Patents by Inventor Wei-Qiang Tian
Wei-Qiang Tian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7447028Abstract: A heat dissipation device includes a heat sink, a fan producing an airflow flowing towards the heat sink, an air-guiding member positioned between the fan and the heat sink and a cover enclosing the fan and the heat sink. The air-guiding member includes an air deflector dividing the airflow produced by the fan into two airstreams. The air deflector guides the airstreams of the airflow flowing towards different portions of the heat sink. By the air deflector, the portion of the heat sink, which is hotter than the other portion of the heat sink, has more air flowing therethrough.Type: GrantFiled: October 12, 2006Date of Patent: November 4, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Cheng-Tien Lai, Tao Li, Wei-Qiang Tian
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Patent number: 7414847Abstract: A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module for contacting with the heat-generating component. The base includes a plurality of first walls and a plurality of second walls. The sidewalls of the retention module enclose a periphery of the base, and the first walls and the second walls respectively abut against the sidewalls of the retention module when the base is located at a first position and a second position. A rotation of the base from the first position to the second position reduces an adhering force generated by a thermal grease located between the base and the heat-generating component.Type: GrantFiled: December 27, 2006Date of Patent: August 19, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Wan-Lin Xia, Tao Li, Wei-Qiang Tian
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Patent number: 7375965Abstract: A heat dissipation assembly comprises a mounting seat, a heat sink and a clip for fastening the heat sink in the mounting seat. The mounting seat defines an opening and is provided with a first and second protrusions. The heat sink is accommodated in the opening of the mounting seat. The clip comprises an elongated pressing member for pressing the heat sink and a clamping leg connected to one end of the pressing member and attached to the first protrusion of the mounting seat. An operating member, defining a notch, is pivotably attached to the other end of the pressing member and is rotatable relative to the pressing member and the second protrusion of the mounting seat slides in the notch of the operating member so that the clip switches between a release status and locking status.Type: GrantFiled: September 1, 2006Date of Patent: May 20, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Wan-Lin Xia, Tao Li, Wei-Qiang Tian
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Publication number: 20080062641Abstract: A heat dissipation device includes a heat sink, a fan producing an airflow flowing towards the heat sink, an air-guiding member positioned between the fan and the heat sink and a cover enclosing the fan and the heat sink. The air-guiding member includes an air deflector dividing the airflow produced by the fan into two airstreams. The air deflector guides the airstreams of the airflow flowing towards different portions of the heat sink. By the air deflector, the portion of the heat sink, which is hotter than the other portion of the heat sink, has more air flowing therethrough.Type: ApplicationFiled: October 12, 2006Publication date: March 13, 2008Applicant: Foxconn Technology Co., Ltd.Inventors: Cheng-Tien Lai, Tao Li, Wei-Qiang Tian
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Publication number: 20080043445Abstract: A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module for contacting with the heat-generating component. The base includes a plurality of first walls and a plurality of second walls. The sidewalls of the retention module enclose a periphery of the base, and the first walls and the second walls respectively abut against the sidewalls of the retention module when the base is located at a first position and a second position. A rotation of the base from the first position to the second position reduces an adhering force generated by a thermal grease located between the base and the heat-generating component.Type: ApplicationFiled: December 27, 2006Publication date: February 21, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: WAN-LIN XIA, TAO LI, WEI-QIANG TIAN
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Publication number: 20070274048Abstract: A heat dissipation assembly comprises a mounting seat, a heat sink and a clip for fastening the heat sink in the mounting seat. The mounting seat defines an opening and is provided with a first and second protrusions. The heat sink is accommodated in the opening of the mounting seat. The clip comprises an elongated pressing member for pressing the heat sink and a clamping leg connected to one end of the pressing member and attached to the first protrusion of the mounting seat. An operating member, defining a notch, is pivotably attached to the other end of the pressing member and is rotatable relative to the pressing member and the second protrusion of the mounting seat slides in the notch of the operating member so that the clip switches between a release status and locking status.Type: ApplicationFiled: September 1, 2006Publication date: November 29, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Wan-Lin Xia, Tao Li, Wei-Qiang Tian
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Publication number: 20070171615Abstract: A heat dissipation device includes a heat sink (10) and a heat capacitor (20). The heat sink includes a base (12) attachable with a heat-generating electronic component (30) and a fin assembly (14) extending from the base. The fin assembly includes two supports (140) and each support has a plurality of first fins (142) parallel to the base and a plurality of second fins (144) perpendicular to the base. The heat capacitor includes a sealed container (22) made of a material with a heat conductivity and a heat-storing material (24) made of a phase-change thermal interface material to absorb heat generated by the heat-generating electronic component. The heat-storing material changes from solid state to liquid state upon absorbing the heat from the heat-generating electronic component.Type: ApplicationFiled: January 24, 2006Publication date: July 26, 2007Inventors: Wan-Lin Xia, Tao Li, Wei-Qiang Tian
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Patent number: 7228889Abstract: A heat dissipation device includes a seat, a fin set arranged on the seat, a fan, a fan mounting device having the fan mounted thereto, and a cover covering the fin set. The fan has a portion thereof located above the fin set. An opening is defined in fan mounting device and communicates the fan with the fin set and the fan with a space above a top of the fin set. The cover has a rearwards expanding port for guiding an airflow generated by a system fan to flow through the fin set. A top wall of the cover has a void to expose a portion of the top of the fin set.Type: GrantFiled: January 9, 2006Date of Patent: June 12, 2007Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., FoxConn Technology Co., Ltd.Inventors: Wei-Qiang Tian, Wan-Lin Xia, Tao Li