Abstract: Generally, the present invention can be viewed as providing a method for manufacturing a multilayer wiring substrate. Briefly described, the method can be broadly conceptualized by the following steps: forming a first conductive connection on a first insulating layer; forming a conductive post on the first conductive connection; forming a second insulating layer on the first conductive connection, the first insulating layer, and the conductive post; exposing the conductive post by removing a portion of the second insulating layer; and forming a second conductive connection on the second insulating layer such that the second conductive connection is electrically connected to the first conductive connection via the conductive post. The second insulating layer can be formed via dry film lamination. In addition, the conductive posts can be exposed by either forming holes in the second insulating layer or by roughening the surface of the second insulating layer.