Patents by Inventor Weiwei CHU

Weiwei CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240164097
    Abstract: The disclosure provides a three-dimensional (3D) memory, a method of fabricating a 3D memory and a memory system. The 3D memory can include a stack including alternately stacked first dielectric layers and conductive layers, and a channel structure extending through the stack and including a second dielectric layer and a blocking layer disposed in this order from outside to inside. The second dielectric layer can have a dielectric constant greater than or equal to 3.9.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 16, 2024
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jianquan JIA, Weiming CHEN, Weiwei CHU, Junbao WANG, Kaiwei LI, Wenhao XIONG, Lei JIN
  • Patent number: 11817463
    Abstract: Provided are a driving backplane and a method for manufacturing the same, a display device. The method includes: forming a first conductive pattern including signal lines; forming an insulating layer having via holes; forming a second conductive pattern including pairs of coupling electrodes; sequentially forming an inorganic material layer and an organic material layer; performing step exposure and developing on the organic material layer to form an intermediate pattern including a hollow-out portion, a completely-reserved portion and a half-reserved portion; the completely-reserved portion is thicker than the half-reserved portion, a thickness of the half-reserved portion is x times that of the inorganic material layer; etching the inorganic material layer and the intermediate pattern until a part of the inorganic material layer, corresponding to the hollow-out portion, is removed; an etching selection ratio of the inorganic material layer to the intermediate pattern is 1:y, 0<x?y.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: November 14, 2023
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY. GROUP CO., LTD.
    Inventors: Wenjie Xu, Jing Wang, Xiaodong Xie, Tsungchieh Kuo, Weiwei Chu, Yuan Li
  • Publication number: 20230043951
    Abstract: An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer . The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.
    Type: Application
    Filed: August 31, 2021
    Publication date: February 9, 2023
    Inventors: Ke WANG, Zhanfeng CAO, Xinhong LU, Qi QI, Yan QU, Zhiwei LIANG, Yingwei LIU, Dapeng XUE, Guoqiang WANG, Jianguo WANG, Song LIU, Yongfei LI, Ting ZENG, Huan LIU, Wanru DONG, Heren GUI, Jian YANG, Haifeng HU, Yu JIANG, Peng XU, Weiwei CHU, Qi GAO
  • Patent number: 11562991
    Abstract: A backplane, a manufacturing method thereof, a backlight module and a display panel are provided. The backplane includes a base substrate; a first conductive layer located on the base substrate and including a wire; a first protection layer located at a side of the first conductive layer facing away from the base substrate; a second conductive layer located on the first protection layer and including a conductive sub-layer, the conductive sub-layer penetrating the first protection layer to be connected with the wire; a second protection layer located at a side of the second conductive layer facing away from the base substrate; a micro light-emitting diode (LED) penetrating the second protection layer to be connected with the conductive sub-layer; and a metallic reflective layer, located on the second protection layer and configured to reflect light irradiated onto the metallic reflective layer from the micro LED.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: January 24, 2023
    Assignees: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Jing Wang, Dong Li, Weiwei Chu, Wenjie Xu
  • Patent number: 11296127
    Abstract: The present disclosure provides a display substrate, a method for manufacturing the same and a display device. The display substrate includes a base substrate, first wires on a side of the base substrate, a first barrier layer on the side of the base substrate; and a second wire on a side of the first barrier layer distal to the base substrate, where the first wires and the second wire being adjacent to and spaced apart from each other.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: April 5, 2022
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jing Wang, Dong Li, Xiaodong Xie, Min He, Weiwei Chu, Wenjie Xu, Yuan Li, Yaying Li
  • Publication number: 20220068980
    Abstract: Provided are a driving backplane and a method for manufacturing the same, a display device. The method includes: forming a first conductive pattern including signal lines; forming an insulating layer having via holes; forming a second conductive pattern including pairs of coupling electrodes; sequentially forming an inorganic material layer and an organic material layer; performing step exposure and developing on the organic material layer to form an intermediate pattern including a hollow-out portion, a completely-reserved portion and a half-reserved portion; the completely-reserved portion is thicker than the half-reserved portion, a thickness of the half-reserved portion is x times that of the inorganic material layer; etching the inorganic material layer and the intermediate pattern until a part of the inorganic material layer, corresponding to the hollow-out portion, is removed; an etching selection ratio of the inorganic material layer to the intermediate pattern is 1:y, 0<x?y.
    Type: Application
    Filed: March 26, 2021
    Publication date: March 3, 2022
    Inventors: Wenjie XU, Jing WANG, Xiaodong XIE, Tsungchieh KUO, Weiwei CHU, Yuan LI
  • Patent number: 11249603
    Abstract: A method of forming a touch control module, a touch control module, and a touch display device are provided. The method includes: providing a rigid base substrate; forming a base layer on the rigid base substrate; forming a touch functional layer at a side of the base layer away from the rigid base substrate; separating the rigid base substrate from the base layer, to form a touch functional component including the base layer and the touch functional layer; and adhering the touch functional component to a display functional component of a display device through an adhesive, to form the touch control module.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: February 15, 2022
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Wenjie Xu, Weiwei Chu, Jing Wang, Feifei Yu, Tsungchieh Kuo
  • Publication number: 20210159219
    Abstract: A backplane, a manufacturing method thereof, a backlight module and a display panel are provided. The backplane includes a base substrate; a first conductive layer located on the base substrate and including a wire; a first protection layer located at a side of the first conductive layer facing away from the base substrate; a second conductive layer located on the first protection layer and including a conductive sub-layer, the conductive sub-layer penetrating the first protection layer to be connected with the wire; a second protection layer located at a side of the second conductive layer facing away from the base substrate; a micro light-emitting diode (LED) penetrating the second protection layer to be connected with the conductive sub-layer; and a metallic reflective layer, located on the second protection layer and configured to reflect light irradiated onto the metallic reflective layer from the micro LED.
    Type: Application
    Filed: March 26, 2020
    Publication date: May 27, 2021
    Applicants: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Jing Wang, Dong Li, Weiwei Chu, Wenjie Xu
  • Publication number: 20210055830
    Abstract: A method of forming a touch control module, a touch control module, and a touch display device are provided. The method includes: providing a rigid base substrate; forming a base layer on the rigid base substrate; forming a touch functional layer at a side of the base layer away from the rigid base substrate; separating the rigid base substrate from the base layer, to form a touch functional component including the base layer and the touch functional layer; and adhering the touch functional component to a display functional component of a display device through an adhesive, to form the touch control module.
    Type: Application
    Filed: August 20, 2020
    Publication date: February 25, 2021
    Inventors: Wenjie XU, Weiwei CHU, Jing WANG, Feifei YU, Tsungchieh KUO
  • Publication number: 20200273890
    Abstract: The present disclosure provides a display substrate, a method for manufacturing the same and a display device. The display substrate includes a base substrate, first wires on a side of the base substrate, a first barrier layer on the side of the base substrate; and a second wire on a side of the first barrier layer distal to the base substrate, where the first wires and the second wire being adjacent to and spaced apart from each other.
    Type: Application
    Filed: November 7, 2019
    Publication date: August 27, 2020
    Inventors: Jing WANG, Dong LI, Xiaodong XIE, Min HE, Weiwei CHU, Wenjie XU, Yuan LI, Yaying LI