Abstract: A method of sampling phase calibration and a device thereof is suitable for an analog-to-digital converter and phase lock loop (ADC-PLL). The ADC-PLL conducts sampling on a periodic analog signal according to a sampling phase so as to produce a plurality of digital signals. The sampling phase calibration device includes a storage unit, a motion-detecting unit and a control unit. The motion-detecting unit is to calculate the number of motion data corresponding to a sampling phase. The control unit is coupled to the motion-detecting unit for changing the sampling phase so as to obtain the number of motion data corresponding to each sampling phase and selecting the sampling phase corresponding to the minimum number of motion data as an optimal sampling phase. The ADC-PLL can correctly sample an analog signal by using the optimal sampling phase and reduce the influence of clock jitter to the minimum.

Abstract: A method of sampling phase calibration and a device thereof is suitable for an analog-to-digital converter and phase lock loop (ADC-PLL). The ADC-PLL conducts sampling on a periodic analog signal according to a sampling phase so as to produce a plurality of digital signals. The sampling phase calibration device includes a storage unit, a motion-detecting unit and a control unit. The motion-detecting unit is to calculate the number of motion data corresponding to a sampling phase. The control unit is coupled to the motion-detecting unit for changing the sampling phase so as to obtain the number of motion data corresponding to each sampling phase and selecting the sampling phase corresponding to the minimum number of motion data as an optimal sampling phase. The ADC-PLL can correctly sample an analog signal by using the optimal sampling phase and reduce the influence of clock jitter to the minimum.

Abstract: A flip chip semiconductor package is disclosed according to the present invention, the flip chip semiconductor package comprises a chip that is mounted on and electrically connects to a leadframe via a plurality of solder bumps by means of flip chip, and an encapsulate that encapsulates the chip, the plurality of solder bumps, and the leadframe, wherein, the leadframe further comprises a plurality of leads and a ground plane that is located between the plurality of leads, and also a slit is formed on the ground plane, and then a molding compound that makes up the encapsulant should be capable of filling within the slit, thus to enhance the adhesion between the ground plane and the encapsulant, and then avoid delamination between the ground plane and the encapsulant in subsequent thermal cycle processes, thereby increasing the reliability of fabricated products.

Abstract: The is to disclose a semiconductor package featuring inclusion of light emitter(s) providing light to indicate the states of the semiconductor package as a whole and/or the chip(s) therein. The light emitter is in an original state or flashing state or emitting state according to the states of the semiconductor package as a whole and/or the chip(s). The semiconductor package includes a carrier and a shield structure in addition to the light emitter. The chip and at least part of the carrier are covered by the shield structure. The light emitter may be partially or fully covered or sealed by the shield structure. The light emitter may also be partially or fully exposed. The shield structure is such that the light provided by the light emitter sealed therein can pass therethrough to reach the outside thereof, thereby the states of the semiconductor package as a whole and/or the chip(s) can be recognized from the outside of the semiconductor package.

Abstract: The is to disclose a semiconductor package featuring inclusion of light emitter(s) providing light to indicate the states of the semiconductor package as a whole and/or the chip(s) therein. The light emitter is in an original state or flashing state or emitting state according to the states of the semiconductor package as a whole and/or the chip(s). The semiconductor package includes a carrier and a shield structure in addition to the light emitter. The chip and at least part of the carrier are covered by the shield structure. The light emitter may be partially or fully covered or sealed by the shield structure. The light emitter may also be partially or fully exposed. The shield structure is such that the light provided by the light emitter sealed therein can pass therethrough to reach the outside thereof, thereby the states of the semiconductor package as a whole and/or the chip(s) can be recognized from the outside of the semiconductor package.