Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.

Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.

Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.

Abstract: An integrated circuit includes a T-coil circuit, a silicon-controlled rectifier (SCR), and a signal-loss prevention circuit. The T-coil circuit is coupled to an input/output (I/O) pad and an internal circuit. The SCR is coupled to the T-coil circuit and the internal circuit. The signal-loss prevention circuit is coupled to the T-coil circuit and the SCR. The signal-loss prevention circuit includes a resistor coupled to the T-coil circuit and the SCR. An electrostatic current flows through the resistor and turns on the SCR. The signal-loss prevention circuit may also include a diode circuit coupled to the T-coil circuit and the SCR. The diode circuit is configured to prevent signal loss.

Abstract: An integrated circuit includes a T-coil circuit, a silicon-controlled rectifier (SCR), and a signal-loss prevention circuit. The T-coil circuit is coupled to an input/output (I/O) pad and an internal circuit. The SCR is coupled to the T-coil circuit and the internal circuit. The signal-loss prevention circuit is coupled to the T-coil circuit and the SCR. The signal-loss prevention circuit includes a resistor coupled to the T-coil circuit and the SCR. An electrostatic current flows through the resistor and turns on the SCR. The signal-loss prevention circuit may also include a diode circuit coupled to the T-coil circuit and the SCR. The diode circuit is configured to prevent signal loss.

Abstract: Packaging devices, methods of manufacture thereof, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging device includes a substrate including an integrated circuit die mounting region. An underfill material flow prevention feature is disposed around the integrated circuit die mounting region.

Abstract: In situ formation of U(VI)-Fe(III) oxides and hydroxides can provide effective uranium remediation. The reason for this is that such compounds can effectively sequester uranium, even in the (VI) oxidation state. Such compounds can be formed in situ by 1) providing Fe(II), 2) reducing uranium to U(IV), and 3) oxidizing the resulting mixture to provide the desired U(VI)-Fe(III) oxides and hydroxides.

Abstract: Methods for producing bioplastics from biogas include techniques for the production of PHB using a dirty biogas (e.g., methane from landfill, digester) as both a power source for the process and as feedstock. Biogas is split into two streams, one for energy to drive the process, another as feedstock. Advantageously, the techniques may be implemented off the power grid with no dependence upon agricultural products for feedstock.

Abstract: Methods and systems are disclosed for producing lactide, which can be used for PLA production or other valuable bioproducts. PLA is heated to undergo thermal depolymerization to recover lactide. The lactide can be used for PLA production or other valuable bioproducts.

Abstract: An electronic device is provided, including a main body, a display module pivotally connected to the main body, a first magnet in the main body, a second magnet in the display module, a lever movably disposed in the main body, and a joining member movably disposed in the main body and connected to the lever. When the display module and the main body are folded, the second magnet attracts the first magnet, and the lever pushes the joining member to protrude from the main body and join with the display module.

Abstract: Production of polyhydroxyalkanoates (PHAs) is performed by delivering substrates such as methane in gas phase during a high solids fermentation. Microorganisms are grown under balanced conditions, then gas phase substrates are delivered under unbalanced conditions to produce PHA granules inside the cells. The cells containing these granules are lysed and the bioplastic powder recovered. The balanced phase growth may occur in submerged liquid cultures or attached as biofilms to a surface.

Abstract: An electronic device is provided, including a main body, a display module pivotally connected to the main body, a first magnet in the main body, a second magnet in the display module, a lever movably disposed in the main body, and a joining member movably disposed in the main body and connected to the lever. When the display module and the main body are folded, the second magnet attracts the first magnet, and the lever pushes the joining member to protrude from the main body and join with the display module.

Abstract: In the present invention, an outer tire is supported and positioned by an auxiliary inner tire such that air can be pumped into the space between the inner and outer tires. When there is a flat tire or leakage, the outer tire is supported by the inner tire and still has an appropriate support to the car, and thus the outer tire will not be compressed completely or grinded by the rim of the wheel, so that the tire will not be damaged easily and the auxiliary inner tire can continue running for a short time.

Abstract: In the present invention, an outer tire is supported and positioned by an auxiliary inner tire such that air can be pumped into the space between the inner and outer tires. When there is a flat tire or leakage, the outer tire is supported by the inner tire and still has an appropriate support to the car, and thus the outer tire will not be compressed completely or grinded by the rim of the wheel, so that the tire will not be damaged easily and the auxiliary inner tire can continue running for a short time.

Abstract: A slidable cover mechanism for a notebook computer's main unit is disclosed, wherein the cover can be separated from the main unit by the method of sliding. The cover mechanism comprises: a top housing, a cover metal plate and housing fixing elements, wherein there are a plurality of components installed between the top housing and the cover metal plate. The top housing has a plurality of fixing holes through which the cover can be combined with the bottom case portion of the main unit. The top housing comprises: sliding hooks and clipping hooks, used for engaging with hinge support elements; a plurality of inserting elements, used for insetting with a plurality of grooves located on the bottom case portion; and a plurality of protrusions, used for inserting into the bottom housing of the bottom case portion.

Abstract: A slidable cover mechanism for a notebook computer's main unit is disclosed, wherein the cover can be separated from the main unit by the method of sliding. The cover mechanism comprises: a top housing, a cover metal plate and housing fixing elements, wherein there are a plurality of components installed between the top housing and the cover metal plate. The top housing has a plurality of fixing holes through which the cover can be combined with the bottom case portion of the main unit. The top housing comprises: sliding hooks and clipping hooks, used for engaging with hinge support elements; a plurality of inserting elements, used for insetting with a plurality of grooves located on the bottom case portion; and a plurality of protrusions, used for inserting into the bottom housing of the bottom case portion.

Abstract: The present invention relates to a biological method for dechlorinating polychlorinated biphenyls (PCBs) by inoculating a polychlorinated biphenyl containing sample with PCB dechlorinating anaerobic methanogenic granules. The granules are made by coculturing particles of a PCP-dechlorinating methanogenic microbial consortia and a PCB-dechlorinating microorganism under anaerobic conditions in an upflow anaerobic sludge blanket (USAB) reactor.