Patents by Inventor Weiquan Zeng

Weiquan Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220214767
    Abstract: The present disclosure discloses a touch substrate and a method for manufacturing the same. The touch substrate includes a substrate, and a touch electrode and an electrostatic discharge structure connected to the touch electrode on the substrate. The electrostatic discharge structure is configured to discharge static electricity generated in the touch electrode.
    Type: Application
    Filed: September 3, 2018
    Publication date: July 7, 2022
    Inventors: Kai QIAO, Guoshou ZOU, Peihuan NING, Shilin ZHU, Weiquan ZENG, Bin WAN, Tingting WANG
  • Publication number: 20210365150
    Abstract: The present disclosure discloses a touch substrate and a method for manufacturing the same. The touch substrate includes a substrate, and a touch electrode and an electrostatic discharge structure connected to the touch electrode on the substrate. The electrostatic discharge structure is configured to discharge static electricity generated in the touch electrode.
    Type: Application
    Filed: September 3, 2018
    Publication date: November 25, 2021
    Inventors: Kai QIAO, Guoshou ZOU, Peihuan NING, Shilin ZHU, Weiquan ZENG, Bin WAN, Tingting WANG
  • Patent number: 10901000
    Abstract: An electrical testing jig includes: a substrate; a first bracket on the substrate, the first bracket having a first step extending in a first direction on a top of the first bracket; and a second bracket on the substrate, the second bracket being spaced apart from the first bracket in a second direction perpendicular to the first direction and having two second steps spaced apart from each other in the first direction on a top of the second bracket. Each of the second steps is angular.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: January 26, 2021
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Kai Qiao, Han Chen, Peihuan Ning, Shilin Zhu, Wei Sun, Bin Wan, Weiquan Zeng, Zhuoyan Ni
  • Publication number: 20190049487
    Abstract: An electrical testing jig includes: a substrate; a first bracket on the substrate, the first bracket having a first step extending in a first direction on a top of the first bracket; and a second bracket on the substrate, the second bracket being spaced apart from the first bracket in a second direction perpendicular to the first direction and having two second steps spaced apart from each other in the first direction on a top of the second bracket. Each of the second steps is angular.
    Type: Application
    Filed: April 27, 2018
    Publication date: February 14, 2019
    Inventors: Kai Qiao, Han Chen, Peihuan Ning, Shilin Zhu, Wei Sun, Bin Wan, Weiquan Zeng, Zhuoyan Ni