Patents by Inventor Weijie YEK

Weijie YEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210078903
    Abstract: A curable epoxy resin compositions containing at least one epoxy resin having on average more than one epoxide group per molecule, at least one inorganic filler, at least one hydraulic binder, and at least one polycarboxylate ether, wherein the inorganic filler has silica with an amount of between 45 and 65 wt.-%, based on the total curable epoxy resin composition, and the amount of the polycarboxylate ether is between 0.01 and 0.03 wt.-%, based on the total curable epoxy resin composition. Further, a multi-component systems for producing the epoxy resin compositions, cured epoxy resins, and methods for repairing or reinforcing a pile or column.
    Type: Application
    Filed: March 21, 2018
    Publication date: March 18, 2021
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Yan SHAO, Weijie YEK, Lanwei WANG