Patents by Inventor Weijing LU

Weijing LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
    Patent number: 11761107
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: September 19, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND AND BISEPOXOIDES
    Publication number: 20210205052
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: February 4, 2020
    Publication date: July 8, 2021
    Inventors: Weijing LU, Lingli DUAN, Zukhra NIAZIMBETOVA, Chen CHEN, Maria RZEZNIK
  • Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides
    Patent number: 10738388
    Abstract: Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: August 11, 2020
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND AND BISEPOXOIDES
    Publication number: 20200179087
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: February 4, 2020
    Publication date: June 11, 2020
    Inventors: Weijing LU, Lingli DUAN, Zukhra NIAZIMBETOVA, Chen CHEN, Maria RZEZNIK
  • Copper electroplating baths containing reaction products of aminex, polyacrylamides and bisepoxides
    Patent number: 10662541
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: May 26, 2020
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND SULTONES
    Publication number: 20200149176
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: January 17, 2020
    Publication date: May 14, 2020
    Inventors: Weijing LU, Lingli DUAN, Zukhra NIAZIMBETOVA, Chen Chen, Maria RZEZNIK
  • Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
    Patent number: 10604858
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: March 31, 2020
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Copper electroplating baths containing compounds of reaction products of amines and quinones
    Patent number: 10590556
    Abstract: A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: March 17, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINEX, POLYACRYLAMIDES AND BISEPOXIDES
    Publication number: 20180245228
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 30, 2018
    Inventors: Weijing LU, Lingli DUAN, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES AND QUINONES
    Publication number: 20180237930
    Abstract: A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 23, 2018
    Inventors: Weijing LU, Lingli DUAN, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES AND POLYACRYLAMIDES
    Publication number: 20180237929
    Abstract: Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 23, 2018
    Inventors: Weijing LU, Lingli DUAN, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND SULTONES
    Publication number: 20180237931
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 23, 2018
    Inventors: Weijing LU, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Amino sulfonic acid based polymers for copper electroplating
    Patent number: 9725816
    Abstract: Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: August 8, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Sulfonamide based polymers for copper electroplating
    Patent number: 9611560
    Abstract: Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Amino sulfonic acid based polymers for copper electroplating
    Patent number: 9598786
    Abstract: Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: March 21, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I. Niazimbetova, Maria Anna Rzeznik
  • Sulfonamide based polymers for copper electroplating
    Patent number: 9562300
    Abstract: Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: February 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I Niazimbetova, Maria Anna Rzeznik
  • AMINO SULFONIC ACID BASED POLYMERS FOR COPPER ELECTROPLATING
    Publication number: 20160186350
    Abstract: Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Application
    Filed: January 13, 2016
    Publication date: June 30, 2016
    Inventors: Weijing LU, Zuhra I. NIAZIMBETOVA, Maria Anna RZEZNIK
  • SULFONAMIDE BASED POLYMERS FOR COPPER ELECTROPLATING
    Publication number: 20160186345
    Abstract: Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Application
    Filed: December 30, 2014
    Publication date: June 30, 2016
    Inventors: Weijing LU, Zuhra I. NIAZIMBETOVA, Maria Anna RZEZNIK
  • AMINO SULFONIC ACID BASED POLYMERS FOR COPPER ELECTROPLATING
    Publication number: 20160186347
    Abstract: Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Application
    Filed: December 30, 2014
    Publication date: June 30, 2016
    Inventors: Weijing LU, Zuhra I. NIAZIMBETOVA, Maria Anna RZEZNIK
  • SULFONAMIDE BASED POLYMERS FOR COPPER ELECTROPLATING
    Publication number: 20160186349
    Abstract: Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Application
    Filed: December 28, 2015
    Publication date: June 30, 2016
    Inventors: Weijing LU, Zuhra I. NIAZIMBETOVA, Maria Anna RZEZNIK