Abstract: A circuit board includes a substrate and a first metal circuit layer. The substrate has an upper surface and a lower surface opposite to the upper surface. The first metal circuit layer is located on the upper surface, and the first metal circuit layer includes a first line area and a second line area. The first line area and the second line area are separated by a groove area, and the groove area includes a bent section. Accordingly, the risk of detachment between the first metal circuit layer and the substrate due to stress concentration on the circuit board can be reduced.

Abstract: A double-sided power device and a method for manufacturing the double-sided power device are provided. The double-sided power device includes a first power module, a second power module, two support members, and an encapsulant. The first power module includes a first power chip. The second power module includes a second power chip. The first power module is opposite to the second power module, and a packaging space is defined between the first power module and the second power module. The two support members are located in the packaging space to be connected to the first power module and the second power module, respectively. The encapsulant is filled in the packaging space.

Abstract: A circuit substrate assembly and a power module are provided. The circuit substrate assembly includes a first conductive block, a second conductive block, a first connecting adhesive body, and at least one first conductive layer. The first conductive block has a first top surface and a first bottom surface opposite to each other. The second conductive block has a second top surface and a second bottom surface opposite to each other. A first channel is formed between the second conductive block and the first conductive block. The first connecting adhesive body is filled in the first channel to connect the first conductive block and the second conductive block. The at least one first conductive layer is attached to the first surface of the first connecting adhesive body and spans the first conductive block and the second conductive block that are isolated by the first connecting adhesive body.

Abstract: A power management circuit including a control circuit and a blanking detecting circuit is provided. The control circuit is configured to output a control signal to control a power conversion operation of a power converter circuit. The blanking detecting circuit is coupled to the control circuit. The blanking detecting circuit is configured to receive a plurality of clock signals, detect a disable state of the clock signals, and turn off the control circuit when the disable state of the clock signals is detected.

Abstract: A power module package is provided. The power module package includes an electronic assembly that includes a substrate and a power device group. The substrate includes an insulating layer, a circuit pattern layer, and a conductive heat-dissipating layer. The circuit pattern layer and the conductive heat-dissipating layer are respectively disposed at two opposite sides of the insulating layer. The power device group is disposed on the circuit pattern layer, and the power device group and the circuit pattern layer are configured to form a common circuit. A total area of the conductive heat-dissipating layer is greater than that of the circuit pattern layer, and a thickness of the circuit pattern layer is greater than that of the insulating layer.

Abstract: A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.

Abstract: A circuit board includes a substrate and a first metal circuit layer. The substrate has an upper surface and a lower surface opposite to the upper surface. The first metal circuit layer is located on the upper surface, and the first metal circuit layer includes a first line area and a second line area. The first line area and the second line area are separated by a groove area, and the groove area includes a bent section. Accordingly, the risk of detachment between the first metal circuit layer and the substrate due to stress concentration on the circuit board can be reduced.

Abstract: A power module package is provided. The power module package includes an electronic assembly that includes a substrate and a power device group. The substrate includes an insulating layer, a circuit pattern layer, and a conductive heat-dissipating layer. The circuit pattern layer and the conductive heat-dissipating layer are respectively disposed at two opposite sides of the insulating layer. The power device group is disposed on the circuit pattern layer, and the power device group and the circuit pattern layer are configured to form a common circuit. A total area of the conductive heat-dissipating layer is greater than that of the circuit pattern layer, and a thickness of the circuit pattern layer is greater than that of the insulating layer.

Abstract: A power module package is provided. The power module package includes an electronic assembly, a first terminal assembly and a second terminal assembly. The electronic assembly at least includes a substrate. The first terminal assembly includes a first power device terminal, and the second terminal assembly includes a second power device terminal. The first power device terminal and the second power device terminal respectively extend from different surfaces of the substrate to form a height difference therebetween. The first power device terminal includes a first contact section and a first non-contact section. The first contact section is directly connected to the substrate, and the first non-contact section is not in contact with the substrate. The substrate protrudes from the first contact section and extends to a position under the first non-contact section.

Abstract: A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.

Abstract: A patterned substrate includes a substrate body and a plurality of solid patterns. The solid patterns are set on the substrate body, and at least partial pitches between the solid patterns are different.

Abstract: A patterned substrate comprises a substrate body and a plurality of solid patterns disposed on the substrate body. The pitch of at least a part of the adjacent solid patterns is between 1.5 ?m and 2.5 ?m, the space of at least a part of the adjacent solid patterns is between 0.1 ?m and 0.7 ?m, and the height of at least a part of the solid patterns is between 0.7 ?m and 1.7 ?m. An electro-optical semiconductor element containing the patterned substrate is also disclosed.

Abstract: The present invention is to provide a flyback energy converter comprising a transformer having a primary winding, a secondary winding and an auxiliary winding, a load electrically connected with the secondary winding, a switch serially connected with the primary winding and a primary controlling circuit. The primary controlling circuit comprises a voltage measurement terminal and a switch controlling terminal. The voltage measurement terminal measures an output voltage wave provided from the auxiliary winding to get a part of times in the part of the output voltage wave, so as to enlarge the part of times to a total time. According to a predetermined timing transferred from the total time, the switch controlling terminal controls the switch.