Abstract: A method for capturing biometric measurement data of a patient's eye, in which the fixation is monitored during the entire biometric measurement. Information in respect of the fixation is extracted, depending on the different recording modes, from already available or additionally captured recordings and/or data. Central retinal OCT scans with absolute fixation information and frontal images with relative fixation information with or without at least partial diffuse lighting are used. On the basis of this extracted fixation information, the subsequent evaluation only uses the captured biometric measurement data captured just before, at the same time as or just after frontal images with the correct fixation. The method can also be applied to different measurement tasks, in which use is made of different measurement modes and in which the alignment of the measurement object is important for the measurement results.

Abstract: A method for capturing biometric measurement data of a patient's eye, in which the fixation is monitored during the entire biometric measurement. Information in respect of the fixation is extracted, depending on the different recording modes, from already available or additionally captured recordings and/or data. Central retinal OCT scans with absolute fixation information and frontal images with relative fixation information with or without at least partial diffuse lighting are used. On the basis of this extracted fixation information, the subsequent evaluation only uses the captured biometric measurement data captured just before, at the same time as or just after frontal images with the correct fixation. The method can also be applied to different measurement tasks, in which use is made of different measurement modes and in which the alignment of the measurement object is important for the measurement results.

Abstract: A method for determining the topography of the cornea of an eye on the basis of an optical, contactless data capture. In the method for determining the topography of the cornea of an eye, which is based on a deflectometric method, the deflectometric measurements are carried out with the aid of a keratometric method by virtue of additional OCT-based scans being made at the keratometric measurement points, wherein the two measurement systems are registered to one another and both the keratometric and the OCT-based measurement values are recorded and used for mutual calibration to determine and output the topographic data. The proposed method serves to determine the topography of the cornea of an eye. It is helpful to ascertain the topography in order to be able to draw conclusions about possible pathological changes. Moreover, the exact measurement of the corneal topography is of great importance for correcting refractive errors.

Abstract: A method for determining the topography of the cornea of an eye on the basis of an optical, contactless data capture. In the method for determining the topography of the cornea of an eye, which is based on a deflectometric method, the deflectometric measurements are carried out with the aid of a keratometric method by virtue of additional OCT-based scans being made at the keratometric measurement points, wherein the two measurement systems are registered to one another and both the keratometric and the OCT-based measurement values are recorded and used for mutual calibration to determine and output the topographic data. The proposed method serves to determine the topography of the cornea of an eye. It is helpful to ascertain the topography in order to be able to draw conclusions about possible pathological changes. Moreover, the exact measurement of the corneal topography is of great importance for correcting refractive errors.

Abstract: A method for determining the topography of the cornea of an eye on the basis of an optical, contactless data capture. In the method for determining the topography of the cornea of an eye, which is based on a deflectometric method, the deflectometric measurements are carried out with the aid of a keratometric method by virtue of additional OCT-based scans being made at the keratometric measurement points, wherein the two measurement systems are registered to one another and both the keratometric and the OCT-based measurement values are recorded and used for mutual calibration to determine and output the topographic data. The proposed method serves to determine the topography of the cornea of an eye. It is helpful to ascertain the topography in order to be able to draw conclusions about possible pathological changes. Moreover, the exact measurement of the corneal topography is of great importance for correcting refractive errors.

Abstract: A method for selecting an intraocular lens (IOL), to optimize the results of refractive procedures on the eye. According to the invention, the method for selecting the IOL includes: a) determining the required biometrical parameters of the eye; b) using the parameters for a corresponding eye model; c) evaluating, using ray tracing, the data of an IOL to be implanted; d) selecting, on the basis of said data, an IOL to be implanted; and e) repeating the method steps c) and d) for further suitable IOLs. To optimize the method, different measuring methods are used to determine the biometrical parameters, a corresponding patient-specific eye model is identified, and, when selecting the IOL, additional retinal image metrics are taken into consideration alongside the determined data. The method according to the invention permits the optimized selection of a spherical, aspheric, toric or multifocal IOL for implantation.

Abstract: A method for determining the topography of the cornea of an eye on the basis of an optical, contactless data capture. In the method for determining the topography of the cornea of an eye, which is based on a deflectometric method, the deflectometric measurements are carried out with the aid of a keratometric method by virtue of additional OCT-based scans being made at the keratometric measurement points, wherein the two measurement systems are registered to one another and both the keratometric and the OCT-based measurement values are recorded and used for mutual calibration to determine and output the topographic data. The proposed method serves to determine the topography of the cornea of an eye. It is helpful to ascertain the topography in order to be able to draw conclusions about possible pathological changes. Moreover, the exact measurement of the corneal topography is of great importance for correcting refractive errors.

Abstract: A method for selecting an intraocular lens (IOL), to optimize the results of refractive procedures on the eye. According to the invention, the method for selecting the IOL includes: a) determining the required biometrical parameters of the eye; b) using the parameters for a corresponding eye model; c) evaluating, using ray tracing, the data of an IOL to be implanted; d) selecting, on the basis of said data, an IOL to be implanted; and e) repeating the method steps c) and d) for further suitable IOLs. To optimize the method, different measuring methods are used to determine the biometrical parameters, a corresponding patient-specific eye model is identified, and, when selecting the IOL, additional retinal image metrics are taken into consideration alongside the determined data. The method according to the invention permits the optimized selection of a spherical, aspheric, toric or multifocal IOL for implantation.

Abstract: A specification establishing method for controlling semiconductor process, the steps includes: sampling a plurality of sample groups from a population, each sample group being a non-normal distribution; filtering the sample groups; summarizing the filtered sample groups to form a non-normal distribution diagram; getting a value-at-risk and a median by calculating from the non-normal distribution diagram; getting a critical value by calculating the value-at-risk and the median with a critical formula; getting a plurality of state values by calculating the filtered sample groups with a proportion formula; and getting an index value by calculating the non-normal distribution diagram with the proportion formula. Thus, the state values indicate the states of the sample groups are abnormal or not by comparing the state values to the index value.

Abstract: A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.

Abstract: A method for evaluating efficacy of prevention maintenance for a tool includes the steps of: choosing a tool which has been maintained preventively and choosing a productive parameter of the tool; collecting values of the productive parameter generated from the tool during a time range for building a varying curve of the productive parameter versus time, modifying the varying curve with a moving average method; transforming the varying curve into a Cumulative Sum chart; and judging whether the values of the productive parameter generated from the tool after the prevention maintenance are more stable, compared with the values of the productive parameter generated from the tool before the prevention maintenance, according to the Cumulative Sum chart. Thereby, if the varying of the values of the productive parameter after the prevention maintenance isn't stable, then the efficacy of this prevention maintenance for the tool is judged not good.

Abstract: A method for planning a semiconductor manufacturing process based on users' demands includes the steps of: establishing a genetic algorithm model and inputting data; establishing a fuzzy system and setting one output parameter representing percent difference of each cost function in neighbor generations; setting to have a modulation parameter corresponding to each input parameter for adjusting fuzzy sets of the output parameter; executing genetic algorithm actions; executing fuzzy inference actions; eliminating chromosomes that produce output parameter smaller than a defined lower limit, and the remaining chromosomes that produces the largest output parameter is defined as the optimum chromosome, wherein the genetic algorithm actions stops being executed upon the optimum chromosome; then determining whether or not a defined number of generations has been reached, if yes, executing the optimum chromosome of the last generation; if no, continuing executing the genetic algorithm actions, thereby finding the opti

Abstract: A specification establishing method for controlling semiconductor process, the steps includes: providing a database and choosing a population from the database; sampling a plurality of sample groups from the population, each sample group being a non-normal distribution and having a plurality of samples; filtering the sample groups; summarizing the filtered sample groups to form a non-normal distribution diagram; getting a value-at-risk and a median by calculating from the non-normal distribution diagram; getting a critical value by calculating the value-at-risk and the median with a critical formula; getting a plurality of state values by calculating the filtered sample groups with a proportion formula; and getting an index value by calculating the non-normal distribution diagram with the proportion formula. Thus, the state values indicate the states of the sample groups are abnormal or not by comparing the state values to the index value.

Abstract: A method for planning a production schedule of equipment includes: receiving information about a material replacement of the equipment; and determining a target production schedule of the equipment according to the information about the material replacement of the equipment, wherein the target production schedule includes an idle period, and during the idle period, the equipment stops manufacturing under a normal state.

Abstract: A method for finding the correlation between tool PM (prevention maintenance) and the product yield of the tool is disclosed. The method uses a moving average method to magnify a curve trend that is formed by the product yield data that is captured during a predetermined days before PM and after PM. The magnified curve trend is shown by a Cumulative sum chart. The Cumulative sum chart is analyzed for informing related workers of the effect between the tool PM and the product yield, so as to accurately estimate PM timing. Thereby, via the method, the effect between the tool PM and the product yield may be determined, which serves as an important reference for workers to execute further PM.

Abstract: A yield loss prediction method includes: performing a plurality of types of defect inspections upon a plurality of batches of wafers which begin to be processed during different periods to generate defect inspection data, respectively; for a specific batch of wafers different from the plurality of batches of wafers, calculating defect prediction data of at least one type of defect inspection according to the defect inspection data of at least the type of defect inspections; and predicting a yield loss of the specific batch of wafers according to at least the defect prediction data.

Abstract: A method for predicting and warning of WAT value includes the steps as follows. A key process is selected and a WAT value after finishing the key process is used as a predictive goal. A predicting model is built. One batch or plural batches of predictive wafers are prepared, and a Fault Detection and Classification data (FDC data) and a metrology data from the predictive wafers of the key process are collected. The FDC data and the metrology data collected from the predictive wafers are inputted into the predicting model for processing a normal predicting procedure, and a predictive WAT value by the predicting model is outputted. The present invention can accurately predict the WAT value, effectively monitor some specific defective wafers and continuously perform the improvement for the specific defective wafer.

Abstract: A method for evaluating efficacy of prevention maintenance for a tool includes the steps of: choosing a tool which has been maintained preventively and choosing a productive parameter of the tool; collecting values of the productive parameter generated from the tool during a time range for building a varying curve of the productive parameter versus time, modifying the varying curve with a moving average method; transforming the varying curve into a Cumulative Sum chart; and judging whether the values of the productive parameter generated from the tool after the prevention maintenance are more stable, compared with the values of the productive parameter generated from the tool before the prevention maintenance, according to the Cumulative Sum chart. Thereby, if the varying of the values of the productive parameter after the prevention maintenance isn't stable, then the efficacy of this prevention maintenance for the tool is judged not good.

Abstract: A method for monitoring fabrication parameters comprises steps of: obtaining a normal parameter variance curve and a comparing parameter variance curve; defining a plurality of normal parameter points on the normal parameter variance curve; defining a plurality of comparing parameter points on the comparing parameter variance curve; finding out the corresponding comparing parameter points nearest to the normal parameter points; calculating the distances between the normal parameter points and the corresponding comparing parameter points thereof; summing up the distances so as to receive a total distance; and determining whether or not the total distance exceeds a limit. Via this arrangement, when fabrication parameter of tool is abnormal, it can be efficiently and immediately determined.

Abstract: A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.