Patents by Inventor Wei-Jun Lin

Wei-Jun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128219
    Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 18, 2024
    Inventors: Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
  • Patent number: 11961817
    Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kai Jun Zhan, Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng
  • Publication number: 20240081154
    Abstract: A method for fabricating a semiconductor device includes the steps of: providing a substrate, wherein the substrate comprises a MRAM region and a logic region; forming a magnetic tunneling junction (MTJ) on the MRAM region; forming a top electrode on the MTJ; and then performing a flowable chemical vapor deposition (FCVD) process to form a first inter-metal dielectric (IMD) layer around the top electrode and the MTJ.
    Type: Application
    Filed: November 8, 2023
    Publication date: March 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Tai-Cheng Hou, Fu-Yu Tsai, Bin-Siang Tsai, Da-Jun Lin, Chau-Chung Hou, Wei-Xin Gao
  • Publication number: 20170165799
    Abstract: A machine tool and a feed saddle structure thereof are provided. The feed saddle structure includes: a fixed column having a first vertical side and a horizontal side adjacent to the first vertical side; a feed saddle having a second vertical side corresponding in position to the first vertical side of the fixed column, and a bottom portion being adjacent to the second vertical side and corresponding in position to the horizontal side of the fixed column; a first guide rail and a second guide rail disposed on the first vertical side and the horizontal side of the fixed column, respectively; and a first slider and a second slider disposed on the second vertical side and the bottom portion of the feed saddle, respectively, and engaged with the first guide rail and the second guide rail, respectively, thereby increasing the dynamic and static rigidity of the machine tool.
    Type: Application
    Filed: December 14, 2015
    Publication date: June 15, 2017
    Inventors: Wei-Jun Lin, Chien-Chih Liao, Shuo-Peng Liang
  • Patent number: 6343903
    Abstract: A tool holder of the hollow taper shank in a tool machine is disclosed. A resisting block supported by a spring is received within a tool holder. As the short knife is disposed within the tool holder, the elastic force of the spring can be overcome. At first, a plurality of steel balls and a resisting block are pushed inversely until the front edge of an wider portion of the short knife passes through the steel ball. Now, the spring will release the energy from elastic deformation so as to enforce the resisting block to move forwards and outwards so as to return to the original position. Thereby, the knife can be firmly secured.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: February 5, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Hsiang-Feng Huang, Kun-Lung Tsai, Wei-Jun Lin, Ke-Wu Ou Yang
  • Patent number: 6148988
    Abstract: An automatic pallet changer is composed of a pallet lifting mechanism and a revolving mechanism. The pallet lifting mechanism has a pallet platform and a lifting rod which is fastened with the bottom of the pallet platform. The pallet platform and the lifting rod are driven by oil pressure to move up and down in a linear manner. The body of the lifting rod is provided with a vertically-oriented first position confining portion. The revolving mechanism has a gear and a rack gear member. The gear is pivoted to the bottom of the pallet lifting mechanism at a fixed height and provided axially with a slide channel in which the lifting rod is slidably disposed. The slide channel is provided in the inside thereof with a vertically-oriented second position confining portion, which is complementary in shape to the first position confining portion of the lifting rod for enabling the lifting rod and the pallet platform to turn synchronously.
    Type: Grant
    Filed: January 13, 1999
    Date of Patent: November 21, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Wei-Jun Lin, Hsiang-Feng Huang, Kuan-Wen Chen