Patents by Inventor Weitu LI

Weitu LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal resin composite, preparation method thereof, and electronic product housing having the same
    Patent number: 12215424
    Abstract: A metal resin composite includes a metal substrate, a metal layer formed on a surface of the metal substrate, and a resin layer formed on the metal layer. A plurality of microcracks are formed at a surface of the metal layer.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: February 4, 2025
    Assignee: BYD COMPANY LIMITED
    Inventors: Junlan Lian, Hongye Lin, Fan Chen, Weitu Li
  • METAL RESIN COMPOSITE AND PREPARATION METHOD THEREOF AND ELECTRONIC PRODUCT HOUSING
    Publication number: 20220002876
    Abstract: A metal resin composite includes a metal substrate, a metal layer formed on a surface of the metal substrate, and a resin layer formed on the metal layer. A plurality of microcracks are formed at a surface of the metal layer.
    Type: Application
    Filed: September 10, 2019
    Publication date: January 6, 2022
    Inventors: Junlan LIAN, Hongye LIN, Fan CHEN, Weitu LI