Abstract: A multichannel video receiver having an analog-to-digital converter, fast-Fourier transform circuit and inverse-Fourier transform circuit. The analog-to-digital converter circuit generates a digitized representation of a frequency band used to convey a plurality of video signals, and the fast-Fourier transform circuit generates a frequency-domain representation of the digitized representation of the frequency band. The inverse-Fourier transform circuit recovers, from the frequency-domain representation, a plurality of digitized time-domain signals that correspond to the plurality of video signals.

Abstract: An analog video receiver implemented in an integrated circuit device. The analog video receiver includes a mixing circuit to mix an analog video signal with a sinusoid to generate a frequency-shifted analog video signal, and an offset cancellation circuit to obtain a sample of the frequency-shifted analog video signal during a first time interval and, based on the sample, generate an offset cancellation signal that, when summed with the frequency-shifted analog video signal, reduces a substantially time-invariant offset in the frequency-shifted analog video signal.

Abstract: An optical modular switching system comprising a first optical switch module having at least one first optical input port, at least one first optical output port, and at least one first interconnect port. The optical modular switching system also comprises a second optical switch module having at least one second optical input port, at least one second optical output port, and at least one second interconnect port. Finally, the optical modular switching system comprises an optical interconnect that optically couples the first optical interconnect port to the second optical interconnect port. The invention also provides a method for switching an optical signal. Additional optical switch modules can be added to incrementally grow the optical modular switching system.

Abstract: A self-aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch with a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.

Abstract: An angular rate sensor made from a structural wafer of single crystal silicon has a pair of proof masses lying in an X-Y plane and supported by a circular frame. The masses are driven into oscillation in the X-direction using an interdigitated comb drive. Rotation of the sensor about the Z-axis induces Coriolis forces which cause the frame to rotate, the rotation of the frame being indicative of the angular rate of the sensor. A parallel plate sensor located outside of the circular frame senses rotation of the frame.

Abstract: Methods for surface micro-machining silicon wafers, including coating cavity sidewalls with oxidation-resistant material to prevent lateral oxidation. This in turn prevents "bird's beak" during formation of a diaphragm. The methods are useful for, among other things, the manufacture of absolute-type pressure sensors. Along with bulk micro-machining techniques, the methods can be used to produce gauge- and differential-type pressure sensors, as well.