Abstract: The present disclosure provides compounds, or their tautomers or pharmaceutically acceptable salts thereof, and their pharmaceutical compositions that can selectively activate Yes-associated protein 1 (YAP). YAP activators of the present disclosure are useful in therapies such as wound and organ repair including, for example, treatment of chronic ulcers.

Abstract: The present disclosure belongs to the technical field of biological products for veterinary medicine, and specifically relates to a recombinant foot-and-mouth disease virus (FMDV) with a reduced immunosuppressive activity, a preparation method and use thereof, and a recombinant vaccine strain. According to the present disclosure, it is firstly discovered that FMDV 3B protein has an immunosuppressive function, and key sites for exerting the immunosuppressive function are found. A recombinant FMDV vaccine strain with a lost immunosuppressive function in FMDV 3B protein is constructed by introducing amino acid mutations into three repeated copies of FMDV 3B protein.

Abstract: The present disclosure discloses polyester composites and their preparation methods, and belongs to the technical field of polymer processing and modification. The polyester composites of the present disclosure comprise 65 to 90 parts of polyester, 5 to 35 parts of an elastomer, 0.05 to 3 parts of a chain extender and 0.01 to 5 parts of a functional additive. The polyester composites of the present disclosure not only have ultra-high toughness, but also can maintain high tensile strength, have excellent hydrolysis resistance, can be matched with an antibacterial agent or an antistatic agent to have good antibacterial or antistatic additional functions, can be widely applied to the fields of fibers and fabrics, plastic structural parts, plastic packages or automobile interior parts, and have a wide prospect.

Abstract: A water-based coating composition containing two parts A and B: (A) a binder component containing a waterborne epoxy dispersion, dispersed inorganic particles, and a polymeric dispersant; and (B) a hardener component, and a ratio of the component (A) and the component (B) is 90:1 to 2:1. The polymeric dispersant contains anti-agglomerating functional groups that are unreactive with oxirane groups of the epoxy dispersion.

Abstract: A stable two-component waterborne coating composition comprising an epoxy component A comprising a waterborne epoxy resin, a polymeric dispersant, and pigments and/or extenders; and a component B comprising a curing agent; providing coatings made therefrom with improved anti-corrosion properties; and a method of preparing the coating composition.

Abstract: An aqueous polymer dispersion is composed of (i) an emulsion polymer having a weight average molecular weight of from 2,000 to 30,000 daltons, wherein the emulsion polymer comprises as polymerized units, based on the dry weight of the emulsion polymer, (a) from 10% to 90% by weight of an ethylenically unsaturated ionic monomer, (b) from 5% to 90% by weight of a photosensitive monomer, and (c) from 0 to 85% by weight of an ethylenically unsaturated nonionic monomer; and (ii) from 3.5% to 50% by weight of TEMPO and/or a derivative thereof, based on the total dry weight of the aqueous polymer dispersion. An aqueous coating composition comprising the aqueous polymer dispersion and a binder provides coatings with improved durability.

Abstract: A polymeric dispersant and a stable two-component epoxy coating composition comprising an epoxy component A comprising: a waterborne epoxy resin, the polymeric dispersant, and pigments and/or extenders; and a component B comprising a curing agent; providing coatings made therefrom with improved anti-corrosion properties; and a method of preparing the coating composition.

Abstract: A stable two-component waterborne coating composition comprising an epoxy component A comprising a waterborne epoxy resin, a polymeric dispersant, and pigments and/or extenders; and a component B comprising a curing agent; providing coatings made therefrom with improved anti-corrosion properties; and a method of preparing the coating composition.

Abstract: The present disclosure discloses polyester composites and their preparation methods, and belongs to the technical field of polymer processing and modification. The polyester composites of the present disclosure comprise 65 to 90 parts of polyester, 5 to 35 parts of an elastomer, 0.05 to 3 parts of a chain extender and 0.01 to 5 parts of a functional additive. The polyester composites of the present disclosure not only have ultra-high toughness, but also can maintain high tensile strength, have excellent hydrolysis resistance, can be matched with an antibacterial agent or an antistatic agent to have good antibacterial or antistatic additional functions, can be widely applied to the fields of fibers and fabrics, plastic structural parts, plastic packages or automobile interior parts, and have a wide prospect.

Abstract: This invention generally relates to a multi-stage polymer suitable for a grinding additive, a method for producing the multi-stage polymer, a composition and a paint composition comprising the multi-stage polymer and a use of the multi-stage polymer for a grinding additive of a paint composition.

Abstract: An aqueous polymer dispersion and an aqueous coating composition comprising the aqueous polymer dispersion that provides coatings with improved durability.

Abstract: A water-based coating composition containing two parts (Parts A and B), (A) binder component containing a waterborne epoxy dispersion and dispersed inorganic particles with a polymeric dispersant and (B) hardener component. The polymeric dispersant contains anti-agglomerating functional groups that are unreactive with oxirane groups of the epoxy dispersion.

Abstract: This invention generally relates to a multi-stage polymer suitable for a grinding additive, a method for producing the multi-stage polymer, a composition and a paint composition comprising the multi-stage polymer and a use of the multi-stage polymer for a grinding additive of a paint composition.

Abstract: The invention discloses a novel package structure of integrate circuit or discrete device and packaging method, and includes the lead pins adjacent to the island; another metal layer formed at the bottom of the island; another metal layer formed at the bottom of lead pins; chip mounted on the island; wires bonded between the chip and the lead pins; the molded body encapsulating the top surface and side surface of the island and the lead pins, small protrusions of the island and the lead pins below the molded body; in the individual package, the number of the island can be one or more, lead pins can be arrayed at one side of the island, also can be arrayed at two sides or three sides of the island, one or two rows of lead pins can be located around the island. The invention provides strong welding, good quality, low cost, smooth production, wide applicability, flexible arrangement of the chips.

Abstract: A packaging substrate with fiat bumps for an electronic device and a method of manufacturing the same relate to the production of the packaging substrate for an electronic device, which comprises base islands and pins structurally and wherein the base islands and pins which all exhibit flat bump shape distribute on the front face of the substrate; the bottom side of the bumps, namely the rear faces of the base islands and pins are contiguous in the same substrate; in the packaging body of a single electronic device to be formed in later procedure, one or more base island may be included, the pins may arrange on one single side of the base island, also may arrange on the both sides or three sides of the base island, or may surround the base island so as to form the structure of one or more circuits of pins.

Abstract: The invention discloses an ultra thin package structure of leadless electronic device and the packaging method, and includes lead support base adjacent to the chip support base; chip mounted on the chip support base; wires bonded between chip and lead support base; the molded body encapsulating the top surface and side surface of the chip support base, small protrusions of the chip support base and lead support base below the molded body; in the individual package, the number of the chip support base island can be one or more, the lead pins can be arrayed at one side of the island, also can be arrayed at two sides or three sides of the island, one or two rows of lead pins can be located around the island.