Patents by Inventor Weiliang TEO

Weiliang TEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure and method of acoustic device
    Patent number: 11799440
    Abstract: The disclosure provides a packaging structure and method of an acoustic device, relating the technical field of semiconductors, including: a substrate and a piezoelectric stack structure located on the substrate, a first organic material layer is disposed on the piezoelectric stack structure, a second organic material layer is disposed on the first organic material layer, the first organic material layer includes a first supporting part and a second supporting part, the second supporting part forms a first acoustic reflection structure, when being transmitted to the first acoustic reflection structure, acoustic waves can be reflected back to the effective area, so that the loss of the acoustic waves is reduced, and the performance of the acoustic device is improved.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: October 24, 2023
    Assignee: Wuhan MEMSonics Technologies Co., Ltd.
    Inventors: Zhipeng Ding, Qin Ren, Bowoon Soon, Bangtao Chen, Liyan Siow, Weiliang Teo, Chao Gu, Yan Liu, Binghui Lin
  • Packaging Structure and Method of Acoustic Device
    Publication number: 20230308073
    Abstract: The disclosure provides a packaging structure and method of an acoustic device, relating the technical field of semiconductors, including: a substrate and a piezoelectric stack structure located on the substrate, a first organic material layer is disposed on the piezoelectric stack structure, a second organic material layer is disposed on the first organic material layer, the first organic material layer includes a first supporting part and a second supporting part, the second supporting part forms a first acoustic reflection structure, when being transmitted to the first acoustic reflection structure, acoustic waves can be reflected back to the effective area, so that the loss of the acoustic waves is reduced, and the performance of the acoustic device is improved.
    Type: Application
    Filed: September 21, 2022
    Publication date: September 28, 2023
    Inventors: Zhipeng DING, Qin REN, Bowoon SOON, Bangtao CHEN, Liyan SIOW, Weiliang TEO, Chao GU, Yan LIU, Binghui LIN