Patents by Inventor Wei-Min Wang

Wei-Min Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240397621
    Abstract: A circuit board device includes a transition region that includes a first conductive layer at a first level, a second conductive layer at a second level, and conductive vias. The first conductive layer includes a pad connected to the solderless connector, a transmission line, and a first reference layer. The transmission line includes first and second segments. A second width of the second segment is the same as or less than a first width of the first segment. The first reference layer has a first anti-pad region for the pad and the transmission line disposed therein. In a plan view, the first anti-pad region surrounding the pad is completely located within a second anti-pad region of a second reference layer of the second conductive layer. The conductive vias are disposed between the first and second conductive layers and surround the pad.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 28, 2024
    Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan University
    Inventors: Chin-Hsun WANG, Ruey-Beei WU, Chun-Jui HUANG, Wei-Yu LIAO, Ching-Sheng CHEN, Chi-Min CHANG
  • Publication number: 20240379758
    Abstract: A semiconductor device structure and methods of forming the same are described. In some embodiments, the structure includes an N-type source/drain epitaxial feature disposed over a substrate, a P-type source/drain epitaxial feature disposed over the substrate, a first silicide layer disposed directly on the N-type source/drain epitaxial feature, and a second silicide layer disposed directly on the P-type source/drain epitaxial feature. The first and second silicide layers include a first metal, and the second silicide layer is substantially thicker than the first silicide layer. The structure further includes a third silicide layer disposed directly on the first silicide layer and a fourth silicide layer disposed directly on the second silicide layer. The third and fourth silicide layer include a second metal different from the first metal, and the third silicide layer is substantially thicker than the fourth silicide layer.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 14, 2024
    Inventors: Wei-Yip LOH, Hong-Mao LEE, Harry CHIEN, Po-Chin CHANG, Sung-Li WANG, Jhih-Rong HUANG, Tzer-Min SHEN, Chih-Wei CHANG
  • Publication number: 20240371715
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.
    Type: Application
    Filed: July 15, 2024
    Publication date: November 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang
  • Patent number: 12133323
    Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: October 29, 2024
    Assignees: UNIMICRON TECHNOLOGY CORP., NATIONAL TAIWAN UNIVERSITY
    Inventors: Chin-Hsun Wang, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Huang, Wei-Yu Liao, Chi-Min Chang
  • Patent number: 12094792
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: September 17, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang
  • Publication number: 20240285178
    Abstract: Provided is an optical sensor for monitoring pulse waveform and blood pressure of a subject. The optical sensor may be manufactured with compact structure, low profile, low cost, and exhibits benefits of disposability, easy to apply, immunity to electro-magnetic interference, high sensitivity, having minimal affect towards sense of touch, maintains patient safety, and supportive of accurate real-time measurements for the clinician. Therefore, pulse waveform and blood pressures of a subject may be faithfully monitored continuously throughout day and night, so as to provide abundant prognostic information while avoiding interference in normal daily activity of the subject. Also provided is a system utilizing the optical sensors for monitoring pulse waveform and blood pressure of a subject.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 29, 2024
    Inventors: Wei-Chih Wang, Chun-Cheng Liu, Fiona Marie Wang, Hao-Min Cheng, Chen-Huan Chen
  • Publication number: 20240249983
    Abstract: A light-emitting device includes a substrate, a light-emitting diode, a first layer, a color filter layer, and a second layer. The light-emitting diode is disposed on the substrate. The first layer is disposed on the substrate and has an opening. At least a portion of the light-emitting diode is disposed in the opening of the first layer. The color filter layer is disposed on the light-emitting diode. The second layer is disposed on the first layer and has an opening overlapped with the opening of the first layer. The second layer is configured to shield light emitted from the light-emitting diode. In the cross-sectional view of the light-emitting device, the minimum width of the opening of the first layer is less than the minimum width of the opening of the second layer.
    Type: Application
    Filed: April 2, 2024
    Publication date: July 25, 2024
    Inventors: Tung-Kai LIU, Tsau-Hua HSIEH, Wei-Cheng CHU, Chun-Hsien LIN, Chandra LIUS, Ting-Kai HUNG, Kuan-Feng LEE, Ming-Chang LIN, Tzu-Min YAN, Hui-Chieh WANG
  • Publication number: 20240169479
    Abstract: The present disclosure provides systems and methods for video generation using latent diffusion machine learning models. Given a text input, video data relevant to the text input can be generated using a latent diffusion model. The process includes generating a predetermined number of key frames using text-to-image generation tasks performed within a latent space via a variational auto-encoder, enabling faster training and sampling times compared to pixel space-based diffusion models. The process further includes utilizing two-dimensional convolutions and associated adaptors to learn features for a given frame. Temporal information for the frames can be learned via a directed temporal attention module used to capture the relation among frames and to generate a temporally meaningful sequence of frames. Additional frames can be generated via a frame interpolation process for inserting one or more transition frames between two generated frames.
    Type: Application
    Filed: November 17, 2022
    Publication date: May 23, 2024
    Inventors: Wei Min Wang, Daquan Zhou, Jiashi Feng
  • Patent number: 11859663
    Abstract: A linear guideway, a sliding module thereof, and a circulation seat thereof are provided. The circulation seat has an inherently one-piece structure, which includes two turning portions, a middle retaining portion, and two lateral retaining portions. The middle retaining portion has a two-stepped structure, which includes a connection bar and a limiting bar that is connected to the connection bar. The connection bar is connected to and arranged between the two turning portions, and a distance between two long lateral surfaces of the connection bar gradually increases along a direction away from the limiting bar. The two lateral retaining portions are connected to and arranged between the two turning portions, and the two lateral retaining portions are respectively located at two opposite sides of the middle retaining portion.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: January 2, 2024
    Assignee: OME TECHNOLOGY CO., LTD.
    Inventors: Kuo-Fu Liao, Wen-Bin Wu, Jo-Hsuan Chang, Wei-Min Wang, Jhih-Jie Luo
  • Publication number: 20230332642
    Abstract: A linear guideway, a sliding module thereof, and a circulation seat thereof are provided. The circulation seat has an inherently one-piece structure, which includes two turning portions, a middle retaining portion, and two lateral retaining portions. The middle retaining portion has a two-stepped structure, which includes a connection bar and a limiting bar that is connected to the connection bar. The connection bar is connected to and arranged between the two turning portions, and a distance between two long lateral surfaces of the connection bar gradually increases along a direction away from the limiting bar. The two lateral retaining portions are connected to and arranged between the two turning portions, and the two lateral retaining portions are respectively located at two opposite sides of the middle retaining portion.
    Type: Application
    Filed: June 10, 2022
    Publication date: October 19, 2023
    Inventors: KUO-FU LIAO, WEN-BIN WU, JO-HSUAN CHANG, WEI-MIN WANG, JHIH-JIE LUO
  • Patent number: 10324262
    Abstract: An assembly for splicing first and second optical fibers is contemplated. The assembly typically comprises a splicing member disposed within a barrel member. A first optical fiber can be inserted through a first end of the barrel member, and a second optical fiber can be inserted through a second end of the barrel member to splice ends of the first and second optical fibers in the splicing member. A recess at the second end of the barrel can be used to lock the second optical cable, and a clamping member can be used to hold the second optical fiber. An optical fiber stub holder can couple the first end of the barrel member and an optical fiber stub from which the first optical fiber extends. Thus, the first and second optical fibers can be effectively secured in a splicing relationship using the assembly.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: June 18, 2019
    Inventor: Wei Min Wang
  • Publication number: 20190179083
    Abstract: An assembly for splicing first and second optical fibers is contemplated. The assembly typically comprises a splicing member disposed within a barrel member. A first optical fiber can be inserted through a first end of the barrel member, and a second optical fiber can be inserted through a second end of the barrel member to splice ends of the first and second optical fibers in the splicing member. A recess at the second end of the barrel can be used to lock the second optical cable, and a clamping member can be used to hold the second optical fiber. An optical fiber stub holder can couple the first end of the barrel member and an optical fiber stub from which the first optical fiber extends. Thus, the first and second optical fibers can be effectively secured in a splicing relationship using the assembly.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 13, 2019
    Inventor: Wei Min WANG
  • Patent number: 9190938
    Abstract: A piezoelectric actuating device includes a carrier, at least a piezoelectric unit, at least a linked component and a moving component. The piezoelectric unit is disposed on the carrier and includes at least a piezoelectric buzzer. The linked component is disposed corresponding to the piezoelectric unit. One end of the linked component is attached to the piezoelectric buzzer. The moving component is connected with the linked component. When the piezoelectric buzzer is actuated, it can carry the linked component to move correspondingly so as to move the moving component. The piezoelectric actuating device has the advantage of low cost and can achieve the sub-nanometer scale actuating resolution.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: November 17, 2015
    Assignee: Academia Sinica
    Inventors: En-Te Hwu, Ing-Shouh Hwang, Wei-Min Wang
  • Patent number: 8893627
    Abstract: A linear actuator includes a housing, a rotary unit disposed in the housing, and a screw member driven by the rotary unit. The rotary unit is translatable relative to the housing when the screw member is driven by the rotary unit.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: November 25, 2014
    Assignee: Academia Sinica
    Inventors: En-Te Hwu, Ing-Shouh Hwang, Wei-Min Wang
  • Publication number: 20130291669
    Abstract: A linear actuator includes a housing, a rotary unit disposed in the housing, and a screw member driven by the rotary unit. The rotary unit is translatable relative to the housing when the screw member is driven by the rotary unit.
    Type: Application
    Filed: April 2, 2013
    Publication date: November 7, 2013
    Applicant: Academia Sinica
    Inventors: En-Te HWU, Ing-Shouh HWANG, Wei-Min WANG
  • Patent number: 7883275
    Abstract: A three rod bundle confined inside a sleeve is constructed as a light guiding fiber mechanical splicing device which is stiff, strong and precise, with no moving parts. The design also applies to splicing fibers to pre-polished optical connectors through a built-in model of this innovative mechanical splicer. Applying the Soddy circles formula and using a bin approach assists in deriving the exact rod sizes needed and sleeve bore size to accommodate the three-rod bundle, so that this apparatus can be properly designed to guide any size of light guide fibers and studs with minimum clearance. Rods of varying diameters are sorted into bins and chosen based upon the aperture desired, thus eliminating the need for tight tolerance of the diameters of the three rods. This unique design allows for construction of a precision virtual hole of very long depth, which enables two optical fiber studs to butt against each other with a core to core misalignment of less than 1 um for single mode fiber optics cables.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: February 8, 2011
    Inventor: Wei-Min Wang
  • Publication number: 20100303418
    Abstract: A three rod bundle confined inside a sleeve is constructed as a light guiding fiber mechanical splicing device which is stiff, strong and precise, with no moving parts. The design also applies to splicing fibers to pre-polished optical connectors through a built-in model of this innovative mechanical splicer. Applying the Soddy circles formula and using a bin approach assists in deriving the exact rod sizes needed and sleeve bore size to accommodate the three-rod bundle, so that this apparatus can be properly designed to guide any size of light guide fibers and studs with minimum clearance. Rods of varying diameters are sorted into bins and chosen based upon the aperture desired, thus eliminating the need for tight tolerance of the diameters of the three rods. This unique design allows for construction of a precision virtual hole of very long depth, which enables two optical fiber studs to butt against each other with a core to core misalignment of less than 1 um for single mode fiber optics cables.
    Type: Application
    Filed: May 27, 2009
    Publication date: December 2, 2010
    Inventor: Wei-Min Wang
  • Patent number: 7471489
    Abstract: The present invention provides unamount head/arm subassemblies and read-write head stack assembly for a disk drive, and a servowriter having the head stack assembly. Each head/arm subassembly is assembled and aligned individually so that multiple head/arm subassemblies can be installed on a mounting block to build the head stack assembly with all heads being properly aligned. In addition, each head/arm subassembly can be disassembled independently, facilitating easy rework on individual defect head.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: December 30, 2008
    Assignee: LaserResearch (S) Pte Ltd
    Inventors: Kien-Wee Lai, Wei-Min Wang, Jui-Kiat Goh
  • Patent number: 7394617
    Abstract: The present invention provides a hub/clamp assembly for holding a disk hub in position when the hub is spin in a high speed. The hub/clamp assembly comprises of: a removable disk hub having a shaft for stacking a plurality of storage disks, a flange portion integrally attached to one end of the shaft, and an extension shaft integrally attached to the flange portion opposite to the shaft; wherein the axes of the shaft, the flange portion, and the extension shaft are in alignment; and a hub clamp housing having a housing with side walls and top and bottom surfaces, and a clamp means disposed within the cavity formed within the housing. The present invention also provides a multi-disk servowriter for writing servo information onto multiple storage disks at the same time.
    Type: Grant
    Filed: May 26, 2005
    Date of Patent: July 1, 2008
    Assignee: LaserResearch (S) Pte Ltd
    Inventors: Kien-Wee Lai, Wei-Min Wang
  • Publication number: 20060061912
    Abstract: The present invention provides unamount head/arm subassemblies and read-write head stack assembly for a disk drive, and a servowriter having the head stack assembly. Each head/arm subassembly is assembled and aligned individually so that multiple head/arm subassemblies can be installed on a mounting block to build the head stack assembly with all heads being properly aligned.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 23, 2006
    Inventors: Kien-Wee Lai, Wei-Min Wang, Jui-Kiat Goh