Patents by Inventor Weiwen Pang
Weiwen Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220074986Abstract: A test system for a memory card includes a first circuit board. One side of the first circuit board is provided with a plurality of contact groups spaced apart from each other along a row direction. Another side of the first circuit board is provided with slots disposed along the row direction. The test system further includes a second circuit board. The second circuit board is provided with a test circuit, and is inserted into the slot along a direction perpendicular to the first circuit board. The second circuit board provides a test signal to the contact groups.Type: ApplicationFiled: July 17, 2019Publication date: March 10, 2022Inventors: Weiwen Pang, Xiaoqiang Li
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Publication number: 20220067475Abstract: A memory card includes a packaging board and a plurality of contacts disposed on one side surface of the packaging board, where the contacts include a power supply contact, a grounding contact, and a detection contact. The detection contact is disposed adjacent to one of the power supply contact or the grounding contact and is suspended or electrically connected to the other of the power supply contact or the grounding contact.Type: ApplicationFiled: July 17, 2019Publication date: March 3, 2022Inventors: Enhua Deng, Dan Guo, Weiwen Pang, Zhixiong Li
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Patent number: 10714148Abstract: A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.Type: GrantFiled: July 16, 2019Date of Patent: July 14, 2020Assignee: SHENZHEN LONGSYS ELECTRONICS CO., LTD.Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin
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Publication number: 20190341081Abstract: A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.Type: ApplicationFiled: July 16, 2019Publication date: November 7, 2019Applicant: SHENZHEN LONGSYS ELECTRONICS CO., LTD.Inventors: Zhixiong LI, Weiwen PANG, Xiaoqiang LI, Honghui HU, Jinmou QIN
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Patent number: 10388329Abstract: A SSD storage module comprising a printed circuit board (1), an encapsulating colloid (2), and an electronic circuit (3) welded on an inner surface of the printed circuit board (1) and having a data storage function; the encapsulating colloid (2) is formed on the inner surface of the printed circuit board (1) and is configured for seamlessly encapsulating the electronic circuit (3), an outer surface of the printed circuit board (1) is provided with a plurality of metal contact pieces (11), the plurality of metal contact pieces (11) are electrically connected with the electronic circuit (3), and the plurality of metal contact pieces (11) comprise a plurality of SATA interface contact pieces (110).Type: GrantFiled: July 18, 2016Date of Patent: August 20, 2019Assignee: SHENZHEN LONGSYS ELECTRONICS CO., LTD.Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin
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Publication number: 20170236558Abstract: A SSD storage module comprising a printed circuit board (1), an encapsulating colloid (2), and an electronic circuit (3) welded on an inner surface of the printed circuit board (1) and having a data storage function; the encapsulating colloid (2) is formed on the inner surface of the printed circuit board (1) and is configured for seamlessly encapsulating the electronic circuit (3), an outer surface of the printed circuit board (1) is provided with a plurality of metal contact pieces (11), the plurality of metal contact pieces (11) are electrically connected with the electronic circuit (3), and the plurality of metal contact pieces (11) comprise a plurality of SATA interface contact pieces (110).Type: ApplicationFiled: July 18, 2016Publication date: August 17, 2017Inventors: Zhixiong LI, Weiwen PANG, Xiaoqiang LI, Honghui HU, Jinmou QIN
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Patent number: 9213492Abstract: The present invention relates to an SD memory card, including an SD card adapter and a memory card. One end of the SD card adapter is provided with an SD interface, and the other end is provided with a receiving groove. Both ends of the memory card are respectively provided with a set of SDIO interface contacts and a USB interface. The memory card can be inserted into the receiving groove to electrically connect the set of SDIO interface contacts and the SD interface.Type: GrantFiled: August 31, 2011Date of Patent: December 15, 2015Assignee: SHENZHEN NETCOM ELECTRONICS CO., LTD.Inventors: Zhixiong Li, Weiwen Pang, Ping Wang
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Patent number: 9173317Abstract: A USB flash disk includes a metal head with a cavity, a support received in the cavity and a USB flash disk chip disposed on the support. The support includes an upper support and a lower support. One end of the upper support is connected to an end of the lower support. The upper support and the lower support form a receiving cavity therebetween to receive the USB flash disk chip. The upper support is provided with a latching structure with an opening on an outer surface thereof. The opening is defined at one end of the upper support connected to the lower support. The latching structure includes an inclined block located in a middle portion thereof and a latching groove defined on the latching structure away from the end of the upper support connecting to the lower support. An inner wall of the cavity is provided with a latching block latched in the latching groove.Type: GrantFiled: August 29, 2011Date of Patent: October 27, 2015Assignee: SHENZHEN NETCOM ELECTRONICS CO., LTD.Inventors: Zhixiong Li, Weiwen Pang, Ping Wang, Riming Zhong
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Publication number: 20130311720Abstract: The present invention relates to an SD memory card, including an SD card adapter and a memory card. One end of the SD card adapter is provided with an SD interface, and the other end is provided with a receiving groove. Both ends of the memory card are respectively provided with a set of SDIO interface contacts and a USB interface. The memory card can be inserted into the receiving groove to electrically connect the set of SDIO interface contacts and the SD interface.Type: ApplicationFiled: August 31, 2011Publication date: November 21, 2013Applicant: SHENZHEN NETCOM ELECTRONICS CO., LTD.Inventors: Zhixiong Li, Weiwen Pang, Ping Wang
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Publication number: 20130308288Abstract: A USB flash disk includes a metal head with a cavity, a support received in the cavity and a USB flash disk chip disposed on the support. The support includes an upper support and a lower support. One end of the upper support is connected to an end of the lower support. The upper support and the lower support form a receiving cavity therebetween to receive the USB flash disk chip. The upper support is provided with a latching structure with an opening on an outer surface thereof. The opening is defined at one end of the upper support connected to the lower support. The latching structure includes an inclined block located in a middle portion thereof and a latching groove defined on the latching structure away from the end of the upper support connecting to the lower support. An inner wall of the cavity is provided with a latching block latched in the latching groove.Type: ApplicationFiled: August 29, 2011Publication date: November 21, 2013Applicant: SHENZHEN NETCOM ELECTRONICS CO., LTD.Inventors: Zhixiong Li, Weiwen Pang, Ping Wang, Riming Zhong
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Patent number: D819037Type: GrantFiled: July 18, 2016Date of Patent: May 29, 2018Assignee: Shenzhen Longsys Electronics Co., Ltd.Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin