Patents by Inventor Weimin Xia

Weimin Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12727107
    Abstract: A computing node includes a housing, a first mainboard, a processor circuit board, and a first cable. The housing includes an accommodating cavity, and a coolant is disposed in the accommodating cavity. The processor circuit board includes a first surface, a second surface, and a first side surface. The first side surface of the processor circuit board faces the first mainboard, a processor is disposed on the first surface or the second surface of the processor circuit board, and the processor is electrically connected to the first mainboard. A plurality of first memories are disposed on the first mainboard, and a first end of the first cable is electrically connected to the first mainboard. A second end of the first cable is electrically connected to the processor circuit board. The processor is electrically connected to the plurality of first memories by using the first cable.
    Type: Grant
    Filed: December 6, 2024
    Date of Patent: September 1, 2026
    Assignee: xFusion Digital Technologies Co., Ltd
    Inventors: Weimin Xia, Zhongli Ji
  • Publication number: 20250331121
    Abstract: The present application provides a computing device and a node device, the computing device including a mounting member, a connecting member, a floating member, a connector, an electronic module, and a backplane system, where the mounting member is provided with a through slot, the through slot extends through the mounting member along a thickness direction of the mounting member, the connecting member is fixedly connected to the mounting member, the floating member is movably connected to the connecting member and is movable relative to the connecting member, the connector is fixedly connected to the floating member and is movable relative to the mounting member when driven by the floating member, the connector is electrically connected between the electronic module and the backplane system, the backplane system includes a terminal connecting member, the terminal connecting member includes a circuit board and a plurality of first conductive terminals.
    Type: Application
    Filed: June 30, 2025
    Publication date: October 23, 2025
    Inventors: Weimin XIA, Gang CHEN, Yuping DAN, Chengjian YANG
  • Publication number: 20250107030
    Abstract: A computing node includes a housing, a first mainboard, a processor circuit board, and a first cable. The housing includes an accommodating cavity, and a coolant is disposed in the accommodating cavity. The processor circuit board includes a first surface, a second surface, and a first side surface. The first side surface of the processor circuit board faces the first mainboard, a processor is disposed on the first surface or the second surface of the processor circuit board, and the processor is electrically connected to the first mainboard. A plurality of first memories are disposed on the first mainboard, and a first end of the first cable is electrically connected to the first mainboard. A second end of the first cable is electrically connected to the processor circuit board. The processor is electrically connected to the plurality of first memories by using the first cable.
    Type: Application
    Filed: December 6, 2024
    Publication date: March 27, 2025
    Applicant: xFusion Digital Technologies Co., Ltd
    Inventors: Weimin Xia, Zhongli Ji