Abstract: An apparatus for extruding a material, the apparatus comprising: a block which includes two or more extrusion containers composed of heat resisting material, the containers being arranged to receive billets of the extruding material; a die set arranged downstream of the block including the two or more extrusion containers; and one or more rams, wherein the one or more rams are aligned with the axes of the extrusion containers and are arranged to push the billets of material through the extrusion containers into the die set; wherein the die set includes an upper die including two or more extrusion channels for extruding material from each of the extrusion containers, and a lower die incorporating a welding chamber, wherein two or more extruded billets from each of the extrusion channels are welded together and passed out through the exit of the die set.

Abstract: The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface.