Patents by Inventor Weitian Liu

Weitian Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for a system-in-package using EMI shielding for capacitive touch sensing
    Patent number: 11372506
    Abstract: Systems, methods, and computer-readable media are disclosed for systems-in-packages that are encapsulated, at least partially, by a coating serving as electromagnetic interference (EMI) shielding, thereby isolating and otherwise protecting components in the systems-in-package from interference. The systems-in-packages may include one or more capacitive sensors in communication with a portion of the EMI shielding that serves as a sensing pad. In this manner, the system-in-package may benefit from EMI shielding and capacitive touch sensing capability without the complexity and increased cost of a separate capacitive touch sensor and sensing pad.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: June 28, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Fubin Song, Chaoran Yang, Kun Tang, Xiaoman Li, Weitian Liu, Zhifan Gong