Abstract: A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The semiconductor die is disposed with the first main face on the carrier. A clip connects the second contact pad to the second external contact. A first bond wire is connected between the third contact pad and the first external contact. The first bond wire is disposed at least partially under the clip.

Abstract: A semiconductor package includes a die pad having a die attach surface, a first laterally separated and vertically offset from the die pad, a semiconductor die mounted on the die attach surface and comprising a first terminal on an upper surface of the semiconductor die, an interconnect clip that is electrically connected to the first terminal and to the first lead, and a heat spreader mounted on top of the interconnect clip. The interconnect clip includes a first planar section that interfaces with the upper surface of the semiconductor die and extends past an outer edge side of the die pad. The heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die. The heat spreader laterally extends past a first outer edge side of the die pad that faces the first lead.

Abstract: A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The semiconductor die is disposed with the first main face on the carrier. A clip connects the second contact pad to the second external contact. A first bond wire is connected between the third contact pad and the first external contact. The first bond wire is disposed at least partially under the clip.

Abstract: A semiconductor package includes a die pad having a die attach surface, a first laterally separated and vertically offset from the die pad, a semiconductor die mounted on the die attach surface and comprising a first terminal on an upper surface of the semiconductor die, an interconnect clip that is electrically connected to the first terminal and to the first lead, and a heat spreader mounted on top of the interconnect clip. The interconnect clip includes a first planar section that interfaces with the upper surface of the semiconductor die and extends past an outer edge side of the die pad. The heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die. The heat spreader laterally extends past a first outer edge side of the die pad that faces the first lead.

Abstract: The present invention provides a social network information match-up system. The system receives the request message of the collaboration information to be published from the user end (demand end), and is able to promote the collaboration information of the user end to other user ends using the system. It also help other user end (request end) to publish collaboration information on the exclusive webpage of the user end on the social network website via the system according to the assistance request of the user end (support end).

Abstract: The present invention provides a social network information match-up system. The system receives the request message of the collaboration information to be published from the user end (demand end), and is able to promote the collaboration information of the user end to other user ends using the system. It also help other user end (request end) to publish collaboration information on the exclusive webpage of the user end on the social network website via the system according to the assistance request of the user end (support end).

Abstract: A latch system used for providing a negative resistance. It includes a current source module used for providing at least one DC current. The latch system also includes a first cross-coupling module, which contains a first inverter, a second inverter, and an action module. The action module contains at least one action block, each of which contains a first device and a second device. The action module is electrically connected to the first and second inverter and is used for increasing the negative resistance of the latch system.

Abstract: A latch system used for providing a negative resistance. It includes a current source module used for providing at least one DC current. The latch system also includes a first cross-coupling module, which contains a first inverter, a second inverter, and an action module. The action module contains at least one action block, each of which contains a first device and a second device. The action module is electrically connected to the first and second inverter and is used for increasing the negative resistance of the latch system.