Abstract: An electronic circuit, comprising: an integrated substrate structure comprising one or more electrically conductive traces comprising plating on a laser-etched, non-conductive isolated portion of the integrated substrate structure defining each electrically conductive trace; one or more electrically conductive pads at one or more predetermined positions along the one or more electrically conductive traces; and an electrical component surface mounted to the at least one electrically conductive pad with interconnect and bonding material.

Abstract: System and methods to enable integration of electronic components to form LED assembly with a high accuracy (0.1 mm or better) and high process capability (Cpk of 1.67 or higher) for realizing precision electro-mechanical device. The system and methods use through holes that connect a printed circuit board to a housing as fiducial marks and LED emitter center as a reference point for alignment in order to improve the efficacy and accuracy of assembling of the LED assembly. The through holes are drilled by using laser drilling or milling machine, Use of adhesive to anchor the LED component down prior to reflow process i.e. to avoid self alignment characteristic of component on solder paste during reflow process.

Abstract: A method for forming a circuit pattern on an integrated substrate structure includes providing an insulating surface which includes a pattern forming portion. An activation ink is deposited only on the pattern forming portion to form a non-conductive isolation layer. A first metal layer is formed on the non-conductive isolation layer by electroless plating. A patterned portion of the first metal layer is isolated from a remaining portion of the first metal layer to form the circuit pattern. A non-conductive masking layer is applied on the first metal layer. A second metal layer is formed on the non-conductive masking layer. A surface mount land pattern and pad configuration is determined. A solder mask layer is applied to the patterned portion. A protective layer is applied to protect pad areas not covered by the solder mask layer. An electrical component may then be mounted to the pad(s).