frame body, subframes, driving motors, bed boards, and detachable bed legs. The driving motors and the bed boards are connected to the bed frame body and the subframes. Flexible covering members are further comprised. The flexible covering members are arranged along the edges of the periphery of the bottom of the bed boards and are connected to the bottom of the bed boards through velcro or other detachable connecting members; and when the bed frame body is in a folded state, the flexible covering members are located between the stacked bed boards. The flexible covering members are arranged around the bed boards, and when the bed frame is folded, the flexible covering members are used as a buffering measure.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Applicant: HUZHOU GLORY HOME FURNISHINGS CO., LTD
    Inventors: Zehua DENG, Dongting LU, Wu SHEN, Xianlong TAN, Weijie ZHANG
  • Publication number: 20220257052
    Abstract: A method for controlling a cooking apparatus includes counting a number of times that an operation temperature of the cooking apparatus exceeds a set temperature within a previous set duration, updating a control parameter corresponding to a current set duration based on the number of times, and controlling a heating device of the cooking apparatus to heat within the current set duration based on the updated control parameter.
    Type: Application
    Filed: November 8, 2019
    Publication date: August 18, 2022
    Inventors: Maoqiao TIAN, Yongdong AI, Xiang WU, Longjian XUAN, Jie LI, Wei CHEN, Xiaohui LI, Biao WANG, Sheng ZHOU, Xianxin MENG, Yanxia ZENG, Fuxing YANG, Wenqi TIAN, Weijie LU
  • Patent number: 6815323
    Abstract: Ohmic contact formation inclusive of Carbon films on 4H and 6H n-type Silicon Carbide is disclosed. Contact formation includes an initial RF sputtering to produce an amorphous Carbon film with the sp2/sp3 Carbon ratio of about 1.0 measured by X-ray photoelectron spectroscopy. This Carbon film gradually evolves from sp3 to sp2 structures of high sp2 content during an annealing at temperatures ranging from 600° C. to 1350° C. depending on the substrate doping levels, between 1016 and 1019, employed. Formation of sp2 Carbon is accelerated by the presence of metal and gaseous catalytic agents including for example nickel and argon. The sp2 Carbon structures consist especially of nano-size graphitic flakes and also of amorphous aromatic-like Carbon structures, and polyene-like Carbon structures, as are revealed by Raman spectroscopy. Ohmic contact is achieved when a sufficient amount of nano-graphitic flakes are formed at the selected annealing temperature.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: November 9, 2004
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Weijie Lu, William C. Mitchel, Warren E. Collins
  • Patent number: 6747291
    Abstract: Ohmic contact formation on p-type Silicon Carbide is disclosed. The formed contact includes an initial amorphous Carbon film layer converted to graphitic sp2 Carbon during an elevated temperature annealing sequence. Decreased annealing sequence temperature, reduced Silicon Carbide doping concentration and reduced specific resistivity in the formed ohmic contact are achieved with respect to a conventional p-type Silicon Carbide ohmic contact. Addition of a Boron carbide layer covering the p-type Silicon Carbide along with the sp2 Carbon is also disclosed. Ohmic contact improvement with increased annealing temperature up to an optimum temperature near 1000° C. is included. Addition of several metals including Aluminum, the optimum metal identified, over the Carbon layer is also included; many other of the identified metals provide Schottky rather than the desired ohmic contacts, however.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: June 8, 2004
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Weijie Lu, William C. Mitchel, Warren E. Collins, Gerald Landis