Patents by Inventor Weilong GUO

Weilong GUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250224286
    Abstract: A sensor chip is provided. The sensor chip includes a first base substrate; a piezoresistor and a resistor lead on the first base substrate; a second base substrate on a side of the piezoresistor and the resistor lead away from the first base substrate; a metal wire bond extending through the second base substrate and connected to the resistor lead; a redistribution layer on a side of the second base substrate away from the first base substrate; and a pressure reference chamber between the first base substrate and the second base substrate. The first base substrate and the second base substrate encapsulate at least a portion of the piezoresistor inside the pressure reference chamber. The metal wire bond is connected to the resistor lead, and is connected to the redistribution layer. The resistor lead is connected to the piezoresistor.
    Type: Application
    Filed: June 20, 2023
    Publication date: July 10, 2025
    Applicants: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd., Beijing BOE Technology Development Co., Ltd.
    Inventors: Weilong Guo, Yue Li, Qiuxu Wei, Lihui Wang, Taonan Zhang, Nana He, Jie Sun, Wenbo Chang, Feng Qu
  • Publication number: 20250224292
    Abstract: The present disclosure provides a detection apparatus, a training method and a training apparatus. The detection apparatus includes a plurality of MEMS sensors configured to collect signals to be detected in real time and output sensing signals according to the signals to be detected; a processing module configured to receive the sensing signals of the plurality of MEMS sensors and determine a detection result of the detection apparatus according to the sensing signals of the plurality of MEMS sensors at each sampling time; wherein, there is a predetermined interval duration between two adjacent sampling times, and a sensing signal of each of the MEMS sensors at the current sampling time is related to a signal to be detected at the current sampling time, a sensing signal at the previous sampling time and an attenuation coefficient.
    Type: Application
    Filed: August 25, 2023
    Publication date: July 10, 2025
    Inventors: Jie SUN, Yue LI, Qiuxu WEI, Lihui WANG, Weilong GUO, Taonan ZHANG, Nana HE, Wenbo CHANG, Feng QU
  • Publication number: 20250009452
    Abstract: An implantation system for a cochlear implant microelectrode with remote motion center control includes: an electrode implantation device including at least one pair of forceps, and a distal end part of the forceps is used as a remote motion center; a six-degree-of-freedom motion mechanism; an input unit, configured to input a surgical trajectory; and a control unit, configured to calculate, a displacement of the forceps in a first body coordinate system, an offset compensation of each motion execution unit at the front end at a corresponding degree of freedom in the first body coordinate system, and an offset compensation of each motion execution unit at the rear end at a corresponding degree of freedom in a second body coordinate system, and drive, based on the corresponding offset compensation and a preset motion priority, the forceps and the corresponding motion execution unit to act.
    Type: Application
    Filed: July 3, 2024
    Publication date: January 9, 2025
    Inventors: Hao WU, Huan JIA, Haoyue TAN, Weilong GUO, Lianchao LI, Azhar Aulia Saputra
  • Publication number: 20240426680
    Abstract: An MEMS pressure sensor, a method for manufacturing an MEMS pressure sensor, and a pressure detection device are provided. The MEMS pressure sensor includes: an adapter board; an integrated circuit chip on one side of the adapter board; and a sensor chip on a side of the adapter board away from the integrated circuit chip. The sensor chip includes a first electrode and a second electrode, and the first electrode is between the adapter board and the second electrode; the second electrode includes a pressure-sensitive portion opposite to the first electrode and an edge portion surrounding the pressure-sensitive portion, the edge portion is fixed onto the adapter board by a bonding layer, and the first electrode, the second electrode, the bonding layer and the adapter board define a cavity. The first and second electrodes of the sensor chip are electrically connected to the integrated circuit chip through the adapter board.
    Type: Application
    Filed: January 3, 2023
    Publication date: December 26, 2024
    Inventors: Qiuxu WEI, Yue LI, Lihui WANG, Weilong GUO, Yanfei REN, Taonan ZHANG, Wenbo CHANG, Jie SUN, Nana HE, Shaohua WU, Guochen DU, Ding DING, Feng QU
  • Publication number: 20240359972
    Abstract: Provided is a package structure, including: an insulating dielectric layer having a first surface and a second surface opposite to each other, wherein at least one first accommodation space running from the first surface to the second surface is formed in the insulating dielectric layer; and at least one conductive post in one-to-one correspondence with the at least one first accommodation space, wherein the conductive post is within the corresponding first accommodation space, a material of the conductive post comprises a non-metallic conductive material, and an absolute value of a difference between a thermal expansion coefficient of the conductive post and a thermal expansion coefficient of the insulating dielectric layer is less than or equal to 8×10?6/° C.; wherein the at least one conductive post comprises at least one first conductive post, two end faces of the first conductive post are flush with the first surface and the second surface, respectively.
    Type: Application
    Filed: July 9, 2024
    Publication date: October 31, 2024
    Inventors: Lihui WANG, Yue LI, Qiuxu WEI, Weilong GUO, Wenbo CHANG, Taonan ZHANG, Jie SUN, Nana HE, Yanfei REN, Feng QU
  • Publication number: 20240319031
    Abstract: Disclosed are a barometric pressure sensor and a method for preparing the same, and an electronic device, which relate to the technical field of sensors. The barometric pressure sensor includes a base substrate, and a first capacitor provided on a side of the base substrate. The first capacitor includes a first bottom electrode provided close to the base substrate; a first insulating layer provided on a side of the first bottom electrode away from the base substrate; and a first top electrode provided on a side of the first insulating layer away from the base substrate. The first top electrode is provided with a first opening which is configured to expose the first insulating layer at a corresponding position. A dielectric constant of the first insulating layer may vary with different humidity environments, so that a capacitance value of the first capacitor varies.
    Type: Application
    Filed: April 18, 2024
    Publication date: September 26, 2024
    Applicants: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Taonan Zhang, Yue Li, Qiuxu Wei, Weilong Guo, Lihui Wang, Jie Sun, Nana He, Wenbo Chang, Feng Qu
  • Patent number: 10826286
    Abstract: A device for jump starting a vehicle with a depleted vehicle battery includes a power supply, a detecting unit, a microcontroller unit (MCU), and two output ports. At least one of the at least one of the two output ports may include a clamp. The detecting unit may be configured to detect a signal indicative of an open/closed state of the clamp. The microcontroller unit (MCU) may be configured to cut off an electrical connection of the clamp with a power supply of a booster basing on the detected signal indicative of the closed state of the clamp.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: November 3, 2020
    Assignees: SHEN ZHEN JQB INDUSTRIAL CO., LTD., JUST QUALITY BATTERY INDUSTRIAL CO., LTD.
    Inventors: Weilong Guo, Huihong Tang, Waihon Cheung, Mingchung Mui
  • Publication number: 20190081472
    Abstract: A device for jump starting a vehicle with a depleted vehicle battery includes a power supply, a detecting unit, a microcontroller unit (MCU), and two output ports. At least one of the at least one of the two output ports may include a clamp. The detecting unit may be configured to detect a signal indicative of an open/closed state of the clamp. The microcontroller unit (MCU) may be configured to cut off an electrical connection of the clamp with a power supply of a booster basing on the detected signal indicative of the closed state of the clamp.
    Type: Application
    Filed: July 4, 2016
    Publication date: March 14, 2019
    Applicants: SHEN ZHEN JQB INDUSTRIAL CO., LTD, JUST QUALITY BATTERY INDUSTRIAL CO., LTD
    Inventors: Weilong GUO, Huihong TANG, Waihon CHEUNG, Mingchung MUI