Abstract: Embodiments of this application provide a composite structure including a substrate layer and a functional layer disposed on a surface of at least one side of the substrate layer. The substrate layer includes a first support member and a second support member that are disposed side by side and a bendable connecting member connected to and disposed between the first support member and the second support member. A material of the first support member and the second support member includes a hard rubber fiber composite material, and the functional layer includes one or more of an electrically conductive layer, a thermally conductive layer, or an impact-resistant layer.

Abstract: Embodiments of this application disclose a power structure, a preparation method, and a device, to provide a power structure with a high integration degree, to meet a requirement of the high-frequency and high-power field. The embodiments of this application provide a power structure, including a first substrate, a second substrate, a driver chip, a power chip, and a conductive part. A first surface of the first substrate and a second surface of the second substrate are disposed opposite to each other; a first end of the conductive part is connected to the first surface, and a second end of the conductive part is connected to the second surface; the driver chip is disposed on the first substrate; and the power chip is disposed on the second substrate.