Abstract: Antimicrobial thermoset coating formulations including an additive compound and a thermo- or UV-curable resin are provided, especially where the additive is chosen from 1-butyl-3-methylimidazolium bromide, didecyldimethyl ammonium chloride, 1-cetylpyridinium chloride, hydroxyethylcellulose, carboxy methylcellulose, triethyl citrate, N-octadecyldimethyl-(3-(trimethoxysilyl)propyl)ammonium chloride, 4-(trimethoxysilylethyl)benzyltrimethylammonium chloride, N-[3-(trimethoxysilyl) propyl]-N,N,N-trimethylammonium chloride, dimethylbenzalkonium. Antimicrobial thermoset coating formulations further including a copper-containing material or cuprous oxide are provided. Methods of making the antimicrobial thermoset coating formulations are also provided. Methods for using the antimicrobial thermoset coating formulations are also provided. Antimicrobial systems are also provided.

Abstract: An optical fiber includes a glass core, a glass cladding surrounding and in direct contact with the glass core, and a coating surrounding and in direct contact with the glass cladding. The coating includes three layers, a first high-modulus coating layer having a Young's modulus greater than 500 MPa, a second high-modulus coating layer having a Young's modulus greater than 500 MPa, and a low-modulus coating layer having a Young's modulus between about 0.20 MPa and 5 MPa. The coating may have the first high-modulus coating layer as the inner layer, the low-modulus coating layer as the intermediate layer, and the second high-modulus coating layer as the outer layer. Alternatively, the coating may have the low-modulus coating layer as the inner layer, first high-modulus coating layer as the intermediate layer, and the second high-modulus coating layer as the outer layer.

Abstract: Methods of cleaning glass comprise mixing the glass with a peroxide-containing aqueous solution and heating the glass at a temperature of about 100°° C. or more. In aspects, 50 wt % of the peroxide-containing aqueous solution based on an amount of the glass is mixed with the glass. The peroxide-containing aqueous solution can be removed from the glass before the heating. Alternatively, in aspects, from 10 wt % to 50 wt % of the peroxide-containing aqueous solution based on an amount of the glass can be mixed with the glass.

Abstract: Coated articles can comprise a coating disposed over a first major surface of a substrate. The coating comprises a plurality of functionalized oligomeric silsesquioxanes and a pencil hardness of about 5H or more. In aspects, the coating comprises a linker terminated with a first functional group and a second functional group. In aspects, the coating comprises a silane coupling agent attaching the coating to the first major surface. Methods of making a coated article comprise depositing a layer comprise a plurality of functionalized oligomeric silsesquioxanes over a first major surface of a substrate and curing the layer to form the coating. Methods of forming a composition comprise reacting a plurality of functionalized oligomeric silsesquioxanes with a linker terminated with a first functional group at a first end of the linker and a second functional group at a second end of the linker opposite the first end of the linker.

Abstract: A cross-bred organic semiconductor (OSC) polymer, includes a diketopyrrolopyrrole (DPP)-fused thiophene polymeric material, such that: the DPP-fused thiophene polymeric material comprises a first linear alkyl-substituted DPP portion and a second branched alkyl-substituted DPP portion, the cross-bred OSC polymer comprises a repeat unit having both the first linear alkyl-substituted DPP portion and the second branched alkyl-substituted DPP portion, and the fused thiophene is beta-substituted.

Abstract: Glass-based substrates are described herein that may be processed by methods including applying a cover article onto a glass-based substrate, submerging the glass-based substrate in an etchant, and maintaining the submersion of the glass-based substrate in the etchant. The glass-based substrate may include a covered surface portion and an exposed surface portion. At least a portion of the covered surface portion may be in direct contact with the cover article. The covered surface portion may not be in contact with the etchant and the exposed surface portion may be in direct contact with the etchant. The etchant may contact the exposed surface portion and the cover article fora time sufficient to etch the exposed surface portion. The cover article may provide a barrier between the etchant and the covered surface portion for the entirety of the submerging.

Abstract: A cross-bred organic semiconductor (OSC) polymer, includes a diketopyrrolopyrrole (DPP)-fused thiophene polymeric material, such that: the DPP-fused thiophene polymeric material comprises a first linear alkyl-substituted DPP portion and a second branched alkyl-substituted DPP portion, the cross-bred OSC polymer comprises a repeat unit having both the first linear alkyl-substituted DPP portion and the second branched alkyl-substituted DPP portion, and the fused thiophene is beta-substituted.

Abstract: An optical fiber is provided that includes a core region, a cladding region having a radius less than about 62.5 microns; a polymer coating comprising a high-modulus layer and a low-modulus layer, wherein a thickness of the low-modulus inner coating layer is in a range of 4 microns to 20 microns, the modulus of the low-modulus inner coating layer is less than or equal to about 0.35 MPa, a thickness of the high-modulus coating layer is in a range of 4 microns to 20 microns, the modulus of the high-modulus inner coating layer is greater than or equal to about 1.6 GPa, and wherein a puncture resistance of the optical fiber is greater than 20 g, and wherein a microbend attenuation penalty of the optical fiber is less than 0.

Abstract: An optical fiber is provided that includes a core region, a cladding region having a radius less than about 62.5 microns; a polymer coating comprising a high-modulus layer and a low-modulus layer, wherein a thickness of the low-modulus inner coating layer is in a range of 4 microns to 20 microns, the modulus of the low-modulus inner coating layer is less than or equal to about 0.35 MPa, a thickness of the high-modulus coating layer is in a range of 4 microns to 20 microns, the modulus of the high-modulus inner coating layer is greater than or equal to about 1.6 GPa, and wherein a puncture resistance of the optical fiber is greater than 20 g, and wherein a microbend attenuation penalty of the optical fiber is less than 0.03 dB/km, and wherein an outer diameter of the coated optical fiber is less than or equal to 175 microns.

Abstract: Polymer-based portions comprise an index of refraction ranging from about 1.49 to about 1.55. In some embodiments, the polymer-based portion comprises the product of curing 45-75 wt % of a difunctional urethane-acrylate oligomer with 25-55 wt % of a difunctional cross-linking agent and optionally a reactive diluent. In some embodiments, the polymer-based portion comprises the product of curing 75-100 wt % of a reactive diluent and optionally one or more a difunctional urethane-acrylate oligomer and/or a difunctional cross-linking agent. Adhesives comprise an index of refraction ranging from about 1.49 to about 1.55. In some embodiments, the adhesive comprises the product of heating 10-35 wt % of a silane-hydride-terminated siloxane and 65-90 wt % of a vinyl-terminated siloxane. In some embodiments, the adhesive comprises the product of irradiating a thiol-containing siloxane and a photo-initiator with at least one wavelength of light that the photo-initiator is sensitive to.

Abstract: The present disclosure is directed to pharmaceutical packages that include a coating that comprises polysilazane, and methods for the production of such. In one or more embodiments of the present disclosure, a pharmaceutical package may include a glass container comprising a first surface and a second surface opposite the first surface. The first surface may be an outer surface of the glass container. The pharmaceutical package may further include a coating positioned over at least a portion of the first surface of the glass container. The coating may include polysilazane.

Abstract: The present disclosure relates to a thin coated optical fiber that enables connector assembly without stripping the optical fiber. In particular, the thin coating comprises a hard coating, a dye concentrate, and an adhesion promoter. The formulation of the coating promotes adhesion to a glass cladding of the optical fiber and to a ferrule bore (into which the optical fiber is inserted) by not causing silane decomposition of the coating. Moreover, the coating is colored to enable, among other things, fiber identification within a connector. The thin coated optical fibers exhibit good mechanical and optical performance properties as discussed herein.

Abstract: Glass-based articles comprise high effective fracture toughness. Glass-based articles comprise: a glass-based substrate comprising opposing first and second surfaces defining a substrate thickness (ts), a substantially planar central portion, and a perimeter portion; a polymer coating disposed on at least a portion of at least one of the first or the second surfaces; and an effective fracture toughness that is greater than or equal to 1.25 MPa·m0.5 as measured at room temperature.

Abstract: Methods for producing a glass sheet are provided. The methods can include forming a glass ribbon from molten glass, applying a polymer precursor to at least a portion of a first or second major surface of the glass ribbon, curing the polymer precursor to form a polymer coating, and separating the glass ribbon to produce at least one glass sheet. Glass ribbons and glass sheets produced by these methods are also disclosed.

Abstract: Glass-based substrates are described herein that may be processed by methods including applying a cover article onto a glass-based substrate, submerging the glass-based substrate in an etchant, and maintaining the submersion of the glass-based substrate in the etchant. The glass-based substrate may include a covered surface portion and an exposed surface portion. At least a portion of the covered surface portion may be in direct contact with the cover article. The covered surface portion may not be in contact with the etchant and the exposed surface portion may be in direct contact with the etchant. The etchant may contact the exposed surface portion and the cover article fora time sufficient to etch the exposed surface portion. The cover article may provide a barrier between the etchant and the covered surface portion for the entirety of the submerging.

Abstract: A polymer blend, including at least one organic semiconductor (OSC) polymer, such that: the at least one OSC polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, the at least one OSC polymer has a first portion and a second portion, and at least one of the first portion or the second portion includes at least one UV-curable side chain.

Abstract: Disclosed is a polymer blend comprising an organic semiconductor (OSC) polymer blended with an isolating polymer and method for making the same. The OSC polymer includes a diketopyrrolopyrrole fused thiophene polymeric material, and the fused thiophene is beta-substituted. The isolating polymer includes a non-conjugated backbone, and the isolating polymer may be one of polyacrylonitrile, alkyl substituted polyacrylonitrile, polystyrene, polysulfonate, polycarbonate, an elastomer block copolymer, derivatives thereof, copolymers thereof and mixtures thereof. The method includes blending the OSC polymer with an isolating polymer in an organic solvent to create a polymer blend and depositing a thin film of the polymer blend over a substrate. Also disclosed is an organic semiconductor device that includes a thin semiconducting film comprising OSC polymer.

Abstract: Glass-based articles comprise high effective fracture toughness. Glass-based articles comprise: a glass-based substrate comprising opposing first and second surfaces defining a substrate thickness (ts), a substantially planar central portion, and a perimeter portion; a polymer coating disposed on at least a portion of at least one of the first or the second surfaces; and an effective fracture toughness that is greater than or equal to 1.25 MPa.m0.5 as measured at room temperature.

Abstract: An optical fiber is provided that includes a core region, a cladding region having a radius less than about 62.5 microns; a polymer coating comprising a high-modulus layer and a low-modulus layer, wherein a thickness of the low-modulus inner coating layer is in a range of 4 microns to 20 microns, the modulus of the low-modulus inner coating layer is less than or equal to about 0.35 MPa, a thickness of the high-modulus coating layer is in a range of 4 microns to 20 microns, the modulus of the high-modulus inner coating layer is greater than or equal to about 1.6 GPa, and wherein a puncture resistance of the optical fiber is greater than 20 g, and wherein a microbend attenuation penalty of the optical fiber is less than 0.

Abstract: The present disclosure relates to a thin coated optical fiber that enables connector assembly without stripping the optical fiber.