Patents by Inventor Weijun-William Wang

Weijun-William Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7892435
    Abstract: Systems and methods are disclosed that promote the remediation of contaminated materials that are produced during industrial processes. These systems and methods include heating a material, transferring heat from the material to an industrial process. During this transfer, contaminants may be introduced into the material. These methods may remove the contaminant by treating the material with a surface modified nanoceramic through nanofiltration and/or active sites adsorption/reaction. The surface modified nanoceramic may remove at least part of the contaminant in the material. No cooling required prior to removing the contaminant from the material, which can lead to great energy saving and pollution reduction.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: February 22, 2011
    Assignee: Honeywell International Inc.
    Inventors: Tao Pan, Weijun-William Wang, Linan Zhao, Hongda Li
  • Publication number: 20090289012
    Abstract: Systems and methods are disclosed that promote the remediation of contaminated materials that are produced during industrial processes. These systems and methods include heating a material, transferring heat from the material to an industrial process. During this transfer, contaminants may be introduced into the material. These methods may remove the contaminant by treating the material with a surface modified nanoceramic through nanofiltration and/or active sites adsorption/reaction. The surface modified nanoceramic may remove at least part of the contaminant in the material. No cooling required prior to removing the contaminant from the material, which can lead to great energy saving and pollution reduction.
    Type: Application
    Filed: May 21, 2008
    Publication date: November 26, 2009
    Applicant: Honeywell International Inc.
    Inventors: Tao Pan, Weijun-William Wang, Linan Zhao, Hongda Li