Patents by Inventor Weiwei CHU
Weiwei CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260059910Abstract: A light-emitting substrate and a backlight module are provided, the light-emitting substrate includes a base substrate; a metal wiring layer; a first planarization layer; an electrode layer; the electrode layer including a metal sub-layer and a conductive sub-layer stacked; material of the metal sub-layer include metal or metal alloy; the conductive sub-layer covers the metal sub-layer; a second planarization layer at a side of the electrode layer a functional device layer at a side of the second planarization layer and including a plurality of functional devices electrically connected to the electrode layer; the electrode layer includes a first buffer metal layer between the metal sub-layer and the conductive sub-layer; material of the first buffer metal layer is any one of or a mixture of more than one of molybdenum, molybdenum-niobium alloy, molybdenum-tungsten alloy, molybdenum-nickel-titanium alloy and molybdenum-magnesium-aluminum alloy.Type: ApplicationFiled: October 30, 2025Publication date: February 26, 2026Inventors: Ke WANG, Zhanfeng Cao, Xinhong Lu, Qi Qi, Yan Qu, Zhiwei Liang, Yingwei Liu, Dapeng Xue, Guoqiang Wang, Jianguo Wang, Song Liu, Yongfei Li, Ting Zeng, Huan Liu, Wanru Dong, Heren Gui, Jian Yang, Haifeng Hu, Yu Jiang, Peng Xu, Weiwei Chu, Qi Gao
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Patent number: 12471424Abstract: An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer. The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.Type: GrantFiled: August 31, 2021Date of Patent: November 11, 2025Assignee: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.Inventors: Ke Wang, Zhanfeng Cao, Xinhong Lu, Qi Qi, Yan Qu, Zhiwei Liang, Yingwei Liu, Dapeng Xue, Guoqiang Wang, Jianguo Wang, Song Liu, Yongfei Li, Ting Zeng, Huan Liu, Wanru Dong, Heren Gui, Jian Yang, Haifeng Hu, Yu Jiang, Peng Xu, Weiwei Chu, Qi Gao
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Publication number: 20240164097Abstract: The disclosure provides a three-dimensional (3D) memory, a method of fabricating a 3D memory and a memory system. The 3D memory can include a stack including alternately stacked first dielectric layers and conductive layers, and a channel structure extending through the stack and including a second dielectric layer and a blocking layer disposed in this order from outside to inside. The second dielectric layer can have a dielectric constant greater than or equal to 3.9.Type: ApplicationFiled: December 29, 2022Publication date: May 16, 2024Applicant: Yangtze Memory Technologies Co., Ltd.Inventors: Jianquan JIA, Weiming CHEN, Weiwei CHU, Junbao WANG, Kaiwei LI, Wenhao XIONG, Lei JIN
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Patent number: 11817463Abstract: Provided are a driving backplane and a method for manufacturing the same, a display device. The method includes: forming a first conductive pattern including signal lines; forming an insulating layer having via holes; forming a second conductive pattern including pairs of coupling electrodes; sequentially forming an inorganic material layer and an organic material layer; performing step exposure and developing on the organic material layer to form an intermediate pattern including a hollow-out portion, a completely-reserved portion and a half-reserved portion; the completely-reserved portion is thicker than the half-reserved portion, a thickness of the half-reserved portion is x times that of the inorganic material layer; etching the inorganic material layer and the intermediate pattern until a part of the inorganic material layer, corresponding to the hollow-out portion, is removed; an etching selection ratio of the inorganic material layer to the intermediate pattern is 1:y, 0<x?y.Type: GrantFiled: March 26, 2021Date of Patent: November 14, 2023Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY. GROUP CO., LTD.Inventors: Wenjie Xu, Jing Wang, Xiaodong Xie, Tsungchieh Kuo, Weiwei Chu, Yuan Li
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Publication number: 20230043951Abstract: An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer . The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.Type: ApplicationFiled: August 31, 2021Publication date: February 9, 2023Inventors: Ke WANG, Zhanfeng CAO, Xinhong LU, Qi QI, Yan QU, Zhiwei LIANG, Yingwei LIU, Dapeng XUE, Guoqiang WANG, Jianguo WANG, Song LIU, Yongfei LI, Ting ZENG, Huan LIU, Wanru DONG, Heren GUI, Jian YANG, Haifeng HU, Yu JIANG, Peng XU, Weiwei CHU, Qi GAO
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Patent number: 11562991Abstract: A backplane, a manufacturing method thereof, a backlight module and a display panel are provided. The backplane includes a base substrate; a first conductive layer located on the base substrate and including a wire; a first protection layer located at a side of the first conductive layer facing away from the base substrate; a second conductive layer located on the first protection layer and including a conductive sub-layer, the conductive sub-layer penetrating the first protection layer to be connected with the wire; a second protection layer located at a side of the second conductive layer facing away from the base substrate; a micro light-emitting diode (LED) penetrating the second protection layer to be connected with the conductive sub-layer; and a metallic reflective layer, located on the second protection layer and configured to reflect light irradiated onto the metallic reflective layer from the micro LED.Type: GrantFiled: March 26, 2020Date of Patent: January 24, 2023Assignees: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Jing Wang, Dong Li, Weiwei Chu, Wenjie Xu
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Patent number: 11296127Abstract: The present disclosure provides a display substrate, a method for manufacturing the same and a display device. The display substrate includes a base substrate, first wires on a side of the base substrate, a first barrier layer on the side of the base substrate; and a second wire on a side of the first barrier layer distal to the base substrate, where the first wires and the second wire being adjacent to and spaced apart from each other.Type: GrantFiled: November 7, 2019Date of Patent: April 5, 2022Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Jing Wang, Dong Li, Xiaodong Xie, Min He, Weiwei Chu, Wenjie Xu, Yuan Li, Yaying Li
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Publication number: 20220068980Abstract: Provided are a driving backplane and a method for manufacturing the same, a display device. The method includes: forming a first conductive pattern including signal lines; forming an insulating layer having via holes; forming a second conductive pattern including pairs of coupling electrodes; sequentially forming an inorganic material layer and an organic material layer; performing step exposure and developing on the organic material layer to form an intermediate pattern including a hollow-out portion, a completely-reserved portion and a half-reserved portion; the completely-reserved portion is thicker than the half-reserved portion, a thickness of the half-reserved portion is x times that of the inorganic material layer; etching the inorganic material layer and the intermediate pattern until a part of the inorganic material layer, corresponding to the hollow-out portion, is removed; an etching selection ratio of the inorganic material layer to the intermediate pattern is 1:y, 0<x?y.Type: ApplicationFiled: March 26, 2021Publication date: March 3, 2022Inventors: Wenjie XU, Jing WANG, Xiaodong XIE, Tsungchieh KUO, Weiwei CHU, Yuan LI
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Patent number: 11249603Abstract: A method of forming a touch control module, a touch control module, and a touch display device are provided. The method includes: providing a rigid base substrate; forming a base layer on the rigid base substrate; forming a touch functional layer at a side of the base layer away from the rigid base substrate; separating the rigid base substrate from the base layer, to form a touch functional component including the base layer and the touch functional layer; and adhering the touch functional component to a display functional component of a display device through an adhesive, to form the touch control module.Type: GrantFiled: August 20, 2020Date of Patent: February 15, 2022Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Wenjie Xu, Weiwei Chu, Jing Wang, Feifei Yu, Tsungchieh Kuo
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Publication number: 20210159219Abstract: A backplane, a manufacturing method thereof, a backlight module and a display panel are provided. The backplane includes a base substrate; a first conductive layer located on the base substrate and including a wire; a first protection layer located at a side of the first conductive layer facing away from the base substrate; a second conductive layer located on the first protection layer and including a conductive sub-layer, the conductive sub-layer penetrating the first protection layer to be connected with the wire; a second protection layer located at a side of the second conductive layer facing away from the base substrate; a micro light-emitting diode (LED) penetrating the second protection layer to be connected with the conductive sub-layer; and a metallic reflective layer, located on the second protection layer and configured to reflect light irradiated onto the metallic reflective layer from the micro LED.Type: ApplicationFiled: March 26, 2020Publication date: May 27, 2021Applicants: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Jing Wang, Dong Li, Weiwei Chu, Wenjie Xu
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Publication number: 20210055830Abstract: A method of forming a touch control module, a touch control module, and a touch display device are provided. The method includes: providing a rigid base substrate; forming a base layer on the rigid base substrate; forming a touch functional layer at a side of the base layer away from the rigid base substrate; separating the rigid base substrate from the base layer, to form a touch functional component including the base layer and the touch functional layer; and adhering the touch functional component to a display functional component of a display device through an adhesive, to form the touch control module.Type: ApplicationFiled: August 20, 2020Publication date: February 25, 2021Inventors: Wenjie XU, Weiwei CHU, Jing WANG, Feifei YU, Tsungchieh KUO
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Publication number: 20200273890Abstract: The present disclosure provides a display substrate, a method for manufacturing the same and a display device. The display substrate includes a base substrate, first wires on a side of the base substrate, a first barrier layer on the side of the base substrate; and a second wire on a side of the first barrier layer distal to the base substrate, where the first wires and the second wire being adjacent to and spaced apart from each other.Type: ApplicationFiled: November 7, 2019Publication date: August 27, 2020Inventors: Jing WANG, Dong LI, Xiaodong XIE, Min HE, Weiwei CHU, Wenjie XU, Yuan LI, Yaying LI