Abstract: A method for automatic power negotiation for electric vehicle-to-vehicle charge transfer, includes connecting a donor electric vehicle to a receiver electric vehicle via a charging cable of a charging cable system and receiving from a control box of the charging cable system, an initial power setting for the donor electric vehicle. The method also includes determining if the initial power setting has a non-zero value and if the initial power setting has a non-zero value, determining if the initial power setting is acceptable by the donor electric vehicle. The method further includes if the initial power setting is acceptable by the donor electric vehicle, repeatedly increasing the initial power setting to a higher power setting until a maximum power setting is determined and transferring an electric charge from the donor electric vehicle to the receiver electric vehicle along the charging cable based on the maximum power setting.

Abstract: The is to disclose a semiconductor package featuring inclusion of light emitter(s) providing light to indicate the states of the semiconductor package as a whole and/or the chip(s) therein. The light emitter is in an original state or flashing state or emitting state according to the states of the semiconductor package as a whole and/or the chip(s). The semiconductor package includes a carrier and a shield structure in addition to the light emitter. The chip and at least part of the carrier are covered by the shield structure. The light emitter may be partially or fully covered or sealed by the shield structure. The light emitter may also be partially or fully exposed. The shield structure is such that the light provided by the light emitter sealed therein can pass therethrough to reach the outside thereof, thereby the states of the semiconductor package as a whole and/or the chip(s) can be recognized from the outside of the semiconductor package.

Abstract: The is to disclose a semiconductor package featuring inclusion of light emitter(s) providing light to indicate the states of the semiconductor package as a whole and/or the chip(s) therein. The light emitter is in an original state or flashing state or emitting state according to the states of the semiconductor package as a whole and/or the chip(s). The semiconductor package includes a carrier and a shield structure in addition to the light emitter. The chip and at least part of the carrier are covered by the shield structure. The light emitter may be partially or fully covered or sealed by the shield structure. The light emitter may also be partially or fully exposed. The shield structure is such that the light provided by the light emitter sealed therein can pass therethrough to reach the outside thereof, thereby the states of the semiconductor package as a whole and/or the chip(s) can be recognized from the outside of the semiconductor package.