Abstract: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

Abstract: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

Abstract: A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

Abstract: In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.

Abstract: Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.

Abstract: Laser pulse energy adjustments are motivated by an understanding of the effect of laser pulse width variations among different lasers on satisfying a quality metric associated with a laser-processed target. In a preferred embodiment, the adjustments normalize this effect among different lasers drilling vias in a target specimen. The number of pulses delivered to the target specimen to form each via can be modified, based on the pulse energy applied to the via location, to control different via quality metrics.

Abstract: An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown.

Abstract: An improved method for laser machining features in brittle materials such as glass is presented, wherein a tool path related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses. Laser pulses applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses being applied adjacent to a previous pulse location.

Abstract: An improved method for laser machining features in brittle materials 8 such as glass is presented, wherein a tool path 10 related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses 12. Laser pulses 12 applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses 12 being applied adjacent to a previous pulse location.

Abstract: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

Abstract: A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating applied to the high quality cosmetic surface can have a thickness of between about 5 mil and about 10 mil, inclusive and have sufficient adhesion strength to adhere to the part without delaminating during processing. The protective coating applied to the machining surface of the part can be a metallic material, such as a metallic foil or tape.

Abstract: A process to laser micro-machine a metal part with a high cosmetic quality surface, including applying a protective coating layer to at least one surface of the part to physically isolate the surface from air prior to micro-machining the part with a laser, and sacrificing the protective layer to block/consume oxygen in air by carbonization and oxidation due to strong laser irradiation. The protective coating applied to at least one of a front side high quality cosmetic surface and a back side surface of the part. The coating layer being highly transparent to an applied laser beam, having a thickness of between approximately 5 mil and approximately 10 mil, inclusive, and having sufficient adhesion strength to adhere to the part without delaminating during processing. The laser can be selected from a nano-second pulse width laser and a micro-second pulse width laser to process the part.

Abstract: In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.

Abstract: In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.

Abstract: An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown.

Abstract: Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.

Abstract: A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

Abstract: In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.

Abstract: High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.

Abstract: A differential diameter hole drilling method by which through-holes having improved major surface quality are formed in a target material involves drilling a pilot hole having a diameter that is less than the desired diameter of the through-hole and then drilling a through-hole having the desired diameter. The pilot hole forms a channel from which thermal energy produced during laser drilling can diffuse into the environment, thereby reducing the amount of thermal energy diffusing into the surrounding target material matrix and the degree of thermal damage to the heat affected zone of the target material matrix. The pilot hole also forms a channel through which ablated target material may be removed, thereby increasing overall through-hole throughput. Pilot hole formation reduces the thermal energy required to form the remaining portion of the through-hole and thereby results in less thermal damage to the surrounding target material matrix.