Abstract: A first and second semiconductor device are bonded together using a bonding contact pad embedded within a bonding dielectric layer of the first semiconductor device and at least one bonding via embedded within a bonding dielectric layer of the second semiconductor device. The bonding contact pad extends a first dimension in a first direction perpendicular to the major surface of the first semiconductor device and a second dimension in a second direction parallel to the plane of the first semiconductor wafer, the second dimension being at least twice the first dimension. The bonding via extends a third dimension in the first direction and a fourth dimension in the second direction, the third dimension being at least twice the first dimension. The bonding contact pad and bonding via may be at least partially embedded in respective bonding dielectric layers in respective topmost dielectric layers of respective stacked interconnect layers.

Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.

Abstract: A method for forming a semiconductor package is provided. The method includes forming a first alignment mark in a first substrate of a first wafer and forming a first bonding structure over the first substrate. The method also includes forming a second bonding structure over a second substrate of a second wafer and trimming the second substrate, so that a first width of the first substrate is greater than a second width of the second substrate. The method further includes attaching the second wafer to the first wafer via the first bonding structure and the second bonding structure, thinning the second wafer until a through-substrate via in the second substrate is exposed, and performing a photolithography process on the second wafer using the first alignment mark.

Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: A ubiquitous auto calibration device is provided, which includes microcontroller unit, flex bus, image receiver image processing module, and an image output unit. The microcontroller unit is provided for receiving the electronic signal and performing a self-adjusting process to the electronic signal. The flex bus is connected with the microcontroller unit, and is provided for transmitting the electronic signal to the image processing module after performing the self-adjusting process. The image receiver is provided for receiving the image signal from the image receiving interface. The image processing module is provided for performing an image calibration process to the image signal, so that the image signal can obey the color temperature standard, Gamma value, uniformity and color gamut standards when the panel outputs the image signal.

Abstract: A ubiquitous auto calibration device is provided, which includes microcontroller unit, flex bus, image receiver image processing module, and an image output unit. The microcontroller unit is provided for receiving the electronic signal and performing a self-adjusting process to the electronic signal. The flex bus is connected with the microcontroller unit, and is provided for transmitting the electronic signal to the image processing module after performing the self-adjusting process. The image receiver is provided for receiving the image signal from the image receiving interface. The image processing module is provided for performing an image calibration process to the image signal, so that the image signal can obey the color temperature standard, Gamma value, uniformity and color gamut standards when the panel outputs the image signal.

Abstract: A monitor correction apparatus and a monitor having the same are provided. The monitor having the monitor correction apparatus includes a display panel and a first frame. The first frame covers a perimeter of the display panel and defines a display area. The monitor correction apparatus includes a front bezel that is integrally formed with the first frame and covers a part of the display area. Moreover, the monitor correction apparatus includes guide pins that are formed inside the first frame and near the front bezel. The monitor correction apparatus also includes a flexible printed circuit board which has at least one guide hole to be inserted by the guide pins. One end of the flexible printed circuit board extends into the front bezel. An optical sensor is disposed on the flexible printed circuit board and inside the front bezel and has an optical signal receiving zone.

Abstract: A monitor correction apparatus and a monitor having the same are provided. The monitor having the monitor correction apparatus includes a display panel and a first frame. The first frame covers a perimeter of the display panel and defines a display area. The monitor correction apparatus includes a front bezel that is integrally formed with the first frame and covers a part of the display area. Moreover, the monitor correction apparatus includes guide pins that are formed inside the first frame and near the front bezel. The monitor correction apparatus also includes a flexible printed circuit board which has at least one guide hole to be inserted by the guide pins. One end of the flexible printed circuit board extends into the front bezel. An optical sensor is disposed on the flexible printed circuit board and inside the front bezel and has an optical signal receiving zone.