Abstract: An amplifier may include multiple transistors with two transistors having their gates tied together via a common connection. The amplifier may utilize a local common mode feedback resistor as part of the amplifier. The local common mode feedback resistor may be coupled between the common connection and respective terminals of two transistors of multiple transistors. The local common mode feedback resistor may include a group of resistors coupled in series. The local common mode feedback resistor may also include a metal oxide semiconductor (MOS) resistor coupled in parallel with one or more of the first group of resistors. In the local common mode feedback, the first MOS resistor provides different levels of resistance to different process corners to reduce overshoot when the amplifier is enabled.

Abstract: Systems and devices are provided for tracking bandgap current generated by a bandgap circuit and mitigation of leakage current regardless of variations in PVT conditions. An apparatus may include one or more power amplifiers that powers components of the apparatus and comprising a transistor. The apparatus may also include bandgap current mirroring circuitry that generates a mirrored current that mirrors a received current that is process, voltage, and temperature (PVT) independent. The apparatus may also include a bulk voltage generator circuit including an amplifier having an input coupled to the bandgap current mirroring circuitry. Bulk voltage control circuitry is coupled to an output of the amplifier and generates a bulk voltage based on the relationship between the mirrored current and the leakage current.

Abstract: A device includes source circuitry comprising a first portion of a current mirror and a first transistor. The device also includes load circuitry comprising a second portion of the current mirror and a second transistor, wherein the load circuitry is disposed at a distance from the source circuitry. The device further includes a path coupled to a first gate of the first transistor and to a second gate of the second transistor, wherein the path provides a predetermined voltage to both of the first gate of the first transistor and to the second gate of the second transistor.

Abstract: Systems, methods, and apparatuses relating to interlocking transistor active regions are disclosed. An apparatus includes a gate including electrically conductive material and an active material including a doped semiconductor material. A portion of the active material overlapped by the gate has an at least substantially triangular shape. An apparatus includes a plurality of active materials. Each active material includes tapered ends and a plurality of gates. The plurality of active materials is arranged in an interlocking pattern with at least some tapered ends of the active materials interlocking with at least some others of the tapered ends. The plurality of gates overlaps the interlocked tapered ends of the plurality of active materials.

Abstract: A device includes source circuitry comprising a first portion of a current mirror and a first transistor. The device also includes load circuitry comprising a second portion of the current mirror and a second transistor, wherein the load circuitry is disposed at a distance from the source circuitry. The device further includes a path coupled to a first gate of the first transistor and to a second gate of the second transistor, wherein the path provides a predetermined voltage to both of the first gate of the first transistor and to the second gate of the second transistor.

Abstract: An amplifier includes a first stage and a second stage. The first stage includes a floating current source to maintain current within a threshold. The first stage also includes a local common mode feedback configured to provide gain to an input signal. Moreover, the second stage includes a driver that provides a load current to a load coupled to the amplifier.

Abstract: A semiconductor device may include a bandgap circuit that outputs a reference voltage. The bandgap circuit may include a bandgap core circuit and a startup circuit coupled to the bandgap core circuit. The startup circuit may connect a voltage source to a node that corresponds to an output of the bandgap core circuit in response to the bandgap core circuit being initialized. The startup circuit may also disconnect the voltage source from the node in response to the output voltage being equal to or greater than a desired voltage (e.g., a threshold voltage) and one or more local voltages of the bandgap core circuit being equal to or greater than a local threshold voltage.

Abstract: Embodiments herein relate to protection of a standby amplifier of a memory device. Specifically, an input voltage of the standby amplifier may be reduced to decrease an occurrence of damage to the standby amplifier or components thereof. In some embodiments, the input voltage may be reduced using a voltage divider that provides the reduced input voltage to the standby amplifier during a power up operation. Upon completion of the power up operation, the input voltage of the standby amplifier may return to an operating voltage. The reduced input voltage may reduce the occurrence of damage to the standby amplifier by maintaining a gate to drain voltage of one or more transistors of the standby amplifier below a maximum.

Abstract: A memory device includes a voltage generator configured to generate a reference voltage for transmission to at least one component of the memory device. The voltage generator includes a first input to receive a first signal having a first voltage value. The voltage generator also includes a second input to receive a second signal having a second voltage value. The voltage generator further includes a first circuit configured to generate third voltage and a second circuit coupled to the first circuit to receive the third voltage value, wherein the second circuit receives the first signal and the second signal and is configured to utilize the third voltage value to facilitate comparison of the first voltage value and the second voltage value to generate an output voltage.

Abstract: An amplifier includes a first stage and a second stage. The first stage includes a floating current source to maintain current within a threshold. The first stage also includes a local common mode feedback configured to provide gain to an input signal. Moreover, the second stage includes a driver that provides a load current to a load coupled to the amplifier.

Abstract: Systems and devices are provided for tracking bandgap current generated by a bandgap circuit and mitigation of leakage current regardless of variations in PVT conditions. An apparatus may include one or more power amplifiers that powers components of the apparatus and comprising a transistor. The apparatus may also include bandgap current mirroring circuitry that generates a mirrored current that mirrors a received current that is process, voltage, and temperature (PVT) independent. The apparatus may also include a bulk voltage generator circuit including an amplifier having an input coupled to the bandgap current mirroring circuitry. Bulk voltage control circuitry is coupled to an output of the amplifier and generates a bulk voltage based on the relationship between the mirrored current and the leakage current.

Abstract: Methods, systems, and devices for compensating for kickback noise are described. A regulator may include an input circuit, a bias circuit, and an enable circuit. The regulator may be configured so that the enable circuit is positioned between the input circuit and the bias circuit. A balance resistor may be included in a path between an input of the regulator and a gate of a bias transistor included in the bias transistor. A size of the balance resistor may be based on an amount of charge drawn by the bias transistor during an activation event. Dimensions of the bias transistor may be modified based on an amount of charge drawn by the bias transistor during an activation event.

Abstract: Embodiments herein relate to protection of a standby amplifier of a memory device. Specifically, an input voltage of the standby amplifier may be reduced to decrease an occurrence of damage to the standby amplifier or components thereof. In some embodiments, the input voltage may be reduced using a voltage divider that provides the reduced input voltage to the standby amplifier during a power up operation. Upon completion of the power up operation, the input voltage of the standby amplifier may return to an operating voltage. The reduced input voltage may reduce the occurrence of damage to the standby amplifier by maintaining a gate to drain voltage of one or more transistors of the standby amplifier below a maximum.

Abstract: Methods, systems, and devices for operating an amplifier with a controllable pull-down capability are described. A memory device may include a memory array and a power circuit that generates an internal signal for components in the memory array. The power circuit may include an amplifier and a power transistor that is coupled with the amplifier. A pull-down capability of the amplifier may be controllable using an external signal that is based on a difference between a reference signal and the internal signal. The power circuit may also include a comparator that is coupled with the amplifier and configured to compare the reference signal and the internal signal. Components of the comparator may be integrated with components of the amplifier, may share a bias circuit, and may use nodes within the amplifier to control the comparator. A signal output by the comparator may control the pull-down capability of the amplifier.

Abstract: Methods, systems, and devices for timing signal delay compensation in a memory device are described. In some memory devices, operations for accessing memory cells may be performed with timing that is asynchronous relative to an input signal. To support asynchronous timing, a memory device may include delay components that support generating a timing signal having aspects that are delayed relative to an input signal. In accordance with examples as disclosed herein, a memory device may include delay components having a variable and configurable impedance, where the configurable impedance may be based at least in part on a configuration signal generated at the memory device. A configuration signal may be generated based on fabrication characteristics of the memory device, or based on operating conditions of the memory device, or various combinations thereof.

Abstract: A memory device includes a voltage generator configured to generate a reference voltage for transmission to at least one component of the memory device. The voltage generator includes a first input to receive a first signal having a first voltage value. The voltage generator also includes a second input to receive a second signal having a second voltage value. The voltage generator further includes a first circuit configured to generate third voltage and a second circuit coupled to the first circuit to receive the third voltage value, wherein the second circuit receives the first signal and the second signal and is configured to utilize the third voltage value to facilitate comparison of the first voltage value and the second voltage value to generate an output voltage.

Abstract: A semiconductor device may include a bandgap circuit that outputs a reference voltage. The bandgap circuit may include a bandgap core circuit and a startup circuit coupled to the bandgap core circuit. The startup circuit may connect a voltage source to a node that corresponds to an output of the bandgap core circuit in response to the bandgap core circuit being initialized. The startup circuit may also disconnect the voltage source from the node in response to the output voltage being equal to or greater than a desired voltage (e.g., a threshold voltage) and one or more local voltages of the bandgap core circuit being equal to or greater than a local threshold voltage.

Abstract: An amplifier may include multiple transistors with two transistors having their gates tied together via a common connection. The amplifier may utilize a local common mode feedback resistor as part of the amplifier. The local common mode feedback resistor may be coupled between the common connection and respective terminals of two transistors of multiple transistors. The local common mode feedback resistor may include a group of resistors coupled in series. The local common mode feedback resistor may also include a metal oxide semiconductor (MOS) resistor coupled in parallel with one or more of the first group of resistors. In the local common mode feedback, the first MOS resistor provides different levels of resistance to different process corners to reduce overshoot when the amplifier is enabled.

Abstract: Devices and methods include voltage buses. The devices also include one or more power amplifiers coupled to the voltage bus. Each of the one or more power amplifiers include one or more transistors. The devices also include a model that is configured to emulate leakage from at least one of the one or more transistors. A current mirror with a first transistor coupled to the model and a second transistor coupled to the voltage bus. The current mirror is configure to draw charge from the voltage bus based at least in part on the emulated leakage from the model.

Abstract: Devices and methods include voltage buses. The devices also include one or more power amplifiers coupled to the voltage bus. Each of the one or more power amplifiers include one or more transistors. The devices also include a model that is configured to emulate leakage from at least one of the one or more transistors. A current mirror with a first transistor coupled to the model and a second transistor coupled to the voltage bus. The current mirror is configure to draw charge from the voltage bus based at least in part on the emulated leakage from the model.