Patents by Inventor Wei-Liang Liu

Wei-Liang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11972956
    Abstract: A lid attach process includes dipping a periphery of a lid in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid. The lid attach process further includes positioning the lid over a die attached to a substrate using a lid carrier, wherein the periphery of the lid is aligned with a periphery of the lid carrier. The lid attach process further includes attaching the lid to the substrate with the adhesive material forming an interface with the substrate. The lid attach process further includes contacting a thermal interface material (TIM) on the die with the lid.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Kuan-Lin Ho, Jason Shen
  • Patent number: 11955338
    Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Chun Huang, Ya-Wen Yeh, Chien-Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Ru-Gun Liu, Chin-Hsiang Lin, Yu-Tien Shen
  • Publication number: 20240111597
    Abstract: A present invention embodiment requests resources for a set of tasks from different resource providers. The set of tasks includes first tasks and second tasks of longer duration than the first tasks. The resources are revocable by the different resource providers based on processing demand. Performance of the first tasks is initiated on the resources, and stable resources are identified based on revocation of the resources during performance of the first tasks. Performance of the second tasks are initiated on the identified stable resources. Requests for the resources to the different resource providers are adjusted based on resource provider information collected in response to completion of the set of tasks.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Guang Han Sui, Wei Ge, Lan Zhe Liu, Guo Liang Wang
  • Patent number: 11916077
    Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
  • Patent number: 10989613
    Abstract: A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a plurality of first finger circuits of the first sensing circuit and a plurality of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: April 27, 2021
    Assignee: TAIWAN ALPHA ELECTRONIC CO., LTD.
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu, Huang-Chao Chan
  • Publication number: 20190376853
    Abstract: A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a priority of first finger circuits of the first sensing circuit and a priority of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.
    Type: Application
    Filed: May 17, 2019
    Publication date: December 12, 2019
    Inventors: TZU-HSUAN HUANG, WEI-LIANG LIU, HUANG-CHAO CHAN
  • Patent number: 10485453
    Abstract: A stretch sensor includes a first elastic insulating layer, a first elastic conductive layer, an elastic dielectric layer, a second elastic conductive layer and a second elastic insulating layer sequentially piled together thereon. The first and the second elastic insulating layers include the same elastic resin, and the first and the second elastic conductive layer include the same elastic resin and the same conductive material. The elastic dielectric layer includes the elastic resin and a dielectric material, in which the dielectric material comprises at least one of an Sr1-xCaxTiO3 compound, an Sr1-yBayTiO3 compound, and a BaTiO3 compound so as to make the dielectric constant of the dielectric material within 15.65-2087.3 F/m.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: November 26, 2019
    Assignee: TAIWAN ALPHA ELECTRONIC CO., LTD.
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu
  • Patent number: 10302459
    Abstract: A bend sensor includes a flexible circuit substrate, an insulation pad and a flexible conductive substrate. The flexible circuit substrate includes an insulating body, a first circuit and a second circuit. The first and second circuits are disposed on opposing sides of the insulating body. The first circuit has first fingers, while the second circuit has second fingers. The insulation pad disposed on the insulating body exposes the first and second fingers. The flexible conductive substrate disposed on the insulating pad has a conductive layer separated from the first fingers and the second fingers. While the bend sensor is bent, the conductive layer on the flexible conductive substrate would deform toward the flexible circuit substrate so as to form multiple contacts with the first and second fingers. Through these contacts, a number of resistors are formed to contribute a detectable resistance for the corresponding bending amplitude to be further realized.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: May 28, 2019
    Assignee: TAIWAN ALPHA ELECTRONIC CO., LTD.
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu, Huang-Chao Chan
  • Patent number: 10274305
    Abstract: A lamination type stretch sensor includes a first elastic insulating layer, a first elastic conductive layer, an elastic dielectric layer, a second elastic conductive layer and a second elastic insulating layer sequentially piled together thereon. The first elastic conductive layer includes a plurality of first coupling sections and a plurality of first connecting sections. The second elastic conductive layer includes a plurality of second coupling sections and a plurality of second connecting sections disposed between the second coupling sections. The elastic dielectric layer is deposited between the first elastic conductive layer and the second elastic conductive layer.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: April 30, 2019
    Assignee: TAIWAN ALPHA ELECTRONIC CO., LTD.
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu
  • Patent number: 10249416
    Abstract: A slide type variable resistor with a resistance adjusting member, comprising a housing, two side rails, a circuit module, a control member and a base. The housing includes a housing limiting hole and a space. The two side rails are disposed in the space. The circuit module is disposed in the space and has a resistive circuit. The control member is disposed in the space. The control member includes an object, at least one metal brush, a handle and an elastic member. The object having a bump, and the elastic member is sleeved at the bump.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: April 2, 2019
    Assignee: TAIWAN ALPHA ELECTRONIC CO., LTD.
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu, Chien-Chih Ho
  • Patent number: 10242775
    Abstract: A variable resistor with a light emitting element includes a circuit board, a housing and a slide assembly. The circuit board extending in a longitudinal direction has a circuit arrangement surface to arrange thereon a resistive circuit and a power circuit. The housing fixed to the circuit board so as to form a slide space has a sliding slot extending in the longitudinal direction. The slide assembly further includes a slidable member, a fader set, a light emitting element, a resistive circuit brush and two light-emitting element brushes. The fader set fixed at the slidable member penetrates the sliding slot. The light emitting element in an accommodating groove of the slidable member projects a light beam toward the fader set. The resistive circuit brush electrically connects the resistive circuit. The two light-emitting element brushes electrically bridge the power circuit and the light emitting element.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: March 26, 2019
    Assignee: TAIWAN ALPHA ELECTRONIC CO., LTD.
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu, Chien-Chih Ho
  • Patent number: 10234341
    Abstract: A finger movement-sensing assembly includes a flexible substrate, a bend-sensing circuit structure and a depression-sensing circuit structure. The flexible substrate extends in a first direction for use on a finger. The flexible substrate has an outer extension section and an inner deflection section. The outer extension section is applied to be mounted onto a back of the finger, and the inner deflection section is applied to be mounted onto a pulp of the finger. The bend-sensing circuit structure is disposed on the outer extension section to produce a bend-sensing signal. The depression-sensing circuit structure is disposed on the inner deflection section to produce a depression-sensing signal.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: March 19, 2019
    Assignee: Taiwan Alpha Electronic Co., Ltd.
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu
  • Publication number: 20190039233
    Abstract: A toolbox includes a casing, at least one drawer, and at least one latch. The casing has a chamber, and a side wall of the casing has at least one side opening communicating with the chamber. The drawer is movably provided in the casing and located in the chamber, and has a recess located at a position corresponding to the side opening of the side wall. The latch is pivotally provided on the side wall of the casing, and has at least one blocking portion. The latch can be operated to pivotally move between a first position and a second position. When the latch is located at the first position, the blocking portion extends into the chamber through the side opening, and enters the recess of the drawer. When the latch is located at the second position, the blocking portion is away from the recess of the drawer.
    Type: Application
    Filed: August 2, 2017
    Publication date: February 7, 2019
    Inventor: WEI-LIANG LIU
  • Patent number: 10163552
    Abstract: A rotary variable resistor includes a resistance circuit module, a fixation frame, a brush assembly and a rotor shaft. The resistance circuit module has a circuit board, an output circuit, three input circuits and a resistance ring. The output circuit includes a brush contact port having an annular brush contact area and an output port extending out from the brush contact port. Each input circuit has a resistor contact end and an input port. The three resistor contact ends are evenly annularly separated. The resistance ring co-axially and annularly spaced to the brush contact port contacts the resistor contact ends. The fixation frame is fixedly mounted on the resistance circuit module. The brush assembly rotatably restrained by the fixation frame bridges the annular brush contact area and the resistance ring. The rotor shaft for driving the brush assembly is connected with the brush assembly.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: December 25, 2018
    Assignee: TAIWAN ALPHA ELECTRONIC CO., LTD.
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu, Chien-Chih Ho
  • Publication number: 20180364114
    Abstract: A finger movement-sensing assembly includes a flexible substrate, a bend-sensing circuit structure and a depression-sensing circuit structure. The flexible substrate extends in a first direction for use on a finger. The flexible substrate has an outer extension section and an inner deflection section. The outer extension section is applied to be mounted onto a back of the finger, and the inner deflection section is applied to be mounted onto a pulp of the finger. The bend-sensing circuit structure is disposed on the outer extension section to produce a bend-sensing signal. The depression-sensing circuit structure is disposed on the inner deflection section to produce a depression-sensing signal.
    Type: Application
    Filed: May 25, 2018
    Publication date: December 20, 2018
    Inventors: Tzu-Hsuan HUANG, Wei-Liang LIU
  • Publication number: 20180184949
    Abstract: A stretch sensor includes a first elastic insulating layer, a first elastic conductive layer, an elastic dielectric layer, a second elastic conductive layer and a second elastic insulating layer sequentially piled together thereon. The first and the second elastic insulating layers include the same elastic resin, and the first and the second elastic conductive layer include the same elastic resin and the same conductive material. The elastic dielectric layer includes the elastic resin and a dielectric material, in which the dielectric material comprises at least one of an Sr1-xCaxTiO3 compound, an Sr1-yBayTiO3 compound, and a BaTiO3 compound so as to make the dielectric constant of the dielectric material within 15.65-2087.3 F/m.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 5, 2018
    Inventors: Tzu-Hsuan Huang, Wei-Liang Liu
  • Publication number: 20180188015
    Abstract: A lamination type stretch sensor includes a first elastic insulating layer, a first elastic conductive layer, an elastic dielectric layer, a second elastic conductive layer and a second elastic insulating layer sequentially piled together thereon. The first elastic conductive layer includes a plurality of first coupling sections and a plurality of first connecting sections. The second elastic conductive layer includes a plurality of second coupling sections and a plurality of second connecting sections disposed between the second coupling sections. The elastic dielectric layer is deposited between the first elastic conductive layer and the second elastic conductive layer.
    Type: Application
    Filed: February 27, 2017
    Publication date: July 5, 2018
    Inventors: TZU-HSUAN HUANG, WEI-LIANG LIU
  • Publication number: 20180113003
    Abstract: A bend sensor includes a flexible circuit substrate, an insulation pad and a flexible conductive substrate. The flexible circuit substrate includes an insulating body, a first circuit and a second circuit. The first and second circuits are disposed on opposing sides of the insulating body. The first circuit has first fingers, while the second circuit has second fingers. The insulation pad disposed on the insulating body exposes the first and second fingers. The flexible conductive substrate disposed on the insulating pad has a conductive layer separated from the first fingers and the second fingers. While the bend sensor is bent, the conductive layer on the flexible conductive substrate would deform toward the flexible circuit substrate so as to form multiple contacts with the first and second fingers. Through these contacts, a number of resistors are formed to contribute a detectable resistance for the corresponding bending amplitude to be further realized.
    Type: Application
    Filed: September 18, 2017
    Publication date: April 26, 2018
    Inventors: TZU-HSUAN HUANG, WEI-LIANG LIU, HUANG-CHAO CHAN
  • Publication number: 20170256342
    Abstract: A variable resistor with a light emitting element includes a circuit board, a housing and a slide assembly. The circuit board extending in a longitudinal direction has a circuit arrangement surface to arrange thereon a resistive circuit and a power circuit. The housing fixed to the circuit board so as to form a slide space has a sliding slot extending in the longitudinal direction. The slide assembly further includes a slidable member, a fader set, a light emitting element, a resistive circuit brush and two light-emitting element brushes. The fader set fixed at the slidable member penetrates the sliding slot. The light emitting element in an accommodating groove of the slidable member projects a light beam toward the fader set. The resistive circuit brush electrically connects the resistive circuit. The two light-emitting element brushes electrically bridge the power circuit and the light emitting element.
    Type: Application
    Filed: January 6, 2017
    Publication date: September 7, 2017
    Inventors: TZU-HSUAN HUANG, WEI-LIANG LIU, CHIEN-CHIH HO
  • Publication number: 20170227349
    Abstract: A position sensor includes a variable capacitor assembly and a circuit board. The variable capacitor assembly includes a baseboard and a dielectric coupling element. The baseboard includes a baseboard body, a grounding electrode and two power electrodes. The grounding electrode is disposed nearby one side of the baseboard body. The two power electrodes are disposed separately near the other side of the baseboard body. The dielectric coupling element is spaced with the two power electrodes and the grounding electrode, and operable to be moved along a moving path. A covering condition is varied when the dielectric coupling element is operated to move along the moving path. When a power is alternatively applied to the power electrodes, a pair of capacitance values between the grounding electrode and the power electrodes is varied with the covering condition to accordingly determine a relative position of the coupling element along the moving path.
    Type: Application
    Filed: March 29, 2016
    Publication date: August 10, 2017
    Inventors: Tzu-Hsuan HUANG, Wei-Liang LIU, Chao-Jen HO, Chien-Chih HO